Thermal control of optical components
    1.
    发明申请
    Thermal control of optical components 有权
    光学部件的热控制

    公开(公告)号:US20060279734A1

    公开(公告)日:2006-12-14

    申请号:US10760145

    申请日:2004-01-16

    IPC分类号: G01J3/28

    摘要: A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, such as an arrayed waveguide grating (AWG), a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple AWG's can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than AWG's, by stabilizing one of the AWG's in the same manner as in the case of a single AWG, and determining power dissipated in the heaters of the remaining AWG's based on the linearized model.

    摘要翻译: 可以使用光学集成电路的线性化热和光学模型来使用主动温度调节来温度稳定电路的一个或多个光学元件。 为了稳定单个光学元件,例如阵列波导光栅(AWG),可以在光栅附近提供温度传感器和加热器。 然后可以使用热系数和光学系数为温度控制器选择适当的温度设定点,该温度控制器从传感器接收读数并确定加热器中消耗的功率。 多个AWG可以单独稳定,使用相同的过程并将交叉加热因子与其他环境因素结合在一起。 或者,通过使用比AWG更少的传感器,可以使用比AWG更少的传感器来稳定多个AWG,通过以与单个AWG相同的方式稳定AWG之一,并根据线性化模型确定剩余AWG的加热器中消耗的功率。

    Isothermal thin film heater
    3.
    发明申请
    Isothermal thin film heater 有权
    等温薄膜加热器

    公开(公告)号:US20050135743A1

    公开(公告)日:2005-06-23

    申请号:US10744790

    申请日:2003-12-23

    IPC分类号: G02B6/34 H05B3/28

    摘要: Systems and methods for an isothermal thin film heater are provided. The isothermal thin film heater mitigates temperature variations in an optical circuit, such as an arrayed-waveguide grating. The thin film heater comprises a conductive plate and at least one heating element trace coupled to the conductive plate for heating the optical circuit. The heating element trace(s) is arranged around a periphery portion of the conductive plate such that concentric arcs are formed by the heating element trace(s). A sensor for sensing the temperature of the thin film heater and/or the optical circuit can also be provided.

    摘要翻译: 提供了等温薄膜加热器的系统和方法。 等温薄膜加热器减轻诸如阵列波导光栅的光学电路中的温度变化。 薄膜加热器包括导电板和耦合到导电板的至少一个加热元件迹线,用于加热光学电路。 加热元件迹线围绕导电板的周边部分布置,使得同心圆弧由加热元件迹线形成。 还可以提供用于感测薄膜加热器和/或光电路的温度的传感器。

    Double core biopsy instrumentation kit
    4.
    发明授权
    Double core biopsy instrumentation kit 有权
    双核活检仪器套件

    公开(公告)号:US07914463B2

    公开(公告)日:2011-03-29

    申请号:US11551784

    申请日:2006-10-23

    IPC分类号: A61B10/00

    CPC分类号: A61B10/0275 A61B2010/0225

    摘要: A biopsy needle for collecting tissue samples includes a needle having a first cavity adapted for accepting a first sample core, the needle having a second cavity adapted for accepting a second sample core and a sheath with a single slot or opening and positioned coaxially with the needle. The needle with the sheath may have a separate core extraction kit.

    摘要翻译: 用于收集组织样本的活检针包括具有适于接受第一样品芯的第一腔的针,所述针具有适于接纳第二样品芯的第二腔和具有单个槽或开口并与针同轴定位的护套 。 具有护套的针可以具有单独的芯提取套件。

    Lead cut and tape attach apparatus
    5.
    发明授权
    Lead cut and tape attach apparatus 失效
    铅切带和胶带装置

    公开(公告)号:US5108536A

    公开(公告)日:1992-04-28

    申请号:US501444

    申请日:1990-03-30

    IPC分类号: H01L21/00 H05K13/00

    摘要: A lead cut and tape attach apparatus (10) for automatically cutting leads on one side of a semiconductor I.C. quad device and subsequently cutting and attaching a piece of tape over the gaps formed between the cut leads and for sequentially cutting the leads and attaching tape thereover on the remaining sides of the quad device includes a double-acting punch assembly (34) formed of an inner punch blade (58) and an outer punch (56). There is provided upper and lower cams (68, 78) for actuating the inner punch blade relative to the outer punch so that on a first downward stroke the inner punch blade is extended to cut the leads of the quad device. On a second downward stroke of the punch assembly, the inner punch blade is retracted and the outer punch cuts and attaches the tape.

    摘要翻译: 一种用于在半导体I.C的一侧自动切割引线的引线切割和带式连接装置(10)。 并且随后在形成在切割引线之间的间隙上切割并附接一条带,并且用于在四边形装置的剩余侧面上顺序地切割引线和连接带,其中包括一个双作用冲头组件(34),该双作用冲头组件 内冲头刀片(58)和外冲头(56)。 设置有用于致动内冲头相对于外冲头的上凸轮和下凸轮(68,78),使得在第一向下行程上,内冲头刀片被延伸以切割四边形装置的引线。 在冲头组件的第二次向下行程中,内冲头刀片缩回并且外冲头切割并附接带子。