公开(公告)号：US20140091198A1

公开(公告)日：2014-04-03

申请号：US14123636

申请日：2011-10-11

申请人： Mitsubishi Electric Corporation

发明人： Fumio Shoda ,  Hidenori Fukahori ,  Takayuki Yanagisawa ,  Mitoru Yabe ,  Tetsuya Nishimura ,  Shuhei Yamamoto ,  Yoko Inoue ,  Tetsuo Funakura

IPC分类号： G01J1/04

CPC分类号： G01J1/0448 ,  G01J1/0429 ,  G01J1/0474 ,  G01J1/4257

摘要： A laser output measurement mechanism includes a light splitter that is disposed in a state rotated by a predetermined angle about an optical axis of laser light incident thereon, and that reflects a part of the laser light according to a Fresnel reflectivity that depends on a polarization direction and an incident angle of the laser light at a reflection surface thereof, and a light detector that measures an intensity of the laser light reflected by the light splitter.

摘要翻译： 激光输出测量机构包括光分离器，该光分离器以处于入射到其上的激光的光轴旋转预定角度的状态，并且根据取决于偏振方向的菲涅耳反射率反射一部分激光 以及其反射面处的激光的入射角，以及测量由分光器反射的激光的强度的光检测器。

公开(公告)号：US09450380B2

公开(公告)日：2016-09-20

申请号：US14550613

申请日：2014-11-21

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Shuhei Yamamoto ,  Akira Nakamura ,  Kazutaka Ikeda

IPC分类号： H01S5/00 ,  H01S5/20 ,  H01S5/022

CPC分类号： H01S5/20 ,  H01S5/0224 ,  H01S5/02272

摘要： A sub-mount includes a sub-mount substrate, an Au layer placed above the sub-mount substrate, a barrier layer which is placed on the Au layer and has a barrier portion at least in a portion of its outer peripheral portion which is other than a portion corresponding to a side of an output end of a semiconductor laser, and a solder layer placed on the barrier layer in an area surrounded by the barrier portion, wherein the semiconductor laser is bonded to the sub-mount through the solder layer, in a state where the semiconductor laser is spaced apart by a predetermined interval from an inner surface of the barrier portion, and further, the output end protrudes, in a direction of output of the laser light, from an end of the solder layer which corresponds to the side of the output end of the semiconductor laser.

摘要翻译： 子安装座包括副安装基板，位于副安装基板上方的Au层，位于Au层上的阻挡层，至少在其外周部分的另一部分上具有阻挡部分 比与半导体激光器的输出端的一侧对应的部分，以及在由阻挡部包围的区域中的阻挡层上设置的焊料层，其中半导体激光通过焊料层接合到副安装座， 在半导体激光器与阻挡部分的内表面隔开预定间隔的状态下，并且输出端在激光输出方向上从相应的焊料层的端部突出 到半导体激光器的输出端侧。