摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; and a ring having an inner circumferential wall and an outer circumferential wall. The inner circumferential wall is provided on the shroud and adjacent to an outer circumference of the cooling fan. The outer circumferential wall surrounds the inner circumferential wall, and an air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An air-flow-direction downstream side end of an outer circumferential edge of the cooling fan is positioned at a further downstream position in the air flow direction than the air-flow-direction downstream side end of the inner circumferential wall.
摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; and a ring having an inner circumferential wall and an outer circumferential wall. The inner circumferential wall is provided on the shroud and adjacent to an outer circumference of the cooling fan. The outer circumferential wall surrounds the inner circumferential wall, and an air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An air-flow-direction downstream side end of an outer circumferential edge of the cooling fan is positioned at a further downstream position in the air flow direction than the air-flow-direction downstream side end of the inner circumferential wall.
摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan; and an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of an outer circumferential edge of the cooling fan is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An angle between: an line connecting the air-flow-direction downstream side end of the inner circumferential wall to the air-flow-direction downstream side end of the outer circumferential wall in cross section along the air flow direction of the inner circumferential wall and the outer circumferential wall; and a line orthogonal to the air flow direction, is 9 degrees or more and 45 degrees or less.
摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan; and an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of an outer circumferential edge of the cooling fan is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An angle between: an line connecting the air-flow-direction downstream side end of the inner circumferential wall to the air-flow-direction downstream side end of the outer circumferential wall in cross section along the air flow direction of the inner circumferential wall and the outer circumferential wall; and a line orthogonal to the air flow direction, is 9 degrees or more and 45 degrees or less.
摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan so as to surround the cooling fan; an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. The cooling fan is rotatable within a space provided on a radially inner side of the inner circumferential wall. The air-flow-direction downstream side end of the outer circumferential wall is provided at a further upstream position in the air flow direction than an air-flow-direction downstream side end of the cooling fan.
摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan; and an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An air-flow-direction downstream side end of the cooling fan is positioned at a further downstream position than the air-flow-direction downstream side end of the inner circumferential wall. A ratio between a length of the outer circumferential wall and a length of the inner circumferential wall in the air flow direction is 1.07 or more and 1.81 or less, and a width between the outer circumferential wall and the inner circumferential wall is 15 mm or more and 55 mm or less.
摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan; and an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An air-flow-direction downstream side end of the cooling fan is positioned at a further downstream position than the air-flow-direction downstream side end of the inner circumferential wall. A ratio between a length of the outer circumferential wall and a length of the inner circumferential wall in the air flow direction is 1.07 or more and 1.81 or less, and a width between the outer circumferential wall and the inner circumferential wall is 15 mm or more and 55 mm or less.
摘要:
A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan so as to surround the cooling fan; an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. The cooling fan is rotatable within a space provided on a radially inner side of the inner circumferential wall. The air-flow-direction downstream side end of the outer circumferential wall is provided at a further upstream position in the air flow direction than an air-flow-direction downstream side end of the cooling fan.
摘要:
Insulative viscous fluid or gel material having low hardness is used for at least a first electricity insulating layer as an insulating layer of a static electricity chuck. Since a holding surface of the first electricity insulating layer is deformed in accordance with a back surface shape of a wafer, a substantially entire surface of the holding surface comes into intimate contact with the wafer uniformly. An exposing surface of the electricity insulating layer may be coated with a second electricity insulating layer having corrosion resistance. With this structure, adhesion between the back surface of the wafer and the static electricity chuck apparatus is enhanced, which reduces the contact thermal resistance, and it is possible to obtain a static electricity chuck apparatus which is capable of controlling temperature of a surface of the wafer with high precision and has high plasma resistance and durability.
摘要:
A cabin heating apparatus in accordance with the present invention is provided with a central duct (3) extended to one side of an operator's seat through a front-to-rear changeover damper (2) connected to an air conditioner unit (1), a rear duct (4) extended to the rear of the operator's seat through the front-to-rear changeover damper 2 and outlets (9) formed at an extreme end part of the rear duct (4). The cabin heating apparatus is further provided with a lower outlet (6) for supplying an air flow along a floor through an above-to-below changeover damper (5) connected to an extreme end part of the central duct (3), a front duct (7) rising from the above-to-below changeover damper 6 and a front outlet (8) provided at an extreme end part of the front duct (7). An appropriate air flow distribution ratio is set by these changeover dampers (2, 5).