公开(公告)号：US20040121606A1

公开(公告)日：2004-06-24

申请号：US10329081

申请日：2002-12-23

Applicant: Motorola, Inc.

Inventor： Glenn D. Raskin ,  George W. Marlin ,  Douglas G. Mitchell

IPC: H01L021/311

CPC classification number: H01L24/05 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2223/6672 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11901 ,  H01L2224/11902 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A structure and method for achieving a flip-chip semiconductor device having plated copper inductors (4), transformers (16), interconnect, and power busing that is electrically superior, lower cost, and provides for higher quality inductors as well as lower losses for on-chip transformers. Providing a solder dam (8, 24, 28) enables the fabrication of flip-chip solder bumps directly on to inductors and transformers.

Abstract translation: 一种用于实现具有电镀铜电感器（4），变压器（16），互连和功率集成的倒装芯片半导体器件的结构和方法，其电性优良，成本更低，并且提供更高质量的电感器以及更低损耗 片上变压器。 提供焊料坝（8,24,28）可以将倒装芯片焊料凸块直接制造到电感器和变压器上。