公开(公告)号：US20240064906A1

公开(公告)日：2024-02-22

申请号：US17820315

申请日：2022-08-17

Applicant: Micron Technology, Inc.

Inventor： Kristopher D. Hamrick ,  Bradley R. Bitz ,  James J. Oleary ,  Mark A. Tverdy

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/183 ,  H05K1/111 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2201/10159 ,  H05K2201/09472

Abstract: A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.

公开(公告)号：US12207411B2

公开(公告)日：2025-01-21

申请号：US17820315

申请日：2022-08-17

Applicant: Micron Technology, Inc.

Inventor： Kristopher D. Hamrick ,  Bradley R. Bitz ,  James J. Oleary ,  Mark A Tverdy

IPC: H05K1/18 ,  H05K1/11

Abstract: A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.

公开(公告)号：US20250159813A1

公开(公告)日：2025-05-15

申请号：US19020037

申请日：2025-01-14

Applicant: Micron Technology, Inc.

Inventor： Kristopher D. Hamrick ,  Bradley R. Bitz ,  James J. Oleary ,  Mark A. Tverdy

IPC: H05K1/18 ,  H05K1/11

Abstract: A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.