Coating installation
    1.
    发明申请
    Coating installation 审中-公开
    涂装安装

    公开(公告)号:US20050145487A1

    公开(公告)日:2005-07-07

    申请号:US10511389

    申请日:2003-04-11

    IPC分类号: C25B9/00 H01J37/34

    CPC分类号: H01J37/34 H01J37/3447

    摘要: The invention relates to a coating installation comprising a recipient (1) which is divided into a cathode side (3) and a substrate side (4) by means of a screen (2). The cathode side (3) and the substrate side (4) respectively have a direct extraction outlet (10, 16) and a gas admission (8, 14). The gas admission (8) on the cathode side (3) is connected to a process gas source (9) and the gas admission (14) for the substrate side (4) is connected to a reactive gas source (15).

    摘要翻译: 本发明涉及一种涂层装置,其包括借助于屏幕(2)被分为阴极侧(3)和基板侧(4)的接收器(1)。 阴极侧(3)和基板侧(4)分别具有直接提取出口(10,16)和气体入口(8,14)。 阴极侧(3)上的气体进入(8)连接到处理气体源(9),并且用于基板侧(4)的气体进入(14)连接到反应气体源(15)。

    Method for regulating sputtering processes
    2.
    发明授权
    Method for regulating sputtering processes 失效
    溅射工艺调节方法

    公开(公告)号:US06797128B1

    公开(公告)日:2004-09-28

    申请号:US10148099

    申请日:2002-07-29

    IPC分类号: C23C1434

    CPC分类号: H01J37/32935 C23C14/0042

    摘要: The invention relates to a method for regulating MF or HF sputtering processes, a harmonic analysis of the electrical discharge parameters being implemented and the MF or HF output and/or the reactive gas flow being regulated on the basis of the analysis results.

    摘要翻译: 本发明涉及一种用于调节MF或HF溅射工艺的方法,正在实施的放电参数的谐波分析和MF或HF输出和/或基于分析结果调节的反应气流。