Coating installation
    1.
    发明申请
    Coating installation 审中-公开
    涂装安装

    公开(公告)号:US20050145487A1

    公开(公告)日:2005-07-07

    申请号:US10511389

    申请日:2003-04-11

    IPC分类号: C25B9/00 H01J37/34

    CPC分类号: H01J37/34 H01J37/3447

    摘要: The invention relates to a coating installation comprising a recipient (1) which is divided into a cathode side (3) and a substrate side (4) by means of a screen (2). The cathode side (3) and the substrate side (4) respectively have a direct extraction outlet (10, 16) and a gas admission (8, 14). The gas admission (8) on the cathode side (3) is connected to a process gas source (9) and the gas admission (14) for the substrate side (4) is connected to a reactive gas source (15).

    摘要翻译: 本发明涉及一种涂层装置,其包括借助于屏幕(2)被分为阴极侧(3)和基板侧(4)的接收器(1)。 阴极侧(3)和基板侧(4)分别具有直接提取出口(10,16)和气体入口(8,14)。 阴极侧(3)上的气体进入(8)连接到处理气体源(9),并且用于基板侧(4)的气体进入(14)连接到反应气体源(15)。

    SPUTTER CHAMBER FOR COATING A SUBSTRATE
    3.
    发明申请
    SPUTTER CHAMBER FOR COATING A SUBSTRATE 审中-公开
    用于涂覆基材的喷射室

    公开(公告)号:US20070227882A1

    公开(公告)日:2007-10-04

    申请号:US11692868

    申请日:2007-03-28

    IPC分类号: C23C14/00

    摘要: The invention relates to a sputter chamber for coating substrates, in which the so-called “picture frame effect” is eliminated or at least largely reduced. The thickness of the coating at the margin of a substrate hereby no longer deviates significantly from the thickness of the coating in the center of the substrate. This is attained thereby that the negative effect of the process gas—or of several process gases—which is introduced into the sputter chamber is equalized by an additional inert or reactive gas. At the margins of the substrates to be coated and on the substrate side facing away from the cathode thus an additional gas stream is generated, which is directed counter to the process gas stream.

    摘要翻译: 本发明涉及一种用于涂覆基板的溅射室,其中所谓的“图像帧效应”被消除或至少大大降低。 衬底边缘处的涂层厚度不再显着偏离衬底中心涂层的厚度。 由此可以实现由引入到溅射室中的工艺气体或几种工艺气体的负面影响,由额外的惰性气体或反应性气体均衡。 在待涂覆的基底的边缘和背离阴极的基底侧上,产生另外的气流,其与工艺气体流相反。