Electrical connector having conductive terminals that are provided with a dielectric coating
    3.
    发明授权
    Electrical connector having conductive terminals that are provided with a dielectric coating 失效
    具有导电端子的电连接器,其具有电介质涂层

    公开(公告)号:US06478586B1

    公开(公告)日:2002-11-12

    申请号:US09971569

    申请日:2001-10-09

    申请人: Danny Ma

    发明人: Danny Ma

    IPC分类号: H01R1200

    摘要: An electrical connector includes a connector housing and a plurality of conductive terminals. Each of the conductive terminals is mounted on the housing, includes a conductive terminal body with first and second contact surfaces, and is provided with a dielectric coating at portions other than the first and second contact surfaces, thereby insulating each of the terminals from adjacent ones on the housing.

    摘要翻译: 电连接器包括连接器壳体和多个导电端子。 每个导电端子安装在壳体上,包括具有第一和第二接触表面的导电端子体,并且在除了第一和第二接触表面之外的部分处设置有电介质涂层,从而使每个端子与相邻端子绝缘 在房屋上

    Integrated circuit structure having conductive, protective layer for
multilayer metallization to permit reworking
    4.
    发明授权
    Integrated circuit structure having conductive, protective layer for multilayer metallization to permit reworking 失效
    集成电路结构,具有用于多层金属化的导电保护层,以允许返工

    公开(公告)号:US4672420A

    公开(公告)日:1987-06-09

    申请号:US722957

    申请日:1985-04-12

    摘要: An improved integrated circuit structure, and method of making the structure, is disclosed wherein at least one metallization layer is coated during production of the structure with a conductive layer capable of withstanding metal removal means, and an upper metallization layer is subsequently applied to the structure. At least a portion of the subsequent metallization layer is in ohmic contact with the conductive layer and the lower metallization layer is protected by the intervening conductive layer during subsequent removal of the upper metallization layer if subsequent reworking of the structure becomes necessary. In a preferred embodiment, the use of the conductive layer over a metallization layer further enhances the construction process during patterning of a photoresist applied over the conductive layer by the use of a conductive material having antireflective properties.

    摘要翻译: 公开了一种改进的集成电路结构和制造该结构的方法,其中在具有能够承受金属去除装置的导电层的结构生产期间至少涂覆一个金属化层,随后将上部金属化层施加到该结构 。 后续金属化层的至少一部分与导电层欧姆接触,并且如果随后的结构的再加工变得必要,则随后去除上部金属化层期间,下部金属化层被中间导电层保护。 在优选实施例中,在金属化层上使用导电层进一步增强了通过使用具有抗反射特性的导电材料在施加在导电层上的光致抗蚀剂图案化期间的构造过程。