Semiconductor apparatus transmitting fuse information and repair method thereof
    1.
    发明授权
    Semiconductor apparatus transmitting fuse information and repair method thereof 有权
    发送熔丝信息的半导体装置及其修理方法

    公开(公告)号:US08917569B2

    公开(公告)日:2014-12-23

    申请号:US13168241

    申请日:2011-06-24

    IPC分类号: G11C7/00 G11C17/18

    摘要: A semiconductor apparatus includes a signal transmission block and signal reception blocks. The signal transmission block is disposed in a first chip and configured to transmit fuse information in synchronization with transmission control signals. The signal reception blocks are respectively disposed in the first chip and a second chip and configured to receive the fuse information in synchronization with reception control signals.

    摘要翻译: 半导体装置包括信号传输块和信号接收块。 信号传输块设置在第一芯片中并且被配置为与传输控制信号同步地发送熔丝信息。 信号接收块分别设置在第一芯片和第二芯片中,并被配置为与接收控制信号同步地接收熔丝信息。

    Repair circuit and semiconductor apparatus including the same
    2.
    发明授权
    Repair circuit and semiconductor apparatus including the same 有权
    修理电路和包括其的半导体装置

    公开(公告)号:US08339879B2

    公开(公告)日:2012-12-25

    申请号:US12836443

    申请日:2010-07-14

    IPC分类号: G11C7/00

    摘要: A repair circuit of a semiconductor apparatus includes a transmission control unit configured to generate first through nth (n is an integer equal to or greater than 2) control signals in response to a repair information signal, and enable all mth through nth control signals when the repair information signal indicating an mth (m is an integer equal to or greater than 1 and equal to or less than n) TSV is inputted; transmission units configured to allocate transmission paths for first through nth signals to first through nth TSVs and a repair TSV in response to the first through nth control signals; and receiving units configured to receive the signals transmitted from the first through nth TSVs and the repair TSV in response to the first through nth control signals.

    摘要翻译: 半导体装置的修复电路包括发送控制单元,被配置为响应于修复信息信号产生第一至第n(n是等于或大于2的整数)控制信号,并且当第二至第N控制信号 输入指示第m(m为1以上且等于或小于n的整数)TSV的修复信息信号; 传输单元,被配置为响应于第一至第N控制信号,将第一到第n个信号的传输路径分配到第一到第n个TSV和修复TSV; 以及接收单元,被配置为响应于第一至第N控制信号接收从第一至第TSV和修复TSV发送的信号。

    CONTAINER CAP
    3.
    发明申请
    CONTAINER CAP 有权
    集装箱盖

    公开(公告)号:US20130327772A1

    公开(公告)日:2013-12-12

    申请号:US14000822

    申请日:2012-02-14

    IPC分类号: B65D41/04

    摘要: A container cap according to the present invention includes a lower cap combined with a container and comprising an opening communicating with an inside of the container; and an upper cap combined with the lower cap to cover the opening. Further, the upper cap includes a cover covering the opening; a rim provided around the cover and partly connected to the cover; a connection part connecting the rim and the cover; and a handle connected to the rim and having a round shape, which curves outwards from a center of the cover, viewed on a plane.

    摘要翻译: 根据本发明的容器盖包括与容器结合的下盖,并且包括与容器的内部连通的开口; 以及与下盖结合以覆盖开口的上盖。 此外,上盖包括覆盖开口的盖; 围绕所述盖设置并部分地连接到所述盖的边缘; 连接边缘和盖的连接部分; 以及连接到轮辋并且具有圆形形状的手柄,其从平面上观察到从盖的中心向外弯曲。

    WAFER SCALE ARRAY OF OPTICAL PACKAGE AND METHOD FOR FABRICATING THE SAME
    4.
    发明申请
    WAFER SCALE ARRAY OF OPTICAL PACKAGE AND METHOD FOR FABRICATING THE SAME 有权
    波长范围的光学阵列阵列及其制造方法

    公开(公告)号:US20100283113A1

    公开(公告)日:2010-11-11

    申请号:US12812357

    申请日:2009-01-12

    摘要: A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.

    摘要翻译: 光学封装的晶片级阵列及其制造方法。 光学封装的晶片级阵列包括至少一个透镜结构的晶片级阵列,包括第一晶体管结构的晶片级阵列和直接形成在第一晶体管结构的晶片级阵列上的晶片级透镜阵列 使得晶片尺寸的透镜阵列与第一镜筒结构的晶片级阵列整体地组合,第一镜筒结构的晶片尺寸阵列由与晶片级阵列的透镜的材料不同的材料制成 的镜片; 以及堆叠在所述至少一个透镜结构的所述至少一个晶片级阵列上并与之组合的至少一个第二筒结构的晶片级阵列。

    Method and apparatus for improving sound quality
    5.
    发明授权
    Method and apparatus for improving sound quality 有权
    提高音质的方法和装置

    公开(公告)号:US08543391B2

    公开(公告)日:2013-09-24

    申请号:US13230824

    申请日:2011-09-12

    IPC分类号: G10L21/02

    CPC分类号: G10L21/0364

    摘要: Disclosed is a method of improving a sound quality, including: receiving a transmission signal of a first user equipment; removing noise in the transmission signal using noise information of the first user equipment side; performing speech reinforcement with respect to the noise removed transmission signal using noise information of a second user equipment side; and transmitting the speech reinforced transmission signal to the second user equipment.

    摘要翻译: 公开了一种改善声音质量的方法,包括:接收第一用户设备的发送信号; 使用第一用户设备侧的噪声信息去除传输信号中的噪声; 使用第二用户设备侧的噪声信息对噪声消除的传输信号执行语音强化; 以及将所述语音加强的发送信号发送到所述第二用户设备。

    Wafer-scale array of optical packages and method for fabricating the same
    6.
    发明授权
    Wafer-scale array of optical packages and method for fabricating the same 有权
    光学封装的晶圆尺寸阵列及其制造方法

    公开(公告)号:US08294229B2

    公开(公告)日:2012-10-23

    申请号:US12812357

    申请日:2009-01-12

    IPC分类号: H01L31/0232

    摘要: A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.

    摘要翻译: 光学封装的晶片级阵列及其制造方法。 光学封装的晶片级阵列包括至少一个透镜结构的晶片级阵列,包括第一晶体管结构的晶片级阵列和直接形成在第一晶体管结构的晶片级阵列上的晶片级透镜阵列 使得晶片尺寸的透镜阵列与第一镜筒结构的晶片级阵列整体地组合,第一镜筒结构的晶片尺寸阵列由与晶片级阵列的透镜的材料不同的材料制成 的镜片; 以及堆叠在所述至少一个透镜结构的所述至少一个晶片级阵列上并与之组合的至少一个第二筒结构的晶片级阵列。

    METHOD AND APPARATUS FOR IMPROVING SOUND QUALITY
    7.
    发明申请
    METHOD AND APPARATUS FOR IMPROVING SOUND QUALITY 有权
    改善声音质量的方法和装置

    公开(公告)号:US20120123770A1

    公开(公告)日:2012-05-17

    申请号:US13230824

    申请日:2011-09-12

    IPC分类号: G10L21/02

    CPC分类号: G10L21/0364

    摘要: Disclosed is a method of improving a sound quality, including: receiving a transmission signal of a first user equipment; removing noise in the transmission signal using noise information of the first user equipment side; performing speech reinforcement with respect to the noise removed transmission signal using noise information of a second user equipment side; and transmitting the speech reinforced transmission signal to the second user equipment.

    摘要翻译: 公开了一种改善声音质量的方法,包括:接收第一用户设备的发送信号; 使用第一用户设备侧的噪声信息去除传输信号中的噪声; 使用第二用户设备侧的噪声信息对噪声消除的传输信号执行语音强化; 以及将所述语音加强的发送信号发送到所述第二用户设备。

    Plasma display apparatus
    8.
    发明授权
    Plasma display apparatus 失效
    等离子显示装置

    公开(公告)号:US07804465B2

    公开(公告)日:2010-09-28

    申请号:US11672978

    申请日:2007-02-09

    IPC分类号: G09G3/28 G09G3/10

    摘要: A plasma display apparatus comprises a plasma display panel and a driver. The plasma display panel comprises a first electrode, a second electrode, and a third electrode crossing the first electrode and the second electrode. During a first frame, the driver alternately supplies a sustain signal to the first electrode and the second electrode and supplies a constant voltage to the third electrode. During a second frame having a smaller APL of the first frame, the driver alternately supplies a sustain signal to the first electrode and the second electrode and supplies an auxiliary signal to the third electrode so as to correspond to at least one sustain signal of the sustain signals supplied to the first electrode and the second electrode.

    摘要翻译: 等离子体显示装置包括等离子体显示面板和驱动器。 等离子体显示面板包括第一电极,第二电极和与第一电极和第二电极交叉的第三电极。 在第一帧期间,驱动器向第一电极和第二电极交替提供维持信号,并向第三电极提供恒定电压。 在具有第一帧的较小APL的第二帧期间,驱动器交替地向第一电极和第二电极提供维持信号,并将辅助信号提供给第三电极,以便对应于维持的至少一个维持信号 提供给第一电极和第二电极的信号。

    Semiconductor apparatus transmitting signals between stacked chips
    10.
    发明授权
    Semiconductor apparatus transmitting signals between stacked chips 有权
    半导体装置在堆叠芯片之间传输信号

    公开(公告)号:US08575996B2

    公开(公告)日:2013-11-05

    申请号:US13169430

    申请日:2011-06-27

    申请人: Min Seok Choi

    发明人: Min Seok Choi

    IPC分类号: G11C7/00

    摘要: A semiconductor apparatus may include a transmission control signal generation unit, a fuse signal transmission unit, a reception control signal generation unit and a fuse signal reception unit. The transmission control signal generation unit receives a clock signal and generates a plurality of divided clock signals based on the clock signal to output transmission control signals from the plurality of divided clock signals. The fuse signal transmission unit transmits fuse information in synchronization with the transmission control signals. The reception control signal generation unit receives the clock signal and generates the plurality of divided clock signals, and generates reception control signals based on the plurality of divided clock signals. The fuse signal reception unit receives the fuse information in synchronization with the reception control signals.

    摘要翻译: 半导体装置可以包括传输控制信号生成单元,熔丝信号发送单元,接收控制信号生成单元和熔丝信号接收单元。 发送控制信号生成单元接收时钟信号,并根据时钟信号生成多个分频时钟信号,从多个分频时钟信号输出发送控制信号。 熔丝信号传输单元与传输控制信号同步传输熔丝信息。 接收控制信号生成单元接收时钟信号并生成多个分频时钟信号,并且基于多个分频时钟信号产生接收控制信号。 熔丝信号接收部与接收控制信号同步地接收熔丝信息。