公开(公告)号：US09912313B2

公开(公告)日：2018-03-06

申请号：US14360403

申请日：2012-10-23

申请人： Micro Crystal AG

发明人： Léa Deillon ,  Silvio Dalla Piazza ,  Thierry Hessler

IPC分类号： H03H3/007 ,  H03H3/02 ,  B81C1/00 ,  H03H9/02 ,  H03H3/04

CPC分类号： H03H3/0072 ,  B81C1/00269 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02244 ,  H03H2003/022 ,  H03H2003/026 ,  H03H2003/0478 ,  H03H2003/0485 ,  H03H2003/0492 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49574

摘要： An element is arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. The metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C. A method of fabricating the encapsulation device is also disclosed.

公开(公告)号：US20140312735A1

公开(公告)日：2014-10-23

申请号：US14360403

申请日：2012-10-23

申请人： Micro Crystal AG

发明人： Léa Deillon ,  Silvio Dalla Piazza ,  Thierry Hessler

IPC分类号： H03H3/007 ,  H03H9/02 ,  H03H3/02

CPC分类号： H03H3/0072 ,  B81C1/00269 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02244 ,  H03H2003/022 ,  H03H2003/026 ,  H03H2003/0478 ,  H03H2003/0485 ,  H03H2003/0492 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49574

摘要： The invention relates to an element arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. According to the invention, the metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C.

摘要翻译： 本发明涉及一种布置成与另一部分配合的元件，以便形成用于包括至少部分地涂覆有金属化的元件的部件的封装装置。 根据本发明，金属化包括由金属间化合物保护的至少一个金属层，其被熔点低于250℃的材料的非扩散部分涂覆。