公开(公告)号：US11372043B2

公开(公告)日：2022-06-28

申请号：US16546648

申请日：2019-08-21

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US11011452B2

公开(公告)日：2021-05-18

申请号：US16205151

申请日：2018-11-29

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Hyunsuk Chun

IPC: H01L23/433 ,  H01L23/367 ,  H01L23/31

Abstract: A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached to the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.

公开(公告)号：US20230343673A1

公开(公告)日：2023-10-26

申请号：US17728625

申请日：2022-04-25

Applicant: Micron Technology, Inc.

Inventor： Wei Zhou ,  Bret K. Street ,  Amy R. Griffin

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/3737 ,  H01L23/3735 ,  H01L23/3675 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0657 ,  H01L24/96 ,  H01L24/97 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2924/1436 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2224/08221 ,  H01L2224/80896

Abstract: A semiconductor device assembly that includes carbon nanofibers (CNFs) for heat dissipation has a CNF layer. Molding compound encapsulates the CNF layer to form an encapsulated CNF layer. The molding compound extends between individual adjacent CNFs within the encapsulated CNF layer, and upper edges of at least a portion of individual CNFs within the encapsulated CNF layer are exposed along an upper surface of the encapsulated CNF layer. The upper surface of the CNF layer is removably attached to a bottom surface of a carrier wafer.

公开(公告)号：US20230343672A1

公开(公告)日：2023-10-26

申请号：US17728586

申请日：2022-04-25

Applicant: Micron Technology, Inc.

Inventor： Wei Zhou ,  Bret K. Street ,  Amy R. Griffin

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3737 ,  H01L23/3675 ,  H01L23/3735 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0657 ,  H01L24/32 ,  H01L2224/08221 ,  H01L2224/32145 ,  H01L2224/80896 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/1436

Abstract: A semiconductor device assembly that includes carbon nanofibers (CNFs) for heat dissipation has a CNF layer. Molding compound encapsulates the CNF layer to form an encapsulated CNF layer. The molding compound extends between individual adjacent CNFs within the encapsulated CNF layer, and upper edges of at least a portion of individual CNFs within the encapsulated CNF layer are exposed along an upper surface of the encapsulated CNF layer. The upper surface of the CNF layer is removably attached to a bottom surface of a carrier wafer.

公开(公告)号：US20210272872A1

公开(公告)日：2021-09-02

申请号：US16807075

申请日：2020-03-02

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Hyunsuk Chun ,  Eiichi Nakano ,  Amy R. Griffin

IPC: H01L23/373 ,  H01L23/433

Abstract: Semiconductor devices including materials for thermal management, and associated systems and methods, are described herein. In some embodiments, a semiconductor package includes a first semiconductor die coupled to a second semiconductor die by a plurality of interconnect structures. A thermal material can be positioned between the first and second semiconductor dies. The thermal material can include an array of heat transfer elements embedded in a supporting matrix material. The array of heat transfer elements can include at least one vacant region aligned with at least one of the interconnect structures.

公开(公告)号：US20210225733A1

公开(公告)日：2021-07-22

申请号：US17224358

申请日：2021-04-07

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Hyunsuk Chun

IPC: H01L23/433 ,  H01L23/367 ,  H01L23/31

Abstract: A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.

公开(公告)号：US12078672B2

公开(公告)日：2024-09-03

申请号：US17829224

申请日：2022-05-31

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

CPC classification number: G01R31/2863 ,  G01R31/2875 ,  G01R31/2879

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US20220291280A1

公开(公告)日：2022-09-15

申请号：US17829224

申请日：2022-05-31

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US11385281B2

公开(公告)日：2022-07-12

申请号：US16546674

申请日：2019-08-21

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Hyunsuk Chun

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes a base portion and a plurality of protrusions extending from the base portion. When the heat spreader is coupled to the burn-in testing board, the protrusions are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US20200176353A1

公开(公告)日：2020-06-04

申请号：US16205151

申请日：2018-11-29

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Hyunsuk Chun

IPC: H01L23/433 ,  H01L23/31 ,  H01L23/367

Abstract: A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.