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公开(公告)号：US20130214645A1
公开(公告)日：2013-08-22
申请号：US13771095
申请日：2013-02-20
发明人： SHUICHI MIZUSAWA
IPC分类号： H01L41/053 , H01L41/29
CPC分类号： H01L41/053 , H01L41/29 , H03H9/0595 , H03H9/1021 , H03H9/1035 , H03H9/17 , H03H9/19 , H03H2003/022 , H03H2003/0485 , Y10T29/42
摘要： A surface mount type piezoelectric device includes a piezoelectric vibrating piece, a base plate in a rectangular shape, and a lid plate. The piezoelectric vibrating piece includes a vibrator vibrating at a predetermined vibration frequency. The base plate has one principal surface where the piezoelectric vibrating piece being to be placed. The lid plate seals the vibrator. The other principal surface of the base plate includes a pair of mounting terminals to mount the piezoelectric device. The pair of mounting terminals includes a metal film and an electroless plating film. The electroless plating film is formed on a surface of the metal film. The mounting terminal includes a trace from which a part of the electroless plating film is removed by laser or dicing.
摘要翻译： 表面安装型压电装置包括压电振动片，矩形的底板和盖板。 压电振动片包括以预定振动频率振动的振动器。 基板具有一个主表面，其中压电振动片将被放置。 盖板密封振动器。 基板的另一个主表面包括一对安装端子以安装压电装置。 该一对安装端子包括金属膜和无电镀膜。 化学镀膜形成在金属膜的表面上。 安装端子包括通过激光或切割除去一部分化学镀膜的迹线。
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2.发明申请公开(公告)号：US20110241491A1
公开(公告)日：2011-10-06
申请号：US13075121
申请日：2011-03-29
申请人： Takehiro Takahashi
发明人： Takehiro Takahashi
IPC分类号： H01L41/053 , H01L41/04 , H01L41/22
CPC分类号： H03H9/0595 , H03H3/04 , H03H9/1035 , H03H2003/0428 , H03H2003/0478 , H03H2003/0485 , Y10T29/42
摘要： In an exemplary method for making crystal vibrating devices, four wafers are provided: a crystal wafer, a base wafer, a first-lid wafer, and a second-lid wafer. The crystal wafer defines multiple crystal vibrating pieces including respective frames and respective electrodes formed on both main surfaces thereof. The base wafer defines multiple base plates bondable to one main surface of respective frames. The first-lid wafer defines multiple first lids bondable to the other main surface of the respective frames. Each first lid defines a void registrable with respective electrodes. The second-lid wafer is sized similarly to and bondable to the first-lid wafer so as to sealably close the voids. In a first bonding step the crystal wafer is bonded to the base wafer and first-lid wafer. In a subsequent adjustment step the thickness of at least one electrode per each crystal vibrating piece is adjusted to adjust the vibrational frequency of the respective vibrating portion. Thickness adjustment occurs through the respective voids. In a second bonding step, the second-lid wafer is bonded to the first-lid wafer. The resulting wafer sandwich is cut up into individual quartz crystal devices.
摘要翻译： 在制造水晶振动装置的示例性方法中，提供了四个晶片：晶体晶片，基底晶片，第一盖晶片和第二盖晶片。 晶体晶片限定了多个晶体振动片，其包括形成在其两个主表面上的相应的框架和相应的电极。 基底晶片限定可粘合到相应框架的一个主表面的多个基板。 第一盖晶片限定可粘合到相应框架的另一个主表面的多个第一盖。 每个第一盖限定可注册的各个电极的空隙。 第二盖晶片的尺寸与第一盖晶片的尺寸相似并可结合，以密封地封闭空隙。 在第一接合步骤中，晶体晶片结合到基底晶片和第一盖晶片。 在随后的调整步骤中，调整每个晶体振动片的至少一个电极的厚度，以调节相应的振动部分的振动频率。 通过相应的空隙进行厚度调整。 在第二接合步骤中，第二盖晶片被接合到第一盖晶片。 将得到的晶片夹层切割成单独的石英晶体器件。
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公开(公告)号：US09912313B2
公开(公告)日：2018-03-06
申请号：US14360403
申请日：2012-10-23
申请人： Micro Crystal AG
CPC分类号： H03H3/0072 , B81C1/00269 , H03H3/02 , H03H3/04 , H03H9/02244 , H03H2003/022 , H03H2003/026 , H03H2003/0478 , H03H2003/0485 , H03H2003/0492 , Y10T29/42 , Y10T29/49005 , Y10T29/49574
摘要： An element is arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. The metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C. A method of fabricating the encapsulation device is also disclosed.
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公开(公告)号：US07098574B2
公开(公告)日：2006-08-29
申请号：US10691238
申请日：2003-10-22
申请人： Hirokazu Iwata
发明人： Hirokazu Iwata
CPC分类号： H03H9/0547 , H03H3/04 , H03H9/1021 , H03H9/17 , H03H2003/022 , H03H2003/0485
摘要： In the case where an ultraminiature piezoelectric substrate, which has a resonating portion formed by making a concavity by etching in the surface of the piezoelectric substrate made of an anisotropic crystal material, is mass-produced by batch operation using a large-area piezoelectric substrate wafer, an annular portion surrounding each concavity is formed sufficiently thick to prevent cracking from occurring when the wafer is severed. A piezoelectric substrate 2 of an anisotropic piezoelectric crystal material has a thin resonating portion 4 and a thick annular portion 5 integrally surrounding the outer marginal edge of the resonating portion to form a concavity 3 in at least one of major surfaces of the substrate; the inner wall 5a of the annular portion in the one crystal orientation slopes gently more than the inner wall in the other crystal orientation perpendicular to said one crystal orientation, and the piezoelectric substrate is longer in said one crystal orientation than in the other crystal orientation.
摘要翻译： 在通过使用大面积压电基板晶片的批量操作来批量生产具有通过在由各向异性晶体材料制成的压电基板的表面中通过蚀刻形成凹陷而形成的谐振部分的超微压电基板的情况下 围绕每个凹部的环形部分形成得足够厚以防止当晶片断开时发生裂纹。 各向异性压电晶体材料的压电基片2具有薄的谐振部分4和一个围绕谐振部分的外边缘的厚的环形部分5，以在基片的至少一个主表面中形成凹陷3; 在一个晶体取向中的环形部分的内壁5a在垂直于所述一个晶体取向的另一个晶体取向中比内壁平缓地倾斜，并且压电基片在所述一个晶体取向上比在另一个晶体取向上更长 。
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5.发明授权公开(公告)号：US08981623B2
公开(公告)日：2015-03-17
申请号：US13552652
申请日：2012-07-19
CPC分类号： H03H9/132 , H03H3/04 , H03H9/02157 , H03H9/1035 , H03H9/177 , H03H2003/0428 , H03H2003/0478 , H03H2003/0485
摘要： A piezoelectric vibrating piece is to be bonded to and sandwiched between a lid plate and a base plate with an external electrode. The piezoelectric vibrating piece has a first main surface at the lid plate side and a second main surface at the base plate side. The piezoelectric vibrating piece includes an excitation unit, a first excitation electrode, a second excitation electrode, a framing portion, one connecting portion, a first extraction electrode, and a second extraction electrode. The connecting portion includes a planar surface parallel to both the main surfaces and a side face intersecting with the planar surface. The first extraction electrode is extracted via the connecting portion. The second extraction electrode is extracted via the connecting portion. The first extraction electrode is disposed on at least a part of the side face of the connecting portion to be extracted to the framing portion.
摘要翻译： 将压电振动片与外部电极接合并夹在盖板和基板之间。 压电振动片具有在盖板侧的第一主表面和在底板侧的第二主表面。 压电振动片包括激励单元，第一激励电极，第二激励电极，框架部分，一个连接部分，第一引出电极和第二引出电极。 连接部分包括平行于两个主表面的平面和与平面相交的侧面。 经由连接部分提取第一提取电极。 经由连接部分提取第二提取电极。 第一引出电极设置在连接部分的侧面的至少一部分上以被提取到框架部分。
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公开(公告)号：US20140312735A1
公开(公告)日：2014-10-23
申请号：US14360403
申请日：2012-10-23
申请人： Micro Crystal AG
CPC分类号： H03H3/0072 , B81C1/00269 , H03H3/02 , H03H3/04 , H03H9/02244 , H03H2003/022 , H03H2003/026 , H03H2003/0478 , H03H2003/0485 , H03H2003/0492 , Y10T29/42 , Y10T29/49005 , Y10T29/49574
摘要： The invention relates to an element arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. According to the invention, the metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C.
摘要翻译： 本发明涉及一种布置成与另一部分配合的元件，以便形成用于包括至少部分地涂覆有金属化的元件的部件的封装装置。 根据本发明，金属化包括由金属间化合物保护的至少一个金属层，其被熔点低于250℃的材料的非扩散部分涂覆。
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公开(公告)号：US08278798B2
公开(公告)日：2012-10-02
申请号：US12928293
申请日：2010-12-08
申请人： Ryoichi Ichikawa
发明人： Ryoichi Ichikawa
IPC分类号： H01L41/08
CPC分类号： H03H9/1021 , H03H3/04 , H03H9/19 , H03H2003/0442 , H03H2003/0485
摘要： An object is to provide a crystal device that uses a mesa-structure crystal piece in which frequency adjustment is possible. A configuration is such that in a crystal device having: a crystal piece having a thick portion and a thin portion, with an excitation electrode formed on both main faces of the thick portion, and a lead out electrode electrically connected to the excitation electrode, formed on an end portion; a container main body having a concavity for accommodating the crystal piece; and a cover that is connected to an open end face of the container main body and hermetically seals the crystal piece, a frequency adjustment metal film which is electrically isolated from the excitation electrode and made independent, is formed on the thin portion of the crystal piece.
摘要翻译： 本发明的目的是提供一种使用可能进行频率调节的台面结构晶体的晶体装置。 一种结构是这样一种结构，即在具有：具有厚壁部分和薄壁部分的晶片的同时，形成有在厚壁部的两个主面上形成的激励电极和与激励电极电连接的引出电极， 在一端; 容器主体，具有容纳所述水晶片的凹部; 以及与容器主体的开口端面连接并对该结晶体进行气密密封的盖，在该结晶片的薄部上形成有与激励电极电绝缘且独立的调频金属膜 。
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公开(公告)号：US20120139391A1
公开(公告)日：2012-06-07
申请号：US13272890
申请日：2011-10-13
IPC分类号： H01L41/047 , H01L41/22 , H01L41/053
CPC分类号： H03H3/04 , H03H9/0509 , H03H9/1021 , H03H9/1035 , H03H9/215 , H03H2003/022 , H03H2003/0428 , H03H2003/0478 , H03H2003/0485 , H03H2003/0492
摘要： Piezoelectric vibrating devices have piezoelectric vibrating pieces of which the vibration frequency is measurable individually on a wafer scale, without being affected by adjacent piezoelectric devices on the wafer. An exemplary piezoelectric device includes a piezoelectric vibrating piece having excitation electrodes and respective extraction electrodes. The device includes a package base with two connecting electrodes facing the vibrating piece and connected to respective extraction electrodes. Two pairs of mounting terminals are situated on the outer surface of the package base. Also on the outer surface of the package base are two pairs of opposing castellations that are recessed toward the center of the package base. Edge-surface electrodes connect the first and second main surfaces of the base; one pair is connected to the connecting electrodes and the other pair is connected to respective mounting terminals.
摘要翻译： 压电振动装置具有压电振动片，其振动频率可以单独地在晶片上测量，而不受晶片上的相邻压电器件的影响。 示例性压电装置包括具有激励电极和各自的提取电极的压电振动片。 该装置包括具有面向振动片的两个连接电极并连接到相应的引出电极的封装基座。 两对安装端子位于封装基座的外表面上。 在封装基座的外表面上也是朝向封装基座的中心凹陷的两对相对的榫眼。 边缘表面电极连接基座的第一和第二主表面; 一对连接到连接电极，另一对连接到相应的安装端子。
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公开(公告)号：US09479135B2
公开(公告)日：2016-10-25
申请号：US13418669
申请日：2012-03-13
申请人： Takeo Sato , Yuichiro Nagamine
发明人： Takeo Sato , Yuichiro Nagamine
IPC分类号： H03H3/04 , H03H9/10 , C04B35/46 , C04B35/48 , H01L41/22 , H01L41/25 , H03H3/02 , G01N29/02 , G01N29/036 , G01H3/00
CPC分类号： H03H3/04 , C04B35/46 , C04B35/48 , G01H3/00 , G01N29/022 , G01N29/036 , G01N2291/0256 , G01N2291/0426 , H01L41/22 , H01L41/25 , H03H3/02 , H03H9/10 , H03H9/1021 , H03H9/105 , H03H9/1092 , H03H2003/022 , H03H2003/0485 , Y10T29/42 , Y10T29/49005
摘要： A method for manufacturing a piezoelectric vibration device wherein a substrate is prepared, and a piezoelectric resonator element is mounted on the substrate. Before or after a packaging member is joined to the substrate, the piezoelectric resonator element is exposed to an environment at a higher temperature than ambient temperature and a higher humidity than ambient humidity, and then an electrical property is measured to detect attachment of dust and/or foreign matter according to a variation of the electrical property.
摘要翻译： 一种制造压电振动装置的方法，其中制备了基底，并且压电谐振元件安装在基底上。 在将包装部件接合到基板之前或之后，将压电谐振元件暴露在比环境温度高的环境温度和比环境湿度更高的湿度的环境中，然后测量电性能以检测灰尘和/ 或异物根据电性能的变化而变化。
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10.发明申请公开(公告)号：US20130214649A1
公开(公告)日：2013-08-22
申请号：US13769831
申请日：2013-02-19
IPC分类号： H01L41/047
CPC分类号： H01L41/047 , H03H9/0595 , H03H9/1035 , H03H2003/022 , H03H2003/0485 , Y10T29/42
摘要： A method for fabricating a piezoelectric device includes preparing a piezoelectric wafer, preparing a first wafer, bonding the piezoelectric wafer and the first wafer, preparing a first terminal mask for forming a pair of hot terminals on the bottom surface and a second terminal mask for forming the pair of hot terminals and a grounding terminal as a ground point, selecting an arrangement of the first terminal mask and an arrangement of the second terminal mask on a bottom surface of the first wafer after the wafer bonding, and forming a bottom surface with the power supply terminal and the output terminal through the first terminal mask, or a bottom surface with the power supply terminal, the output terminal, and the grounding terminal through the second terminal mask, after selecting the arrangement.
摘要翻译： 一种制造压电元件的方法包括制备压电晶片，制备第一晶片，接合压电晶片和第一晶片，制备用于在底表面上形成一对热端子的第一端子掩模和用于形成的第二端子掩模 一对热端子和接地端子作为接地点，在晶片接合之后，在第一晶片的底表面上选择第一端子掩模的布置和第二端子掩模的布置，并且形成底表面 电源端子和输出端子通过第一端子掩模，或底面与电源端子，输出端子和接地端子通过第二端子掩模，在选择布置之后。
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