Signature circuit, semiconductor device having the same and method of reading signature information
    3.
    发明授权
    Signature circuit, semiconductor device having the same and method of reading signature information 有权
    签名电路,具有相同的半导体器件和读取签名信息的方法

    公开(公告)号:US07506234B2

    公开(公告)日:2009-03-17

    申请号:US11472850

    申请日:2006-06-22

    IPC分类号: G01R31/28

    摘要: A signature circuit in a semiconductor chip includes a signature program circuit configured to be programmed with signature information and to output a signature signal in response to the signature information; a signature output circuit configured to block the signature signal output by the signature program circuit during operation in a normal mode, and configured to pass the signature signal during operation in a test mode; and a pad-driving transistor directly coupled to the pad, configured to drive the pad during operation in the normal mode in response to an operation command, and configured to drive the pad during operation in the test mode in response to the signature signal output by the signature output circuit. The signature circuit outputs the signature information through a transistor for adjusting impedance to reduce a chip size by omitting an additional logic circuit for the signature circuit.

    摘要翻译: 半导体芯片中的签名电路包括签名程序电路,其被配置为对签名信息进行编程,并响应于签名信息输出签名信号; 签名输出电路,被配置为在正常模式下操作期间阻止由所述签名程序电路输出的签名信号,并且被配置为在测试模式下操作期间传递所述签名信号; 以及焊盘驱动晶体管,其直接耦合到所述焊盘,被配置为响应于操作命令在正常模式下操作期间驱动焊盘,并且被配置为响应于在测试模式中的操作期间响应于由 签名输出电路。 签名电路通过用于调整阻抗的晶体管输出签名信息,以通过省略签名电路的附加逻辑电路来减小芯片尺寸。

    Memory device having redundancy fuse blocks arranged for testing
    4.
    发明授权
    Memory device having redundancy fuse blocks arranged for testing 失效
    具有布置用于测试的冗余熔丝块的存储器件

    公开(公告)号:US07443756B2

    公开(公告)日:2008-10-28

    申请号:US11565821

    申请日:2006-12-01

    IPC分类号: G11C17/18

    CPC分类号: G11C29/787

    摘要: A method of arranging redundancy fuse block arrays may reduce test time for a memory device. The memory device may include a stack bank structure in which at least two banks share a row decoder or a column decoder. Redundancy fuse block arrays for the two banks may be alternately arranged in an X-axis direction or a Y-axis direction of a wafer. Accordingly, a tester may repair defective rows or columns of the two banks without shifting from one axis.

    摘要翻译: 布置冗余熔丝块阵列的方法可以减少存储器件的测试时间。 存储器件可以包括堆栈组结构,其中至少两个存储体共享行解码器或列解码器。 用于两组的冗余保险丝座阵列可以在晶片的X轴方向或Y轴方向上交替布置。 因此,测试者可以修复两个组的有缺陷的行或列而不从一个轴移动。

    Signature circuit, semiconductor device having the same and method of reading signature information
    5.
    发明申请
    Signature circuit, semiconductor device having the same and method of reading signature information 有权
    签名电路,具有相同的半导体器件和读取签名信息的方法

    公开(公告)号:US20070030051A1

    公开(公告)日:2007-02-08

    申请号:US11472850

    申请日:2006-06-22

    IPC分类号: H01H37/76

    摘要: A signature circuit in a semiconductor chip includes a signature program circuit configured to be programmed with signature information and to output a signature signal in response to the signature information; a signature output circuit configured to block the signature signal output by the signature program circuit during operation in a normal mode, and configured to pass the signature signal during operation in a test mode; and a pad-driving transistor directly coupled to the pad, configured to drive the pad during operation in the normal mode in response to an operation command, and configured to drive the pad during operation in the test mode in response to the signature signal output by the signature output circuit. The signature circuit outputs the signature information through a transistor for adjusting impedance to reduce a chip size by omitting an additional logic circuit for the signature circuit.

    摘要翻译: 半导体芯片中的签名电路包括签名程序电路,其被配置为对签名信息进行编程,并响应于签名信息输出签名信号; 签名输出电路,被配置为在正常模式下操作期间阻止由所述签名程序电路输出的签名信号,并且被配置为在测试模式下操作期间传递所述签名信号; 以及焊盘驱动晶体管,其直接耦合到所述焊盘,被配置为响应于操作命令在正常模式下操作期间驱动焊盘,并且被配置为响应于在测试模式中的操作期间响应于由 签名输出电路。 签名电路通过用于调整阻抗的晶体管输出签名信息,以通过省略签名电路的附加逻辑电路来减小芯片尺寸。