Abstract:
An electrostatic discharge protection circuit that includes a rectifier, having an anode and a cathode, including a first p-type portion, a first n-type portion contiguous with the first p-type portion, a second p-type portion contiguous with the first n-type portion, and a second n-type portion contiguous with the second p-type portion, wherein the first p-type portion is coupled to the anode and the second n-type portion is coupled to the cathode, a first transistor having a first terminal, a second terminal and a gate terminal, wherein the first terminal is coupled to the first n-type portion of the rectifier, a second transistor having a first terminal, a second terminal and a gate terminal, wherein the first terminal is coupled to the second terminal of the first transistor, and the second terminal is coupled to the second n-type portion of the rectifier, and a voltage coupling circuit having a first terminal, a second terminal, a third terminal, and a fourth terminal, wherein the first terminal is coupled to the anode of the rectifier, the second and the third terminals are respectively coupled to the gate terminals of the first and second transistors, and the fourth terminal is coupled to the cathode.
Abstract:
The invention discloses a transient voltage detection circuit suitable for an electronic system. The electronic system includes a high voltage line and a low voltage line. The transient voltage detection circuit includes at least one detection circuit and a judge module. Each detection circuit includes a P-typed transistor and/or an N-typed transistor, a capacitor and a detection node. The transistor is coupled with the capacitor, and the detection node is located between the transistor and the capacitor. The judge module is coupled to each of the detection nodes. The judge module generates a judgment according to voltage levels of the detection nodes. Accordingly, the transient voltage detection circuit is formed. The electronic system may selectively execute a protective action according to the judgment.
Abstract:
An electrostatic discharge protection circuit that includes at least two transistors connected in a stacked configuration, a first diffusion region of a first dopant type shared by two adjacent transistors, and a second diffusion region of a second dopant type formed in the first diffusion region. A substrate-triggered site is induced into the device structure of the stacked transistors to improve ESD robustness and turn-on speed. An area-efficient layout to realize the stacked transistors is proposed. The stacked transistors may be implemented in ESD protection circuits with a mixed-voltage I/O interface, or in integrated circuits with multiple power supplies. The stacked transistors are fabricated without using a thick-gate mask.
Abstract:
An electrostatic discharge protection circuit that includes at least two transistors connected in a stacked configuration, a first diffusion region of a first dopant type shared by two adjacent transistors, and a second diffusion region of a second dopant type formed in the first diffusion region. A substrate-triggered site is induced into the device structure of the stacked transistors to improve ESD robustness and turn-on speed. An area-efficient layout to realize the stacked transistors is proposed. The stacked transistors may be implemented in ESD protection circuits with a mixed-voltage I/O interface, or in integrated circuits with multiple power supplies. The stacked transistors are fabricated without using a thick-gate mask.
Abstract:
An on-chip latch-up protection circuit. The lath-up protection circuit includes a core circuit, a power switch, and a current extractor. The power switch controls major current flowing through the core circuit. The current extractor detects amplitude of the major current. The power switch, the core circuit and the current extractor are coupled in series between a relatively-high power line and a relatively-low power line. When the major current surpasses a predetermined amplitude, the power switch is turned off, causing latch-up stops.
Abstract:
An on-chip latch-up protection circuit. The lath-up protection circuit includes a core circuit, a power switch, and a current extractor. The power switch controls major current flowing through the core circuit. The current extractor detects amplitude of the major current. The power switch, the core circuit and the current extractor are coupled in series between a relatively-high power line and a relatively-low power line. When the major current surpasses a predetermined amplitude, the power switch is turned off, causing latch-up stops.
Abstract:
An on-chip latch-up protection circuit. The lath-up protection circuit includes a core circuit, a power switch, and a current extractor. The power switch controls major current flowing through the core circuit. The current extractor detects amplitude of the major current. The power switch, the core circuit and the current extractor are coupled in series between a relatively-high power line and a relatively-low power line. When the major current surpasses a predetermined amplitude, the power switch is turned off, causing latch-up stops.
Abstract:
A mixed-voltage I/O buffer circuit that prevents leakages through a driver stage PMOS transistor is provided. The buffer circuit has a first part that prevents leakage through a parasitic diode of the transistor and a second part that prevents leakage through the transistor when the transistor is turned on by a signal on a bonding pad having a voltage level higher than a power supply voltage of the buffer circuit. The buffer circuit provides biases approximately equal to the high voltage signal to a gate and a substrate terminal of the PMOS transistor when the bonding pad has the high voltage signal thereon, and provides a bias approximately equal to the power supply voltage of the buffer circuit to the gate and substrate of the PMOS transistor when the bonding pad has a low voltage signal thereon.
Abstract:
An integrated circuit device receiving signals from a signal pad that includes at least one silicon bipolar junction transistor responsive to the signals from the signal pad for providing electrostatic discharge protection, and a detection circuit for detecting the signals from the signal pad and providing a bias voltage to the at least one silicon bipolar junction transistor, wherein the at least one silicon bipolar junction transistor includes an emitter, collector and base formed in a single silicon layer and isolated from a substrate of the integrated circuit device, and wherein the base is coupled to the detection circuit to receive the bias voltage.
Abstract:
The present invention is directed to an electrostatic discharge (ESD) device with an improved ESD robustness for protecting output buffers in I/O cell libraries. The ESD device according to the present invention uses a novel I/O cell layout structure for implementing a turn-on restrained method that reduces the turn-on speed of an ESD guarded MOS transistor by adding a pick-up diffusion region and/or varying channel lengths in the layout structure.