公开(公告)号：US07135754B2

公开(公告)日：2006-11-14

申请号：US10757643

申请日：2004-01-13

申请人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

发明人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

IPC分类号： H01L23/48 ,  H05K7/06 ,  H01G4/228 ,  H01G9/04 ,  H09G9/012

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/10 ,  H01L2924/0002 ,  Y10S257/924 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/4913 ,  H01L2924/00

摘要： In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

公开(公告)号：US07337513B2

公开(公告)日：2008-03-04

申请号：US11492541

申请日：2006-07-25

申请人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

发明人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

IPC分类号： H01G7/00

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/10 ,  H01L2924/0002 ,  Y10S257/924 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/4913 ,  H01L2924/00

摘要： In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

摘要翻译： 在包括电容器元件和覆盖电容器元件的封装树脂的芯片型固体电解电容器中，封装树脂具有与安装表面相邻的安装表面和侧表面。 端子电连接到电容器元件并且耦合到封装树脂。 端子沿着安装表面和侧表面延伸以具有从包装树脂露出的外表面并且具有与外端子表面相对的内表面。 内表面具有通过锻造形成的阶梯形状。

公开(公告)号：US20060270115A1

公开(公告)日：2006-11-30

申请号：US11492541

申请日：2006-07-25

申请人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

发明人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

IPC分类号： H01L21/00

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/10 ,  H01L2924/0002 ,  Y10S257/924 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/4913 ,  H01L2924/00

摘要： In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

摘要翻译： 在包括电容器元件和覆盖电容器元件的封装树脂的芯片型固体电解电容器中，封装树脂具有与安装表面相邻的安装表面和侧表面。 端子电连接到电容器元件并且耦合到封装树脂。 端子沿着安装表面和侧表面延伸以具有从包装树脂露出的外表面并且具有与外端子表面相对的内表面。 内表面具有通过锻造形成的阶梯形状。

公开(公告)号：US06920037B2

公开(公告)日：2005-07-19

申请号：US10623255

申请日：2003-07-18

申请人： Mitsunori Sano ,  Takashi Kono ,  Kazuto Yoshida ,  Takashige Suzuki

发明人： Mitsunori Sano ,  Takashi Kono ,  Kazuto Yoshida ,  Takashige Suzuki

IPC分类号： H01G9/012 ,  H01G4/228 ,  H01G9/00 ,  H01G9/04 ,  H01G9/042 ,  H01G9/15 ,  H01G13/00

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/15 ,  Y10T29/417

摘要： In a solid electrolytic capacitor, an anode terminal (27 in FIG. 3) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (11). The two plate pieces are made of a series of continuous members.

摘要翻译： 在固体电解电容器中，阳极端子（图3中的27）具有T形截面，其中两个板块成直角相交。 两个板块中的一个暴露于固体电解电容器的安装表面，而另一个垂直地竖立到阳极引线（11）。 两个板块由一系列连续的构件制成。

公开(公告)号：US06903922B2

公开(公告)日：2005-06-07

申请号：US10387397

申请日：2003-03-14

申请人： Mitsunori Sano ,  Takashi Kono

发明人： Mitsunori Sano ,  Takashi Kono

IPC分类号： H01G9/00 ,  H01G9/012 ,  H01G13/00 ,  H01G4/228 ,  H01G9/04

CPC分类号： H01G9/012 ,  H01G2/02 ,  H01G4/236

摘要： A chip type capacitor which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability, and a method for preparing the chip type capacitor and an anode terminal. The chip type capacitor has a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body. An anode terminal is electrically connected to the portion of the anode lead wire extending from the anode body. This extending portion of the anode lead wire has about 75% or more of its periphery, in the direction substantially perpendicular to the extending direction of the anode lead wire, covered with solidified matter resulting from solidification of a melt, thereby bonding the anode terminal and the anode lead wire to each other.

摘要翻译： 具有改善阳极引线和阳极端子之间的接合强度并提高可靠性的芯片型电容器，以及制造芯片型电容器和阳极端子的方法。 片式电容器具有固体电解电容器元件，其包括具有阳极体，电介质和阴极体的元件体以及从元件体的阳极体部分延伸的阳极引线。 阳极端子电连接到从阳极体延伸的阳极引线的部分。 阳极引线的该延伸部分在大致垂直于阳极引线的延伸方向的方向上具有大约75％或更多的周边，被固化的熔体所固化的物质覆盖，从而将阳极端子和 阳极引线相互连接。

公开(公告)号：US06616713B2

公开(公告)日：2003-09-09

申请号：US09987251

申请日：2001-11-14

申请人： Mitsunori Sano ,  Takashi Kono ,  Kazunori Watanabe

发明人： Mitsunori Sano ,  Takashi Kono ,  Kazunori Watanabe

IPC分类号： H01G900

CPC分类号： H01G9/012 ,  Y10T29/417 ,  Y10T29/49254

摘要： An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.

公开(公告)号：US06519135B2

公开(公告)日：2003-02-11

申请号：US10140180

申请日：2002-05-08

申请人： Mitsunori Sano ,  Takashi Kono

发明人： Mitsunori Sano ,  Takashi Kono

IPC分类号： H01G904

CPC分类号： H01G9/012 ,  H01G9/15 ,  H01G11/48 ,  Y02E60/13

摘要： A chip capacitor has capacitor component 14 having anode lead 17 and sintered body 21 of a metal having a valve action in which anode lead 17 is embedded so as to project from embedding surface 21a, resin-based insulating film layer 24 containing a white pigment and disposed on the embedding surface of capacitor component 14, water-repellent layer 25 disposed on resin-based insulating film layer 24, anode terminal 12 having a portion bent into joint tongue 31, with anode lead 17 being placed on joint tongue 31, joint tongue 31 and anode lead 17 being welded to each other into anode terminal 12, and antireflection member 34 extending from a proximal end of joint tongue 31 of anode terminal 12 toward sintered body 21. When joint tongue 31 and anode lead 17 are welded to each other by a laser beam, antireflection member 34 prevents the laser beam from being reflected from the welded region.

公开(公告)号：US20050168921A1

公开(公告)日：2005-08-04

申请号：US11097316

申请日：2005-04-04

申请人： Mitsunori Sano ,  Takashi Kono

发明人： Mitsunori Sano ,  Takashi Kono

IPC分类号： H01G9/00 ,  H01G9/012 ,  H01G13/00

CPC分类号： H01G9/012 ,  H01G2/02 ,  H01G4/236

摘要： A chip type capacitor is disclosed which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability. A method for preparing the chip type capacitor and an anode terminal used in the preparation method are also disclosed. The chip type capacitor comprises: a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body; and an anode terminal electrically connected to the anode lead wire, the anode lead wire having such a site that about 75% or more of a periphery of a section thereof in the direction substantially perpendicular to the extending direction of the anode lead wire is covered with solidified matter resulting from solidification of a melt, the anode terminal and the anode lead wire being bonded to each other by the solidified matter.

摘要翻译： 公开了一种芯片型电容器，其具有改善的阳极引线和阳极端子之间的结合强度，并提高了可靠性。 还公开了制备方法中制备芯片型电容器和阳极端子的方法。 芯片型电容器包括：固体电解电容器元件，包括具有阳极体，电介质和阴极体的元件体和从元件体的阳极体部分延伸的阳极引线; 以及与阳极引线电连接的阳极端子，具有这样的位置的阳极引线被覆在与阳极引线的延伸方向大致垂直的方向上的部分的周边的大约75％以上的位置 由熔体固化而产生的固化物，阳极端子和阳极引线通过凝固物彼此接合。

公开(公告)号：US09231242B2

公开(公告)日：2016-01-05

申请号：US13927462

申请日：2013-06-26

申请人： Atsushi Sugihara ,  Takashi Kono ,  Tsubasa Matsuda ,  Naoyuki Wada ,  Shuji Tsutsumi ,  Tatsuya Hashimoto

发明人： Atsushi Sugihara ,  Takashi Kono ,  Tsubasa Matsuda ,  Naoyuki Wada ,  Shuji Tsutsumi ,  Tatsuya Hashimoto

IPC分类号： H01M4/04 ,  H01M4/1393 ,  H01M4/62

CPC分类号： H01M4/04 ,  H01M4/1393 ,  H01M4/62 ,  Y02E60/122 ,  Y02P70/54

摘要： A method for producing a non-aqueous electrolyte secondary battery includes: subjecting a mixture of a negative-electrode active material on which oil has been adsorbed, CMC and water to hard kneading to prepare a primary kneaded mixture; diluting the primary kneaded mixture with water to prepare a slurry; and adding a binder to the slurry. The method further includes defining an amount of the oil to a value equal to or more than 50 ml/100 g and equal to or less than 62 ml/100 g, wherein the amount of the oil is an amount at the time when the viscosity characteristics of the negative-electrode active material exhibits 70% of the maximum torque that is generated when the oil is titrated onto the negative-electrode active material. The 1% aqueous solution viscosity of the CMC is defined to a value equal to or more than 6000 mPa·s and equal to or less than 8000 mPa·s.

摘要翻译： 一种非水电解质二次电池的制造方法，其特征在于，将具有吸附油的负极活性物质与CMC和水的混合物进行硬质混炼，制备初级混炼物; 用水稀释初级捏合混合物以制备浆料; 并向浆料中加入粘合剂。 该方法还包括将油的量定义为等于或大于50ml / 100g且等于或小于62ml / 100g的值，其中所述油的量是当粘度 负极活性物质的特性表现出当将油滴定在负极活性物质上时产生的最大扭矩的70％。 CMC的1％水溶液粘度定义为等于或大于6000mPa·s且等于或小于8000mPa·s的值。

公开(公告)号：US08774521B2

公开(公告)日：2014-07-08

申请号：US13404470

申请日：2012-02-24

申请人： Yamato Kanda ,  Makoto Kitamura ,  Takashi Kono ,  Masashi Hirota

发明人： Yamato Kanda ,  Makoto Kitamura ,  Takashi Kono ,  Masashi Hirota

IPC分类号： G06K9/66 ,  G06T7/00

CPC分类号： G06T7/0012 ,  G06T2207/20036 ,  G06T2207/30021 ,  G06T2207/30096

摘要： An image processing apparatus includes an approximate-surface calculator that calculates multiple approximate surfaces that each approximate the pixel value of a pixel included in an examination-target region of an image; an approximate-surface selector that selects at least one approximate surface from the approximate surfaces on the basis of the relation between the pixel value of the pixel in the examination-target region and the approximate surfaces; an approximate-region setting unit that sets an approximate region that is approximated by at least the selected one approximate surface; and an abnormal-region detector that detects an abnormal region on the basis of the pixel value of a pixel in the approximate region and the value corresponding to the coordinates of that pixel on at least one approximate surface.

摘要翻译： 一种图像处理装置，包括近似表面计算器，其计算出近似所述图像的检查对象区域中包含的像素的像素值的多个近似面; 基于检查对象区域中的像素的像素值与近似表面之间的关系，从近似表面选择至少一个近似表面的近似表面选择器; 近似区域设置单元，其设置至少所选择的一个近似表面近似的近似区域; 以及异常区域检测器，其基于近似区域中的像素的像素值检测异常区域，并且在至少一个近似表面上对应于该像素的坐标值。