公开(公告)号：US10721826B2

公开(公告)日：2020-07-21

申请号：US15968928

申请日：2018-05-02

Applicant: Medtronic, Inc.

Inventor： Songhua Shi ,  Darrin T. Schauble ,  Rachel M. Day

IPC: H05K5/00 ,  H01R12/57 ,  H05K5/06 ,  A61B5/0492 ,  H05K5/02

Abstract: In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.

公开(公告)号：US10737099B2

公开(公告)日：2020-08-11

申请号：US15982428

申请日：2018-05-17

Applicant: Medtronic, Inc.

Inventor： James R. Wasson ,  Mark E. Henschel ,  Andrew J. Ries ,  Rachel M. Day ,  Kris A. Peterson

IPC: A61N1/372 ,  A61B5/00 ,  A61N1/375

Abstract: Systems, devices and methods are disclosed that include an antenna for an implantable medical device, the antenna including a passageway extending through the antenna windings of the antenna, the passageway providing a pathway for an electrical connector providing at least one electrical connection between a power source and electronic circuitry included within the implantable medical device.

公开(公告)号：US20190343011A1

公开(公告)日：2019-11-07

申请号：US15968928

申请日：2018-05-02

Applicant: Medtronic, Inc.

Inventor： Songhua Shi ,  Darrin T. Schauble ,  Rachel M. Day

IPC: H05K5/00 ,  H01R12/57 ,  H05K5/02 ,  H05K5/06 ,  A61B5/0492

Abstract: In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.