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公开(公告)号：US11701883B2
公开(公告)日：2023-07-18
申请号：US17399818
申请日：2021-08-11
发明人： Elmer Dimaculangan Perez , See-Huat Tan , Glenn Horrocks , Mohammad Hossain , Michael John Webb , Pascal Blanquer , Erik Coolen
IPC分类号： B41J2/14
CPC分类号： B41J2/14016 , B41J2002/14362 , B41J2002/14491 , B41J2202/19 , B41J2202/22
摘要： An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.
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公开(公告)号：US20190337291A1
公开(公告)日：2019-11-07
申请号：US16400949
申请日：2019-05-01
摘要： A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.
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公开(公告)号：US20210061467A1
公开(公告)日：2021-03-04
申请号：US17096892
申请日：2020-11-12
摘要： A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.
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公开(公告)号：US10850517B2
公开(公告)日：2020-12-01
申请号：US16400958
申请日：2019-05-01
摘要： An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.
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公开(公告)号：US20190322103A1
公开(公告)日：2019-10-24
申请号：US16460904
申请日：2019-07-02
发明人： Elmer Dimaculangan Perez , Nicholas Chin , Miao Wang , See-Huat Tan , Jason Thelander , David Burke , Andrew Thomas , Mahes Rajaratnam
摘要： An inkjet printhead includes: a support structure having a plurality of printhead chips mounted thereto; and a shield plate bonded to the support structure, the shield plate having a slot aligned with the printhead chips, the slot having a perimeter edge. A sealant is disposed on all exposed portions of the support structure adjacent the perimeter edge of each slot.
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公开(公告)号：US12059898B2
公开(公告)日：2024-08-13
申请号：US17096892
申请日：2020-11-12
CPC分类号： B41J2/145 , B41J2/04541 , B41J2/14024 , B41J2/14072 , B41J2/1601 , B81B7/0032 , B41J2202/15 , B81B2201/052
摘要： A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.
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公开(公告)号：US20190337292A1
公开(公告)日：2019-11-07
申请号：US16400958
申请日：2019-05-01
IPC分类号： B41J2/145
摘要： An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.
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