Memory Circuitry And Method Used In Forming Memory Circuitry

    公开(公告)号:US20240047346A1

    公开(公告)日:2024-02-08

    申请号:US17880444

    申请日:2022-08-03

    CPC classification number: H01L23/5228 H01L23/535 H01L27/11556 H01L27/11582

    Abstract: Memory circuitry comprising strings of memory cells comprises a stack comprising vertically-alternating insulative tiers and conductive tiers. Channel-material strings of memory cells extend through the insulative tiers and the conductive tiers in a memory-array region. The insulative tiers and the conductive tiers extend from the memory-array region into a stair-step region. The stair-step region comprises a cavity comprising a flight of stairs. A lining has a specific resistance of at least 1×104 ohm·m at 20° C. atop treads of the stairs of the flight of stairs. Individual of the treads comprise conducting material of one of the conductive tiers. The lining comprises at least one of (a), (b), (c), and (d), where: (a): M1xM2yOz having a specific resistance of at least 1×104 ohm·m at 20° C. and where M1 and M2 are each a different one of Hf, Zr, Al, Ta, Sc, and Y; “z” is greater than zero; and at least one of “x” and “y” is greater than zero; (b) BtCwOv having a specific resistance of at least 1×104 ohm·m at 20° C. and where each of “t” and “v” is greater than zero (c): BrCs having a specific resistance of at least 1×104 ohm·m at 20° C. and where each of “r” and “s” is greater than zero; and (d): BkChNp having a specific resistance of at least 1×104 ohm·m at 20° C. and where each of “k” and “p” is greater than zero. Insulative material in the cavity is directly above the lining that comprises the at least one of the (a), the (b), the (c), and the (d). Conductive vias extend through the insulative material and the lining that comprises the at least one of the (a), the (b), the (c), and the (d). Individual of the conductive vias are directly above and directly against the conducting material of one of the individual treads. Methods are disclosed.

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