中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.012 seconds)

    Methods of Forming Parts Using Laser Machining
    2.
    发明申请
    Methods of Forming Parts Using Laser Machining 有权
    使用激光加工形成零件的方法

    公开(公告)号：US20140197145A1

    公开(公告)日：2014-07-17

    申请号：US14156437

    申请日：2014-01-15

    Applicant: Microfabrica Inc.

    Inventor： Arun S. Veeramani ,  Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard ,  Irina Boguslavsky ,  Pavel Lembrikov ,  Dennis R. Smalley ,  Richard T. Chen

    IPC: B23K26/38

    CPC classification number: B23K26/38 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00

    Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

    Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。

    Batch Methods of Forming Microscale or Millimeter Scale Structures Using Electro Discharge Machining Alone or In Combination with Other Fabrication Methods
    7.
    发明申请
    Batch Methods of Forming Microscale or Millimeter Scale Structures Using Electro Discharge Machining Alone or In Combination with Other Fabrication Methods 审中-公开
    使用单独或与其他制作方法组合的电子放电加工形成微尺度或毫米级结构的批量方法

    公开(公告)号：US20150021299A1

    公开(公告)日：2015-01-22

    申请号：US14333476

    申请日：2014-07-16

    Applicant: Microfabrica Inc.

    Inventor： Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard

    IPC: B23H1/04

    CPC classification number: B23H1/04

    Abstract: Embodiments are directed to forming three-dimensional millimeter scale or micro-scale structures from single or multiple sheets or layers of material via electro discharge machining (EDM). In some embodiments, the electrodes are formed by single layer or multi-layer, single material or multi-material deposition processes. In some embodiments single electrodes form a plurality of parts or structures simultaneously. In some embodiments a sacrificial bridging material is used to hold parts together during and after EDM processing.

    Abstract translation: 实施例涉及通过放电加工（EDM）从单个或多个片材或材料层形成三维毫米级或微尺度结构。 在一些实施例中，电极通过单层或多层单材料或多材料沉积工艺形成。 在一些实施例中，单个电极同时形成多个部件或结构。 在一些实施例中，牺牲桥接材料用于在EDM处理期间和之后将部件保持在一起。

Patent Agency Ranking