公开(公告)号：US20090163069A1

公开(公告)日：2009-06-25

申请号：US12317651

申请日：2008-12-23

申请人： Ming-Yue Chen ,  Been-Yang Liaw ,  Wen-Yi Hsieh ,  Shih-Wei Hsiao

发明人： Ming-Yue Chen ,  Been-Yang Liaw ,  Wen-Yi Hsieh ,  Shih-Wei Hsiao

IPC分类号： H01R13/62 ,  H01R12/00

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R31/2863 ,  H01R12/585 ,  H01R12/89 ,  H01R13/03 ,  H01R13/11 ,  H01R2201/20

摘要： A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ends thereof respectively. Solder balls attached to the bottom of the IC package are respectively clipped between the pair of the tip portions and thus the IC package should be brought into electrical contact with the contacts of the burn-in socket. The tip portion is plated with a Pd—Co layer for reducing the attachment of the Sn and preventing the impedance of the contacts to increase. Meanwhile, the IC package can be sucked up successfully without absorption from the contacts of the burn-in socket.

摘要翻译： 用于接收IC封装的老化插座包括插座主体，安装在插座主体中的多个触点和可移动地安装在插座主体上的致动器。 插座主体中的每个触点分别具有一对夹持臂，其顶端部分分别在其自由端。 附着在IC封装的底部的焊球分别夹在一对尖端部分之间，因此IC封装应与老化插座的触点电接触。 尖端部分镀有Pd-Co层，以减少Sn的附着并防止触点的阻抗增加。 同时，IC封装可以成功吸入，而不会从老化插座的触点吸收。

公开(公告)号：US07963778B2

公开(公告)日：2011-06-21

申请号：US12317651

申请日：2008-12-23

申请人： Ming-Yue Chen ,  Been-Yang Liaw ,  Wen-Yi Hsieh ,  Shih-Wei Hsiao

发明人： Ming-Yue Chen ,  Been-Yang Liaw ,  Wen-Yi Hsieh ,  Shih-Wei Hsiao

IPC分类号： H01R12/00

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R31/2863 ,  H01R12/585 ,  H01R12/89 ,  H01R13/03 ,  H01R13/11 ,  H01R2201/20

摘要： A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ends thereof respectively. Solder balls attached to the bottom of the IC package are respectively clipped between the pair of the tip portions and thus the IC package should be brought into electrical contact with the contacts of the burn-in socket. The tip portion is plated with a Pd—Co layer for reducing the attachment of the Sn and preventing the impedance of the contacts to increase. Meanwhile, the IC package can be sucked up successfully without absorption from the contacts of the burn-in socket.

摘要翻译： 用于接收IC封装的老化插座包括插座主体，安装在插座主体中的多个触点和可移动地安装在插座主体上的致动器。 插座主体中的每个触点分别具有一对夹持臂，其顶端部分分别在其自由端。 附着在IC封装的底部的焊球分别夹在一对尖端部分之间，因此IC封装应与老化插座的触点电接触。 尖端部分镀有Pd-Co层，以减少Sn的附着并防止触点的阻抗增加。 同时，IC封装可以成功吸入，而不会从老化插座的触点吸收。

公开(公告)号：US08403681B2

公开(公告)日：2013-03-26

申请号：US13050896

申请日：2011-03-17

申请人： Cheng-Ching Chien ,  Been-Yang Liaw

发明人： Cheng-Ching Chien ,  Been-Yang Liaw

IPC分类号： H01R12/00

CPC分类号： H01R4/04 ,  H01R12/716 ,  H05K7/1061

摘要： An electrical connector assembly includes an electrical connector, a chip located and a printed circuit board located at opposite sides of the anisoptropic conductive film. The electrical connector has an anisoptropic conductive film and a loading mechanism. The anisoptropic conductive film includes an adhesive and a number of conductive particles dispersed in the adhesive. The anisoptropic conductive film has conductivity only in a thicknesswise direction by pressing. The loading mechanism can exert pressure on the anisoptropic conductive film so that the chip and the printed circuit board electrically couples with each other.

摘要翻译： 电连接器组件包括电连接器，位于芯片的位置和位于各向异性导电膜的相对侧的印刷电路板。 电连接器具有不对称导电膜和加载机构。 各向异性导电膜包括粘合剂和分散在粘合剂中的多个导电颗粒。 各向异性导电膜仅通过压制在厚度方向上具有导电性。 加载机构可以对各向异性导电膜施加压力，使得芯片和印刷电路板彼此电耦合。

公开(公告)号：US6087470A

公开(公告)日：2000-07-11

申请号：US107330

申请日：1998-06-30

申请人： Der-Jang Liaw ,  Been-Yang Liaw

发明人： Der-Jang Liaw ,  Been-Yang Liaw

IPC分类号： C08G69/26 ,  C08G69/32 ,  C08G69/40 ,  C08G73/10 ,  C08G73/14

CPC分类号： C08G69/40 ,  C08G69/265 ,  C08G69/32 ,  C08G73/105 ,  C08G73/14

摘要： The new diamine, "3,3',5,5'-tetramethyl-2,2-bis[4-(4-amino-phenoxy)phenyl]propane" was synthesized and used to prepare high performance soluble engineering plastics by polycondensation. The polymer can be polyamides, polyimides or poly(amide-imide)s. These polymers exhibit excellent solubility, processability, heat resistance and mechanical performance.

摘要翻译： 合成新二胺“3,3'，5,5'-四甲基-2,2-双[4-（4-氨基 - 苯氧基）苯基]丙烷”，并用于通过缩聚制备高性能可溶性工程塑料。 聚合物可以是聚酰胺，聚酰亚胺或聚（酰胺 - 酰亚胺）。 这些聚合物表现出优异的溶解性，加工性，耐热性和机械性能。

公开(公告)号：US5817741A

公开(公告)日：1998-10-06

申请号：US855963

申请日：1997-05-14

申请人： Der-Jang Liaw ,  Been-Yang Liaw

发明人： Der-Jang Liaw ,  Been-Yang Liaw

IPC分类号： C07C217/84 ,  C08G69/40 ,  C08G73/10 ,  C08G69/26

CPC分类号： C07C217/84 ,  C08G69/40 ,  C08G73/105

摘要： A diamine which is useful in preparing a new flexible polyamide and polyimide with an aromatic dicarboxylic acid and a tetracarboxylic dianhydrides, respectively, has a general formula as follows: ##STR1## wherein R.sub.1 is a proton (--H) or methyl (--CH.sub.3) and n is an integer ranging from 1 to 4. These polyamide and polyimide exhibit good mechanical performance and processability.

摘要翻译： 分别用芳族二羧酸和四羧酸二酐制备新的柔性聚酰胺和聚酰亚胺的二胺具有如下通式：其中R 1是质子（-H）或 甲基（-CH 3），n为1〜4的整数。这些聚酰胺和聚酰亚胺表现出良好的机械性能和加工性。

公开(公告)号：US09142932B2

公开(公告)日：2015-09-22

申请号：US13444866

申请日：2012-04-12

申请人： Been-Yang Liaw ,  Chih-Pi Cheng ,  Fu-Jin Peng ,  Zhan-Jun Xu

发明人： Been-Yang Liaw ,  Chih-Pi Cheng ,  Fu-Jin Peng ,  Zhan-Jun Xu

IPC分类号： H01R12/00 ,  H01R43/16 ,  H01R12/57 ,  H01R13/03

CPC分类号： H01R43/16 ,  H01R12/57 ,  H01R13/03 ,  Y10T29/49213

摘要： An electrical connector having a fusible element for mounting on a substrate includes an insulative housing and a contact terminal retained in the insulative housing. The contact terminal includes a resilient contacting arm extending beyond a mating face of the insulative housing and a soldering portion for mating with the fusible element. A gelatinous flux is deployed on the fusible element, and/or on the soldering portion, and/or between the fusible element and the soldering portion, and then flux is dried to immovably fix the fusible element with respect to the soldering portion. The dried flux will be re-juvenile to clean and remove an oxidized layer originally existed on the soldering portion so as to achieve robust welding quality. Besides, a method for trimming an electrical connector to have robust welding properties is also disclosed.

摘要翻译： 具有用于安装在基板上的可熔元件的电连接器包括绝缘壳体和保持在绝缘壳体中的接触端子。 接触端子包括延伸超过绝缘壳体的配合面的弹性接触臂和用于与可熔元件配合的焊接部分。 在可熔元件和/或焊接部分上和/或可熔元件和焊接部分之间部署凝胶状焊剂，然后将焊剂干燥以相对于焊接部分固定可熔元件。 干燥的焊剂将被重新清洁，以清除和去除最初存在于焊接部分上的氧化层，以获得坚固的焊接质量。 此外，还公开了一种用于修整电连接器以具有坚固的焊接性能的方法。

公开(公告)号：US20110086558A1

公开(公告)日：2011-04-14

申请号：US12904174

申请日：2010-10-14

申请人： Chih-Pi Cheng ,  Cheng-Ching Chien ,  Jia-Hau Liu ,  Been-Yang Liaw

发明人： Chih-Pi Cheng ,  Cheng-Ching Chien ,  Jia-Hau Liu ,  Been-Yang Liaw

IPC分类号： H01R13/02 ,  B05D5/12

CPC分类号： H01R13/03 ,  H01R12/52

摘要： An electrical contact material includes a base material, a first number of plating layers forming a contact section and a second number of plating layers forming a soldering section, respectively. The second number of plating layers is provided on the base material and includes a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.

摘要翻译： 电接触材料分别包括基材，形成接触部的第一数量的镀层和形成焊接部的第二数量的镀层。 第二数量的镀层设置在基材上，并且在该基材上直接包含Ni镀层，在所述Ni镀层上包含有机抗氧化镀层。

公开(公告)号：US20090170350A1

公开(公告)日：2009-07-02

申请号：US12317861

申请日：2008-12-29

申请人： Zhan-Jun Xu ,  Been-Yang Liaw ,  Fu-Jin Peng

发明人： Zhan-Jun Xu ,  Been-Yang Liaw ,  Fu-Jin Peng

IPC分类号： H01R12/00 ,  H01R13/62

CPC分类号： H05K7/1053

摘要： An electrical connector is for electrically connecting an electronic package with a circuit substrate. The connector includes a housing with a plurality of conductive terminals received therein, a fastening device for securing the electronic package. The fastening device includes a pressing member for pressing and securing the electronic package and a retaining member for securing the pressing member. At least one of the pressing member, the retaining member are produced from ferrite stainless steel material, and has a layer of high temperature resistant organic thin film thereon.

摘要翻译： 电连接器用于将电子封装与电路基板电连接。 连接器包括具有容纳在其中的多个导电端子的壳体，用于固定电子封装的紧固装置。 紧固装置包括用于按压和固定电子包装的按压构件和用于固定按压构件的保持构件。 压紧构件中的至少一个，保持构件由铁素体不锈钢材料制成，并且在其上具有耐高温有机薄膜层。

公开(公告)号：US5844065A

公开(公告)日：1998-12-01

申请号：US855969

申请日：1997-05-14

申请人： Der-Jang Liaw ,  Been-Yang Liaw

发明人： Der-Jang Liaw ,  Been-Yang Liaw

IPC分类号： C07C217/90 ,  C08G69/40 ,  C08G73/10 ,  C08G69/26

CPC分类号： C08G73/1046 ,  C07C217/90 ,  C08G69/40 ,  C08G73/1039 ,  C08G73/105

摘要： A new diamine, 2,2'-dimethyl-4,4'-bis(4-aminophenoxy)-biphenyl was synthesized and used to prepare high performance engineering plastics by polycondensation. The new diamine as shown in the following formula has a noncoplanar 2,2'-disubstituted biphenylene and a flexible aryl units: ##STR1## The engineering plastics disclosed in the present invention includes polyamides, polyimides and poly(amide-imide)s.

摘要翻译： 合成了一种新的二胺，2,2'-二甲基-4,4'-双（4-氨基苯氧基） - 联苯并用于通过缩聚制备高性能工程塑料。 如下式所示的新二胺具有非平面的2,2'-二取代亚联苯和柔性芳基单元：本发明中公开的工程塑料包括聚酰胺，聚酰亚胺和聚（酰胺 - 酰亚胺）。

公开(公告)号：US07993145B1

公开(公告)日：2011-08-09

申请号：US12832905

申请日：2010-07-08

申请人： David Gregory Howell ,  Chih-Pi Cheng ,  Been-Yang Liaw ,  Cheng-Ching Chien

发明人： David Gregory Howell ,  Chih-Pi Cheng ,  Been-Yang Liaw ,  Cheng-Ching Chien

IPC分类号： H01R12/00

CPC分类号： H01R12/57 ,  H01R13/2435

摘要： A socket connector (100) adapted for electrically connecting a package to a printed circuit board comprises a substrate (2) and a plurality of contacts (3), the substrate (2) comprises a top surface (21), a bottom surface (22) opposite to the top surface (21) and a plurality of passageways (211) impenetrate the top surface (21) and the bottom surface (22), the contact (3) is partly received in the passageway (211) and comprises a body portion (31), at least one leg (33) extends downwardly from the body portion (31) and a spring arm (32) extends upwardly from the body portion (31), the body portion (31) is attached to the top surface of the substrate (2) and the leg (33) goes through the passageway (211) to position the contact (3) on the substrate (2).

摘要翻译： 适于将封装电连接到印刷电路板的插座连接器（100）包括基板（2）和多个触点（3），所述基板（2）包括顶表面（21），底表面（22） ）和多个通道（211）穿过所述顶表面（21）和所述底表面（22），所述触头（3）部分地容纳在所述通道（211）中并且包括主体 部分（31），至少一个腿部（33）从主体部分（31）向下延伸，并且弹簧臂（32）从主体部分（31）向上延伸，主体部分（31）附接到顶部表面 所述基板（2）和所述支脚（33）穿过所述通道（211）以将所述触点（3）定位在所述基板（2）上。