公开(公告)号：US11372043B2

公开(公告)日：2022-06-28

申请号：US16546648

申请日：2019-08-21

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US20210055342A1

公开(公告)日：2021-02-25

申请号：US16546648

申请日：2019-08-21

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US12078672B2

公开(公告)日：2024-09-03

申请号：US17829224

申请日：2022-05-31

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

CPC classification number: G01R31/2863 ,  G01R31/2875 ,  G01R31/2879

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US20220291280A1

公开(公告)日：2022-09-15

申请号：US17829224

申请日：2022-05-31

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.