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Patent Agency Ranking
公开(公告)号：US09533376B2
公开(公告)日：2017-01-03
申请号：US14156437
申请日：2014-01-15
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
CPC classification number: B23K26/38 , B23K26/0624 , B23K26/18 , B23K26/40 , B23K2101/40 , B23K2103/50 , G01R1/06738 , G01R1/06744 , G01R3/00
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。
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公开(公告)号：US20230201968A1
公开(公告)日：2023-06-29
申请号：US17723348
申请日：2022-04-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/38 , C25D5/02 , B23K26/382
CPC classification number: B23K26/38 , C25D5/028 , B23K26/382
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
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公开(公告)号：US09878401B1
公开(公告)日：2018-01-30
申请号：US14720719
申请日：2015-05-22
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/362 , B23K26/364 , B23K26/38 , C25D5/02 , B23K26/382
CPC classification number: B23K26/38 , B23K26/382 , C25D5/48 , C25D7/00 , G01R1/00
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
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公开(公告)号：US11999016B2
公开(公告)日：2024-06-04
申请号：US17723348
申请日：2022-04-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/38 , B23K26/382 , C25D5/02 , C25D5/48 , C25D7/00 , G01R1/067 , G01R3/00 , B23K103/00
CPC classification number: B23K26/38 , B23K26/382 , C25D5/028 , C25D5/48 , C25D7/00 , G01R1/06744 , G01R3/00 , B23K2103/56
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
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公开(公告)号：US20140197145A1
公开(公告)日：2014-07-17
申请号：US14156437
申请日：2014-01-15
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/38
CPC classification number: B23K26/38 , B23K26/0624 , B23K26/18 , B23K26/40 , B23K2101/40 , B23K2103/50 , G01R1/06738 , G01R1/06744 , G01R3/00
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。
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