公开(公告)号：US20230273072A1

公开(公告)日：2023-08-31

申请号：US17729328

申请日：2022-04-26

Applicant: Mellanox Technologies, Ltd.

Inventor： Shai Cohen ,  Amihai Moshe Kopel ,  Beeri Halachmi ,  Alexander Kaminsky

IPC: G01K3/06 ,  G01K1/02 ,  G01K7/00 ,  G01K3/00

CPC classification number: G01K3/06 ,  G01K1/026 ,  G01K7/00 ,  G01K3/005

Abstract: A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving, from a thermal sensor group including thermal sensors, hotspot temperature measurements with respect to a hotspot. Each temperature measurement is received from a respective thermal sensor. The operations further include determining, from the temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.

公开(公告)号：US12253423B2

公开(公告)日：2025-03-18

申请号：US17729328

申请日：2022-04-26

Applicant: Mellanox Technologies, Ltd.

Inventor： Shai Cohen ,  Amihai Moshe Kopel ,  Beeri Halachmi ,  Alexander Kaminsky

IPC: G01K3/06 ,  G01K1/02 ,  G01K3/00 ,  G01K7/00

Abstract: A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving, from a thermal sensor group including thermal sensors, hotspot temperature measurements with respect to a hotspot. Each temperature measurement is received from a respective thermal sensor. The operations further include determining, from the temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.