公开(公告)号：US20200053291A1

公开(公告)日：2020-02-13

申请号：US16660269

申请日：2019-10-22

Applicant: Microsoft Technology Licensing, LLC

Inventor： Raymond Kirk PRICE ,  Michael BLEYER ,  Jian ZHAO ,  Ravi Kiran NALLA ,  Denis DEMANDOLX ,  Zhiqiang LIU

IPC: H04N5/232 ,  H04N13/254 ,  H04N13/207 ,  G02B5/20 ,  H04N5/225 ,  H04N13/271 ,  H04N13/239 ,  H04N5/235 ,  H04N5/222

Abstract: A method for three-dimensional imaging includes emitting an output light with a structured light illuminator in a structured light pattern, receiving a trigger command, changing a field of illumination of the illuminator, and changing a field of view of an imaging sensor. The field of view and the field of illumination are linked, such that the field of view of the imaging sensor is the same as the field of illumination of the illuminator at a short throw field of view and a long throw field of view. The method further includes detecting a reflected light with the imaging sensor and measuring a depth value by calculating a distortion of the structured light pattern.

公开(公告)号：US20190208630A1

公开(公告)日：2019-07-04

申请号：US16294910

申请日：2019-03-06

Applicant: Microsoft Technology Licensing, LLC

Inventor： David MANDELBOUM ,  Shlomo FELZENSHTEIN ,  Boaz SHEM-TOV ,  Raymond Kirk PRICE ,  Ravi Kiran NALLA

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/18 ,  G03B15/03 ,  H05K3/32 ,  F21V19/00

CPC classification number: H05K1/115 ,  F21V19/0015 ,  F21Y2115/30 ,  G03B15/03 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4617 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/10121 ,  H05K2203/049 ,  Y02P70/611

Abstract: A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane.