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    Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the same
    2.
    发明授权
    Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the same 有权

    公开(公告)号：US12191284B2

    公开(公告)日：2025-01-07

    申请号：US18231192

    申请日：2023-08-07

    Applicant: Micron Technology, Inc.

    Inventor： Pezhman Monadgemi

    IPC: H01L25/065 ,  H01L25/00 ,  H01L25/10 ,  H01L25/18

    Abstract: A semiconductor device assembly comprises a substrate including internal contacts on a first side and first external contacts on a second side. The assembly further comprises one or more first dies disposed over the first side and electrically coupled to the internal contacts, and a interposer having a length and a width less than a length and a width of the substrate, having inner contacts on a first side, and having second external contacts on a second side. The interposer is coupled to the second side of the substrate by one or more of the inner contacts. The assembly further comprises a second die disposed between the substrate and the interposer. The assembly further comprises first solder balls on the first external contacts, and second solder balls on the second external contacts. The first and second solder balls are configured to bond with co-planar package contacts.

    THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTERPOSERS CARRYING A SUBSET OF THE EXTERNAL CONTACTS OF THE ASSEMBLY, AND METHODS OF MAKING THE SAME
    4.
    发明申请
    THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTERPOSERS CARRYING A SUBSET OF THE EXTERNAL CONTACTS OF THE ASSEMBLY, AND METHODS OF MAKING THE SAME 有权

    公开(公告)号：US20220208728A1

    公开(公告)日：2022-06-30

    申请号：US17384729

    申请日：2021-07-24

    Applicant: Micron Technology, Inc.

    Inventor： Pezhman Monadgemi

    IPC: H01L25/065 ,  H01L25/10 ,  H01L25/18 ,  H01L25/00

    Abstract: A semiconductor device assembly comprises a substrate including internal contacts on a first side and first external contacts on a second side. The assembly further comprises one or more first dies disposed over the first side and electrically coupled to the internal contacts, and a interposer having a length and a width less than a length and a width of the substrate, having inner contacts on a first side, and having second external contacts on a second side. The interposer is coupled to the second side of the substrate by one or more of the inner contacts. The assembly further comprises a second die disposed between the substrate and the interposer. The assembly further comprises first solder balls on the first external contacts, and second solder balls on the second external contacts. The first and second solder balls are configured to bond with co-planar package contacts.

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