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公开(公告)号：US20240019463A1
公开(公告)日：2024-01-18
申请号：US18469046
申请日：2023-09-18
申请人： MICROFABRICA INC.
CPC分类号： G01R1/06744 , G01R1/06761 , G01R1/07357
摘要： Forming buckling beam probe arrays having MEMS probes engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed is disclosed. Probes can be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement can occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Arrays can include probes and a substrate to which the probes are bonded with one or more guide plates. Final arrays can include probes held by guide plates with aligned or laterally shifted hole patterns.
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公开(公告)号：US20230314482A1
公开(公告)日：2023-10-05
申请号：US18295738
申请日：2023-04-04
申请人： Microfabrica Inc.
CPC分类号： G01R1/07371 , G01R31/2831
摘要： Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise one or more mounting features that extend laterally from a body portion of the probe and the lower and upper array plates, in combination, capture: (1) at least one of the mounting features to inhibit excessive downward vertical movement of the probe body relative to the array plates, (2) at least one of the mounting features to inhibit excessive upward vertical movement of the probe body relative to the array plates, and (3) at least one of the mounting features to inhibit excessive lateral movement of the probe relative to the array plates, and wherein the at least one lower and upper plates longitudinally contact each other in a stacked assembly.
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公开(公告)号：US20230243872A1
公开(公告)日：2023-08-03
申请号：US18295748
申请日：2023-04-04
申请人： Microfabrica Inc.
CPC分类号： G01R1/06733 , G01R1/06722 , G01R1/07314
摘要： Probe for making contact between two electronic circuit elements comprises a feature selected from the group consisting of: (A) at least one first tip and second tip arm supporting a shunting element that makes an electrical connection to at least one standoff while shunting current flow away from a spring element of the probe that joins a respective standoff and supports the respective tip arm, and (B) both of the first tip arm and the second tip arm support a respective shunting element that makes an electrical connection to the at least one respective standoff while shunting current flow away from a respective spring element that joins the respective standoff and supports the respective tip arm.
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公开(公告)号：US20230201968A1
公开(公告)日：2023-06-29
申请号：US17723348
申请日：2022-04-18
申请人： Microfabrica Inc.
发明人： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC分类号： B23K26/38 , C25D5/02 , B23K26/382
CPC分类号： B23K26/38 , C25D5/028 , B23K26/382
摘要： Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
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5.发明申请公开(公告)号：US20170247807A1
公开(公告)日：2017-08-31
申请号：US15358027
申请日：2016-11-21
申请人： Microfabrica Inc.
发明人： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
CPC分类号： C25D5/022 , B81C1/00126 , B81C2201/0109 , B81C2201/019 , C23C18/1605 , C23C18/1651 , C25D1/003 , Y10T156/11 , Y10T156/19
摘要： Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.
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6.发明授权Methods of forming three-dimensional structures having reduced stress and/or curvature 有权形成具有减小的应力和/或曲率的三维结构的方法公开(公告)号：US09540233B2
公开(公告)日：2017-01-10
申请号：US14194564
申请日：2014-02-28
申请人： Microfabrica Inc.
发明人： Ananda H. Kumar , Jorge S. Albarran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
CPC分类号： B81C1/00666 , C25D5/022
摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
摘要翻译： 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。
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公开(公告)号：US20150307997A1
公开(公告)日：2015-10-29
申请号：US14675431
申请日：2015-03-31
申请人： Microfabrica Inc.
CPC分类号： C25D5/022 , B81C1/00373 , C23C18/1605 , C23C18/1608 , C23C18/165 , C23C18/1657 , C23C18/1689 , C23C18/22 , C25D1/003 , C25D5/10 , C25D5/48
摘要： Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate dielectric material and/or wherein seed layer material used to allow deposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.
摘要翻译： 本发明的实施例提供中尺度或微尺寸的三维结构（例如部件，装置等）。 实施例涉及以下一个或多个（1）形成这种结合电介质材料的结构和/或其中用于允许在电介质材料上沉积的种子层材料通过平面化操作去除; （2）形成这样的结构，其中用于至少一些选择性图案化操作的掩模通过将掩模材料转移到衬底或先前形成的层的表面获得，和/或（3）形成这样的结构，其中掩模 用于形成至少部分一些层的图案直接来自表示掩模配置的数据在构建表面上图案化，例如 在一些实施例中，通过经由计算机控制的喷墨喷嘴或阵列或经由计算机控制的挤出装置选择性地分配材料来实现掩模图案化。
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8.发明申请公开(公告)号：US20140239541A1
公开(公告)日：2014-08-28
申请号：US14194214
申请日：2014-02-28
申请人： Microfabrica Inc.
IPC分类号： B29C65/56
CPC分类号： B29C65/56 , B33Y10/00 , C25D5/02 , Y10T29/49885
摘要： Forming multi-layer 3D structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer 3D structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second element is not accessible to the retention region of the first element.
摘要翻译： 形成多层3D结构，其涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层3D结构，其中通过以下之一进行接合：（1）弹性变形和弹性恢复，（2 ）至少一个元件的初始部分相对于所述至少一个元件的另一部分的相对变形，直到所述至少两个元件处于期望的保持位置，之后所述变形被减少或消除，或者（3）移动保持 一个元件的区域进入到另一个元件的保持区域中，没有任何一个元件的变形，沿着包括另一个元件的加载区域的路径，并且其中在正常使用期间，第一和第二元件相对于彼此配置，使得负载 第二元件的区域不能被第一元件的保持区域访问。
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公开(公告)号：US12066462B2
公开(公告)日：2024-08-20
申请号：US17507598
申请日：2021-10-21
申请人： Microfabrica Inc.
CPC分类号： G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
摘要： Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.
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公开(公告)号：US20240103042A1
公开(公告)日：2024-03-28
申请号：US17967548
申请日：2022-10-17
申请人： Microfabrica Inc.
CPC分类号： G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
摘要： Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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