Heat sink
    1.
    发明申请
    Heat sink 审中-公开
    散热器

    公开(公告)号:US20070029068A1

    公开(公告)日:2007-02-08

    申请号:US11195632

    申请日:2005-08-03

    IPC分类号: H05K7/20

    摘要: A heat sink has a base and multiple fins. The fins are attached to the base, and each fin has a radiating surface and a conducting surface. The conducting surface is formed on the radiating surface and has at least one side abutting the base. The base is attached to an integrated circuit to dissipate heat from the integrated circuit. Because at least one of the two sides of the conducting surfaces is in full contact with the base, more heat is conducted from the base to the fins. Therefore the heat sink can cool the integrated circuit effectively.

    摘要翻译: 散热器有一个底座和多个散热片。 翅片附接到基座,并且每个翅片具有辐射表面和导电表面。 导电表面形成在辐射表面上,并且至少一个侧面邻接底座。 该基座连接到集成电路以从集成电路散热。 因为导电表面的两侧中的至少一个与基底完全接触,所以从基底向鳍片传导更多的热量。 因此,散热器可以有效地冷却集成电路。

    Method for detecting the inclined status of hot plate
    3.
    发明申请
    Method for detecting the inclined status of hot plate 审中-公开
    检测热板倾斜状态的方法

    公开(公告)号:US20060219696A1

    公开(公告)日:2006-10-05

    申请号:US11098493

    申请日:2005-04-05

    申请人: Ming-Jen Cheng

    发明人: Ming-Jen Cheng

    IPC分类号: H05B3/68

    CPC分类号: H05B3/68 G03F7/168

    摘要: A method for detecting the inclined status of a hot plate comprising selecting a sensitive photoresist coated on a wafer. A first wafer is positioned on a standard hot plate to perform a bake treatment. A stepping exposure with gradually changing light intensity is performed to obtain the minimum exposure energy of the thickness of the first photoresist layer. A second photoresist layer the same as the first wafer is coated on the surface of the second wafer, and positioned on a hot plate under test to perform a bake treatment. The second photoresist layer is exposed by a minimum exposure energy, thereby having the first photoresist layer being uniformly exposed or not to determine whether the hot plate under test is inclined or not.

    摘要翻译: 一种用于检测热板的倾斜状态的方法,包括选择涂覆在晶片上的敏感光刻胶。 将第一晶片定位在标准热板上以进行烘烤处理。 执行逐渐变化的光强度的步进曝光以获得第一光致抗蚀剂层的厚度的最小曝光能量。 将与第一晶片相同的第二光致抗蚀剂层涂覆在第二晶片的表面上,并定位在被测试的热板上进行烘烤处理。 第二光致抗蚀剂层以最小曝光能量曝光,从而使第一光致抗蚀剂层均匀地曝光或不能确定被测热板是否倾斜。

    Digital wireless stereophonic music transmission device
    6.
    发明申请
    Digital wireless stereophonic music transmission device 审中-公开
    数字无线立体声音乐传输装置

    公开(公告)号:US20080123879A1

    公开(公告)日:2008-05-29

    申请号:US11606318

    申请日:2006-11-28

    申请人: Ming-Jen Cheng

    发明人: Ming-Jen Cheng

    IPC分类号: H04R5/02

    摘要: A digital wireless stereophonic music transmission device includes a transmission module and a headphone. The transmission module includes a digital signal input device for receiving digital audio signals from an external digital music player, a stereophonic input device for receiving stereophonic signals from an external stereophonic music player, an analog/digital converter for converting the stereophonic signals into digital audio signals, and a signal transmitting module that receives digital audio signals from one of the digital signal input device and the analog/digital converter and then codes and transmits the signals received. The headphone includes a signal receiving module, an analog/digital converter, an amplifier, and at least one loudspeaker unit. The signal receiving module receives the signals from the signal transmitting module. The analog/digital converter of the headphone converts the signals received by the signal receiving module into analog audio signals that are output via the amplifier and the loudspeaker unit.

    摘要翻译: 数字无线立体声音乐传输装置包括传输模块和耳机。 传输模块包括用于从外部数字音乐播放器接收数字音频信号的数字信号输入装置,用于从外部立体声音乐播放器接收立体声信号的立体声输入装置,用于将立体声信号转换成数字音频信号的模拟/数字转换器 以及信号发送模块,其从数字信号输入装置和模拟/数字转换器之一接收数字音频信号,然后对所接收的信号进行编码和发送。 耳机包括信号接收模块,模拟/数字转换器,放大器和至少一个扬声器单元。 信号接收模块从信号发送模块接收信号。 耳机的模拟/数字转换器将由信号接收模块接收的信号转换为通过放大器和扬声器单元输出的模拟音频信号。

    COMBINATION HEAT SINK
    7.
    发明申请
    COMBINATION HEAT SINK 审中-公开
    组合式散热器

    公开(公告)号:US20080024994A1

    公开(公告)日:2008-01-31

    申请号:US11491988

    申请日:2006-07-25

    申请人: Ming-Jen Cheng

    发明人: Ming-Jen Cheng

    IPC分类号: H05K7/20

    摘要: A combination heat sink formed of a plurality of radiation fins radially fastened together to show a circular configuration having a top rounded recess that is defined by a notch on each radiation fin for gathering currents of air for enabling gathered currents of air to be guided by a curved surface portion of each radiation fin to the outside of the heat sink to carry heat away from the heat sink rapidly and efficiently. Each radiation fin has a coupling portion so arranged that the radiation fins are fastened together by securing the coupling portion of one radiation fin to the coupling portion of another without the use of any external fastening means of tools.

    摘要翻译: 由多个径向固定在一起的辐射翅片形成的组合散热片,以示出圆形结构,其具有顶部圆形凹槽,该顶部圆形凹槽由每个辐射翅片上的凹口限定,用于收集空气流,以使得能够通过 每个辐射翅片的弯曲表面部分到散热器的外部,从而将热量快速有效地从散​​热器携带。 每个辐射翅片具有一个联接部分,其布置成使得通过将一个辐射翅片的联接部分固定到另一个辐射翅片的联接部分而将散热片固定在一起,而不需要使用任何外部紧固装置。