摘要:
An improved integrated circuit and method for making it are described. The integrated circuit includes a shallow trench isolation structure formed adjacent to a well. A borderless contact makes electrical contact to a conductive region formed on the well and an insulating spacer is formed adjacent to a sidewall of the conductive region.
摘要:
An integrated circuit comprising a conductive region formed on a semiconductor substrate, a silicate glass layer formed on the conductive region, and an etch stop layer formed on the silicate glass layer. The integrated circuit also includes a borderless contact that is coupled to the conductive region.
摘要:
An integrated circuit comprising a conductive region formed on a semiconductor substrate, a silicate glass layer formed on the conductive region, and an etch stop layer formed on the silicate glass layer. The integrated circuit also includes a borderless contact that is coupled to the conductive region.
摘要:
A memory module can include a data buffer having a data bus interface and a dynamic random access memory (DRAM) coupled to the data buffer. The memory module may also include a switch connected in parallel with the data buffer, wherein the switch can selectively bypass the data buffer. In one example, the memory module also includes a registered buffer having an address bus interface, where the switch may selectively bypass the data buffer based on a program signal obtained from an address bus via the address bus interface.
摘要:
A low dark current metal-semiconductor-metal photodetector has an active region for receiving photons and generating charge carriers in the form of holes and electrons in response to the photons and an isolation region for allowing electrical coupling to occur without increasing the dark current. The photodetector is a III-V ternary semiconductor having its active region defined by a via through a dielectric layer. A pair of electrodes has contact portions extending into contact with the active region and terminating on the isolation region. One electrode of the pair provides a high Schottky barrier to holes. The other electrode provides a high Schottky barrier for electrons
摘要:
A memory module can include a data buffer having a data bus interface and a dynamic random access memory (DRAM) coupled to the data buffer. The memory module may also include a switch connected in parallel with the data buffer, wherein the switch can selectively bypass the data buffer. In one example, the memory module also includes a registered buffer having an address bus interface, where the switch may selectively bypass the data buffer based on a program signal obtained from an address bus via the address bus interface.
摘要:
A memory module can include a data buffer having a data bus interface and a dynamic random access memory (DRAM) coupled to the data buffer. The memory module may also include a switch connected in parallel with the data buffer, wherein the switch can selectively bypass the data buffer. In one example, the memory module also includes a registered buffer having an address bus interface, where the switch may selectively bypass the data buffer based on a program signal obtained from an address bus via the address bus interface.