Plasma enhanced cyclic deposition method of metal silicon nitride film
    2.
    发明申请
    Plasma enhanced cyclic deposition method of metal silicon nitride film 审中-公开
    金属氮化硅膜的等离子体增强循环沉积法

    公开(公告)号:US20080318443A1

    公开(公告)日:2008-12-25

    申请号:US12157631

    申请日:2008-06-12

    IPC分类号: H01L21/285 C23C16/34

    摘要: The present invention relates to a method for forming a metal silicon nitride film according to a cyclic film deposition under plasma atmosphere with a metal amide, a silicon precursor, and a nitrogen source gas as precursors. The deposition method for forming a metal silicon nitride film on a substrate comprises steps of: pulsing a metal amide precursor; purging away the unreacted metal amide; introducing nitrogen source gas into reaction chamber under plasma atmosphere; purging away the unreacted nitrogen source gas; pulsing a silicon precursor; purging away the unreacted silicon precursor; introducing nitrogen source gas into reaction chamber under plasma atmosphere; and purging away the unreacted nitrogen source gas.

    摘要翻译: 本发明涉及一种在金属酰胺,硅前体和氮源气体作为前体的等离子体气氛下,根据循环膜沉积形成金属氮化硅膜的方法。 用于在衬底上形成金属氮化硅膜的沉积方法包括以下步骤:脉冲金属酰胺前体; 清除未反应的金属酰胺; 在等离子体气氛下将氮源气体引入反应室; 清除未反应的氮源气体; 脉冲硅前体; 清除未反应的硅前体; 在等离子体气氛下将氮源气体引入反应室; 并清除未反应的氮源气体。