公开(公告)号：US20240305026A1

公开(公告)日：2024-09-12

申请号：US18596264

申请日：2024-03-05

Applicant: Micron Technology, Inc.

Inventor： Mark A. Tverdy ,  Kaleb A. Wilson

IPC: H01R12/73 ,  H01R12/70 ,  H01R25/00 ,  H05K7/02 ,  H05K7/10

CPC classification number: H01R12/73 ,  H01R12/7088 ,  H01R25/006 ,  H05K7/023 ,  H05K7/1076

Abstract: Various embodiments described herein provide a connector assembly with integrated data and backup energy connections, which can be used to electrically couple together two or more printed circuit boards and electrically couple at least one of those printed circuit boards to a backup energy source. For example, a connector assembly of an embodiment can be used to implement a memory sub-system by coupling together two or more printed circuit boards of the memory sub-system and coupling the memory sub-system to a backup energy source, such as a set of capacitors or a set of batteries, which can be used to power the memory sub-system in the event of a main power loss.

公开(公告)号：US20250159813A1

公开(公告)日：2025-05-15

申请号：US19020037

申请日：2025-01-14

Applicant: Micron Technology, Inc.

Inventor： Kristopher D. Hamrick ,  Bradley R. Bitz ,  James J. Oleary ,  Mark A. Tverdy

IPC: H05K1/18 ,  H05K1/11

Abstract: A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.

公开(公告)号：US20240064906A1

公开(公告)日：2024-02-22

申请号：US17820315

申请日：2022-08-17

Applicant: Micron Technology, Inc.

Inventor： Kristopher D. Hamrick ,  Bradley R. Bitz ,  James J. Oleary ,  Mark A. Tverdy

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/183 ,  H05K1/111 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2201/10159 ,  H05K2201/09472

Abstract: A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.

公开(公告)号：US11997782B2

公开(公告)日：2024-05-28

申请号：US17459102

申请日：2021-08-27

Applicant: Micron Technology, Inc.

Inventor： Kaleb A. Wilson ,  Shams U Arifeen ,  Bradley Russell Bitz ,  João Elmiro Da Rocha Chaves ,  Mark A. Tverdy

IPC: H05K1/02

CPC classification number: H05K1/0207 ,  H05K2201/10159 ,  H05K2201/10545

Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).

公开(公告)号：US20240117855A1

公开(公告)日：2024-04-11

申请号：US17962927

申请日：2022-10-10

Applicant: Micron Technology, Inc.

Inventor： Kaleb A. Wilson ,  Bradley R. Bitz ,  Mark A. Tverdy ,  Quang Nguyen ,  Christopher Glancey ,  Jagadeesh B. Ginjupalli ,  Pridhvi Dandu

IPC: F16F15/04 ,  H05K5/02

CPC classification number: F16F15/04 ,  H05K5/0217 ,  F16F2226/04 ,  F16F2226/042

Abstract: Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.

公开(公告)号：US20230065633A1

公开(公告)日：2023-03-02

申请号：US17459102

申请日：2021-08-27

Applicant: Micron Technology, Inc.

Inventor： Kaleb A. Wilson ,  Shams U. Arifeen ,  Bradley Russell Bitz ,  João Elmiro da Rocha Chaves ,  Mark A. Tverdy

IPC: H05K1/02

Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).