Silicon carbide and other films and method of deposition
    2.
    再颁专利
    Silicon carbide and other films and method of deposition 有权
    碳化硅等薄膜及沉积方法

    公开(公告)号:USRE42887E1

    公开(公告)日:2011-11-01

    申请号:US12548363

    申请日:2009-08-26

    IPC分类号: C23C16/00

    CPC分类号: C23C16/325

    摘要: A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

    摘要翻译: 公开了一种在衬底上沉积陶瓷膜,特别是碳化硅膜的方法,其中控制残余应力,残余应力梯度和电阻率。 还公开了具有具有这些受控特性的沉积膜和具有这些性质的器件的衬底,特别是MEMS和NEMS器件,具有具有这些性质的膜的衬底。