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    Polishing article for electro-chemical mechanical polishing
    2.
    发明授权
    Polishing article for electro-chemical mechanical polishing 有权
    电化学机械抛光抛光制品

    公开(公告)号：US07141155B2

    公开(公告)日：2006-11-28

    申请号：US10761941

    申请日：2004-01-21

    申请人： Michael H. Bunyan ,  Thomas A. Clement ,  John J. Hannafin ,  Marc E. LaRosee ,  Kent M. Young

    发明人： Michael H. Bunyan ,  Thomas A. Clement ,  John J. Hannafin ,  Marc E. LaRosee ,  Kent M. Young

    IPC分类号： C25F3/16 ,  H05K3/07

    CPC分类号： B24B37/24 ,  B23H5/08 ,  B24B37/046 ,  B24B37/26 ,  C25F7/00

    摘要： A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.

    摘要翻译： 用于工件的电化学机械抛光（ECMP）的抛光垫或其它成型制品。 该制品包括形成一层的导电化合物。 将该化合物配制成包含在该层中形成连续相的聚合物组分和在连续相内形成离散相的导电填料组分的混合物。 随着工件和层电连接并且在工件和层之间施加电偏压，偏压能够激活电化学反应，该化合物表现出超过偏压激活反应的超电势。

    Thermal management materials having a phase change dispersion
    3.
    发明授权
    Thermal management materials having a phase change dispersion 有权
    具有相变色散的热管理材料

    公开(公告)号：US07682690B2

    公开(公告)日：2010-03-23

    申请号：US10277970

    申请日：2002-10-21

    申请人： Michael H. Bunyan ,  Kent M. Young

    发明人： Michael H. Bunyan ,  Kent M. Young

    IPC分类号： B32B5/16 ,  B32B17/10 ,  B32B27/00

    CPC分类号： H01L23/4275 ,  C09K5/063 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10S428/923 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/27 ,  Y10T428/31801 ,  H01L2924/00

    摘要： A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a polymeric constituent forming a continuous matrix in the layer; and (b) a dispersed constituent forming discrete domains within the matrix, the domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and the domains having a domain transition temperature above normal room temperature from the first domain phase to the second domain phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.

    摘要翻译： 在第一传热表面和相对的第二传热表面之间插入的导热接口，以在它们之间提供热路径。 该界面包括形成为在第一和第二传热表面之间保持一致的层的导热化合物。 化合物是以下物质的混合物：（a）在该层中形成连续基质的聚合物成分; 和（b）在基质内形成离散的结构域的分散组分，所述结构域在正常室温下在第一结构域相中是形式稳定的，并且在第二结构域相中在第一和第二传热表面之间保持一致，并且所述结构域具有 结构域转变温度高于正常室温从第一畴相到第二畴相。 分散的组分可以是可熔的，即低温熔融的金属或金属合金。

    Low force deflection and corrosion resistant EMI gasket
    4.
    发明授权
    Low force deflection and corrosion resistant EMI gasket 有权
    低力偏转和耐腐蚀EMI垫片

    公开(公告)号：US08633402B2

    公开(公告)日：2014-01-21

    申请号：US13643331

    申请日：2011-05-10

    申请人： Michael H. Bunyan ,  George R. Watchko ,  William G. Lionetta

    发明人： Michael H. Bunyan ,  George R. Watchko ,  William G. Lionetta

    IPC分类号： H05K9/00

    CPC分类号： H05K9/0015

    摘要： An EMI shielding gasket having enhanced corrosion protection and force deflection is provided. The gasket has a body formed from an electrically conductive material with outwardly extending projections from one or both surface portions thereof. A non-conductive polymer gel is applied to the spaces between the projections for protection against corrosion. The gasket is particularly adapted for use in external aluminum aircraft surfaces which are exposed to harsh environmental conditions.

    摘要翻译： 提供了具有增强的腐蚀保护和力偏转的EMI屏蔽垫片。 垫圈具有由导电材料形成的本体，其具有从其一个表面部分或两个表面部分向外延伸的突起。 将非导电聚合物凝胶施加到突起之间的空间以防止腐蚀。 垫圈特别适用于暴露于恶劣环境条件的外部铝飞机表面。

    Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications
    6.
    发明授权
    Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications 有权
    封装膨胀卷曲金属网用于密封，EMI屏蔽和雷击应用

    公开(公告)号：US08759692B2

    公开(公告)日：2014-06-24

    申请号：US13707757

    申请日：2012-12-07

    申请人： Michael H. Bunyan ,  George R. Watchko ,  William G. Lionetta

    发明人： Michael H. Bunyan ,  George R. Watchko ,  William G. Lionetta

    IPC分类号： H05K9/00 ,  H02G13/00 ,  H01R43/00

    CPC分类号： H02G13/00 ,  H05K9/0016 ,  H05K9/0081 ,  H05K9/0086 ,  H05K9/009 ,  Y10T29/49117

    摘要： A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, protection against lightning strikes and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.

    摘要翻译： 提供用于密封，雷击保护和EMI屏蔽的复合垫片。 垫圈具有嵌入弹性体凝胶层的弹性导电网片。 导电网是波纹状的，以提供一系列重复波形，为垫片提供较低的偏转力，更好的耐腐蚀性，防雷击和更高的EMI屏蔽能力。 可以在垫圈的边缘部分周围使用第二弹性体，以改善耐磨性和增加拉伸强度。 可以将玻璃纤维片合并在网中以增加加固和支撑。 本发明的垫圈可用于外部飞机部件，例如外部飞机天线安装座。

    FULLY-CURED THERMALLY OR ELECTRICALLY CONDUCTIVE FORM-IN-PLACE GAP FILLER
    7.
    发明申请
    FULLY-CURED THERMALLY OR ELECTRICALLY CONDUCTIVE FORM-IN-PLACE GAP FILLER 审中-公开
    完全固化的电气或电导式形式的间隙填料

    公开(公告)号：US20120133072A1

    公开(公告)日：2012-05-31

    申请号：US13384284

    申请日：2010-08-10

    申请人： Michael H. Bunyan ,  Victoria Santa Fe ,  Jonathan Bergin

    发明人： Michael H. Bunyan ,  Victoria Santa Fe ,  Jonathan Bergin

    IPC分类号： B29C45/16 ,  C09D183/04

    CPC分类号： C09D5/34 ,  C08L83/04 ,  C09K5/14 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K9/0081 ,  H01L2924/00

    摘要： Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An amount of the compound is dispensed from a nozzle, screen, stencil, or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.

    摘要翻译： 施加热和/或导电化合物以填充第一和第二表面之间的热和/或EMI屏蔽间隙。 作为固化的聚合物凝胶组分和颗粒状填充剂组分的混合物，提供流动的形式稳定化合物的供给。 在施加的压力下，将一定量的化合物从喷嘴，筛网，模板或其它孔口分配到其中一个表面上，当相反时，形成间隙，或形成在表面之间的间隙中。 间隙至少部分地被分配化合物的至少一部分填充。

    ELECTRICALLY-CONDUCTIVE FOAM EMI SHIELD
    8.
    发明申请
    ELECTRICALLY-CONDUCTIVE FOAM EMI SHIELD 审中-公开
    电导体泡沫EMI屏蔽

    公开(公告)号：US20110162879A1

    公开(公告)日：2011-07-07

    申请号：US13059110

    申请日：2009-09-18

    申请人： Michael H. Bunyan ,  George R. Watchko ,  William G. Lionetta

    发明人： Michael H. Bunyan ,  George R. Watchko ,  William G. Lionetta

    IPC分类号： H05K9/00 ,  H05K13/00

    CPC分类号： H05K9/003 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  Y10T29/49002 ,  H01L2224/0401

    摘要： An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a resilient layer of a thermoformable, electrically-conductive foam, the layer having first surface and a second surface defining a thickness dimension therebetween, and the layer having an interior portion surrounded by a perimeter portion. The interior portion of the layer is compressed through the thickness dimension thereof to form a top wall portion of the shield, with the thickness dimension of the perimeter portion extending downwardly from the top wall portion to form a side wall portion of the shield which together with the top wall portion defines at least a portion of the compartment.

    摘要翻译： 一种具有至少一个用于封闭电子设备的电路的隔间的EMI屏蔽。 屏蔽包括可热成形的导电泡沫的弹性层，该层具有第一表面和限定其之间的厚度尺寸的第二表面，该层具有由周边部分包围的内部部分。 层的内部部分通过其厚度尺寸被压缩以形成屏蔽件的顶壁部分，周边部分的厚度尺寸从顶壁部分向下延伸以形成屏蔽件的侧壁部分，其与 顶壁部分限定隔室的至少一部分。

    Dispensable cured resin
    9.
    发明申请
    Dispensable cured resin 有权
    可分散固化树脂

    公开(公告)号：US20070230131A1

    公开(公告)日：2007-10-04

    申请号：US11729500

    申请日：2007-03-28

    申请人： Michael H. Bunyan ,  Phillip Blazdell

    发明人： Michael H. Bunyan ,  Phillip Blazdell

    IPC分类号： C08J3/00 ,  G12B15/06

    CPC分类号： H05K7/20481 ,  C08K7/16 ,  H05K9/0083 ,  Y10T428/31663

    摘要： The present invention discloses methods, materials and devices for facilitating electromagnetic/radiofrequency interference (EMI/RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and/or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and/or electrically conductive (or thermally conductive and/or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or/and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component. The process includes applying a shearing force on the compound, thereby rendering the compound dispensable.

    摘要翻译： 本发明公开了用于在包装电路中促进电磁/射频干扰（EMI / RFI）屏蔽和热管理的方法，材料和装置。 更具体地，涉及具有改进的热和EMI管理的集成电路的封装方法，将化合物用作热接口和/或EMI屏蔽的方法以及EMI屏蔽和热管理装置。 更具体地，本发明泄漏了用于调节导热（或导热和/或电绝缘）现场形成的完全固化的化合物的粘度的方法和装置，从而使得该化合物可分配。 此外，公开了处理用作热界面的化合物或/和EMI屏蔽物的方法。 该化合物是颗粒状填料组分和预固化凝胶组分的混合物。 该方法包括对化合物施加剪切力，从而使复合物不必要。