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    Compliant pin probes with extension springs, methods for making, and methods for using
    1.
    发明授权
    Compliant pin probes with extension springs, methods for making, and methods for using 有权

    公开(公告)号：US12078657B2

    公开(公告)日：2024-09-03

    申请号：US17854756

    申请日：2022-06-30

    Applicant: Microfabrica Inc.

    Inventor： Ming Ting Wu ,  Arun S. Veeramani

    IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

    CPC classification number: G01R1/06722 ,  G01R1/06738 ,  G01R1/0735 ,  G01R3/00

    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat extension spring segment and wherein in some embodiments the probes also provide: (1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements, and/or (2) ratcheting elements on probe arms and/or frame elements to allow permanent or semi-permanent transition from a build state or initial state to a working state or pre-biased state.

    Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
    2.
    发明公开
    Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes 审中-公开

    公开(公告)号：US20230314482A1

    公开(公告)日：2023-10-05

    申请号：US18295738

    申请日：2023-04-04

    Applicant: Microfabrica Inc.

    Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

    IPC: G01R1/073 ,  G01R31/28

    CPC classification number: G01R1/07371 ,  G01R31/2831

    Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise one or more mounting features that extend laterally from a body portion of the probe and the lower and upper array plates, in combination, capture: (1) at least one of the mounting features to inhibit excessive downward vertical movement of the probe body relative to the array plates, (2) at least one of the mounting features to inhibit excessive upward vertical movement of the probe body relative to the array plates, and (3) at least one of the mounting features to inhibit excessive lateral movement of the probe relative to the array plates, and wherein the at least one lower and upper plates longitudinally contact each other in a stacked assembly.

    Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
    5.
    发明授权
    Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes 有权

    公开(公告)号：US12196781B2

    公开(公告)日：2025-01-14

    申请号：US17968552

    申请日：2022-10-18

    Applicant: Microfabrica Inc.

    Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

    IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

    Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.

    Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
    8.
    发明公开
    Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes 审中-公开

    公开(公告)号：US20240094256A1

    公开(公告)日：2024-03-21

    申请号：US17968552

    申请日：2022-10-18

    Applicant: Microfabrica Inc.

    Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

    IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

    CPC classification number: G01R1/07314 ,  G01R1/06722 ,  G01R1/06738 ,  G01R3/00

    Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.

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