公开(公告)号：US09767864B1

公开(公告)日：2017-09-19

申请号：US15216256

申请日：2016-07-21

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Harish N. Venkata ,  Guy S. Perry

IPC: G11C7/06 ,  G11C7/10 ,  G11C7/12 ,  G11C8/10 ,  G11C7/22

CPC classification number: G11C7/065 ,  G11C7/10 ,  G11C7/1006 ,  G11C7/12 ,  G11C7/222 ,  G11C8/10 ,  G11C11/403 ,  G11C11/4087 ,  G11C11/4091 ,  G11C11/4094 ,  G11C11/4096

Abstract: The present disclosure includes apparatuses and methods related to storing a data value in a sensing circuitry element. An example method comprises sensing a first data value with a sense amplifier of a sensing circuitry element, moving a second data value from a first storage location of a compute component to a second storage location of the compute component, and storing, in the first storage location, a third data value resulting from a logical operation performed on the first data value and the second data value. The logical operation can be performed by logic circuitry of the sensing circuitry element.

公开(公告)号：US10418123B2

公开(公告)日：2019-09-17

申请号：US16119856

申请日：2018-08-31

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Guy S. Perry ,  Harish N. Venkata ,  Glen E. Hush

IPC: G11C29/00

Abstract: Apparatuses and methods related to column repair in memory are described. The sensing circuitry of an apparatus can include a first sensing component, a second sensing component, and a third sensing component. The second sensing component can include a defective sense amplifier that is column repaired. The apparatus can include a controller configured to use the sensing circuitry to shift data from the first sensing component to the third sensing component by transferring the data through the second sensing component. The second sensing component can be physically located between the first sensing component and the third sensing component.

公开(公告)号：US20180374559A1

公开(公告)日：2018-12-27

申请号：US16119856

申请日：2018-08-31

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Guy S. Perry ,  Harish N. Venkata ,  Glen E. Hush

IPC: G11C29/00

CPC classification number: G11C29/702 ,  G11C29/785 ,  G11C29/81 ,  G11C29/848

Abstract: The present disclosure includes apparatuses and methods related to column repair in memory. An example apparatus can include sensing circuitry. The sensing circuitry can include a first sensing component, a second sensing component, and a third sensing component. The second sensing component can include a defective sense amplifier that is column repaired. The apparatus can include a controller configured to use the sensing circuitry to shift data from the first sensing component to the third sensing component by transferring the data through the second sensing component. The second sensing component can be physically located between the first sensing component and the third sensing component.

公开(公告)号：US10789996B2

公开(公告)日：2020-09-29

申请号：US16360685

申请日：2019-03-21

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Harish N. Venkata ,  Guy S. Perry

IPC: G11C7/10 ,  G11C11/4096 ,  G11C11/4091

Abstract: The present disclosure includes apparatuses and methods related to shifting data. An example apparatus comprises sensing circuitry including a sense amplifier and a compute component having a first storage location and a second storage location associated therewith. A controller is coupled to the sensing circuitry. The controller is configured to control an amount of power associated with shifting a data value stored in the first storage location to the second storage location by applying a charge sharing operation.

公开(公告)号：US20190341084A1

公开(公告)日：2019-11-07

申请号：US16514371

申请日：2019-07-17

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Harish N. Venkata ,  Guy S. Perry

IPC: G11C7/06 ,  G11C11/4096 ,  G11C11/4094 ,  G11C11/4091 ,  G11C11/403 ,  G11C7/12 ,  G11C7/10 ,  G11C8/10 ,  G11C7/22

Abstract: The present disclosure includes apparatuses and methods related to storing a data value in a sensing circuitry element. An example method comprises sensing a first data value with a sense amplifier of a sensing circuitry element, moving a second data value from a first storage location of a compute component to a second storage location of the compute component, and storing, in the first storage location, a third data value resulting from a logical operation performed on the first data value and the second data value. The logical operation can be performed by logic circuitry of the sensing circuitry element.

公开(公告)号：US20180025759A1

公开(公告)日：2018-01-25

申请号：US15216440

申请日：2016-07-21

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Harish N. Venkata ,  Guy S. Perry

IPC: G11C7/08

CPC classification number: G11C7/1006 ,  G11C7/1036 ,  G11C11/4091 ,  G11C11/4096 ,  G11C2211/4013

Abstract: The present disclosure includes apparatuses and methods related to shifting data. An example apparatus comprises sensing circuitry including a sense amplifier and a compute component having a first storage location and a second storage location associated therewith. A controller is coupled to the sensing circuitry. The controller is configured to control an amount of power associated with shifting a data value stored in the first storage location to the second storage location by applying a charge sharing operation.

公开(公告)号：US10360949B2

公开(公告)日：2019-07-23

申请号：US15972783

申请日：2018-05-07

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Harish N. Venkata ,  Guy S. Perry

IPC: G11C7/06 ,  G11C7/12 ,  G11C7/10 ,  G11C7/22 ,  G11C8/10 ,  G11C11/403 ,  G11C11/4091 ,  G11C11/4094 ,  G11C11/4096 ,  G11C11/408

Abstract: The present disclosure includes apparatuses and methods related to storing a data value in a sensing circuitry element. An example method comprises sensing a first data value with a sense amplifier of a sensing circuitry element, moving a second data value from a first storage location of a compute component to a second storage location of the compute component, and storing, in the first storage location, a third data value resulting from a logical operation performed on the first data value and the second data value. The logical operation can be performed by logic circuitry of the sensing circuitry element.

公开(公告)号：US10242722B2

公开(公告)日：2019-03-26

申请号：US15978578

申请日：2018-05-14

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Harish N. Venkata ,  Guy S. Perry

IPC: G11C7/10 ,  G11C11/4091 ,  G11C11/4096

Abstract: The present disclosure includes apparatuses and methods related to shifting data. An example apparatus comprises sensing circuitry including a sense amplifier and a compute component having a first storage location and a second storage location associated therewith. A controller is coupled to the sensing circuitry. The controller is configured to control an amount of power associated with shifting a data value stored in the first storage location to the second storage location by applying a charge sharing operation.

公开(公告)号：US10068664B1

公开(公告)日：2018-09-04

申请号：US15600409

申请日：2017-05-19

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Guy S. Perry ,  Harish N. Venkata ,  Glen E. Hush

IPC: G11C29/00

CPC classification number: G11C29/702 ,  G11C29/785 ,  G11C29/81 ,  G11C29/848

Abstract: Apparatuses and methods related to column repair in memory are described. An apparatus can include sensing circuitry. The sensing circuitry can include a first sensing component, a second sensing component, and a third sensing component. The second sensing component can include a defective sense amplifier that is column repaired. The apparatus can include a controller configured to use the sensing circuitry to shift data from the first sensing component to the third sensing component by transferring the data through the second sensing component. The second sensing component can be physically located between the first sensing component and the third sensing component.

公开(公告)号：US09966116B2

公开(公告)日：2018-05-08

申请号：US15693064

申请日：2017-08-31

Applicant: Micron Technology, Inc.

Inventor： Daniel B. Penney ,  Harish N. Venkata ,  Guy S. Perry

IPC: G11C7/06 ,  G11C7/10 ,  G11C7/12 ,  G11C8/10 ,  G11C7/22

CPC classification number: G11C7/065 ,  G11C7/10 ,  G11C7/1006 ,  G11C7/12 ,  G11C7/222 ,  G11C8/10 ,  G11C11/403 ,  G11C11/4087 ,  G11C11/4091 ,  G11C11/4094 ,  G11C11/4096

Abstract: The present disclosure includes apparatuses and methods related to storing a data value in a sensing circuitry element. An example method comprises sensing a first data value with a sense amplifier of a sensing circuitry element, moving a second data value from a first storage location of a compute component to a second storage location of the compute component, and storing, in the first storage location, a third data value resulting from a logical operation performed on the first data value and the second data value. The logical operation can be performed by logic circuitry of the sensing circuitry element.