公开(公告)号：US20100327699A1

公开(公告)日：2010-12-30

申请号：US12865905

申请日：2008-02-05

申请人： Muhammed Hassanali ,  Carl Salupo ,  Steve Keverline ,  Fred M. Kimock

发明人： Muhammed Hassanali ,  Carl Salupo ,  Steve Keverline ,  Fred M. Kimock

IPC分类号： H01L41/053 ,  C08L79/08 ,  B05D5/12

CPC分类号： C04B41/52 ,  C04B41/009 ,  C04B41/90 ,  C04B2111/00844 ,  H01L41/0533 ,  H01L41/23 ,  H01L41/338 ,  C04B41/51 ,  C04B41/4574 ,  C04B41/488 ,  C04B35/00 ,  C04B35/491

摘要： Various embodiments of the present invention relate to an encapsulated ceramic element coated with polymer material applied precisely to the element edges that are exposed during dicing. Methods of applying the polymer, as well as specific polymers that are particularly useful are disclosed. For example, the polymer material may be applied using precise application methods such as ink-jet printing to direct-write the material precisely where specifically desired. Another method described in the use of photolithographic methods. Additionally, the inventors have identified polyimide as a particularly useful polymer material in connection with certain aspects.

摘要翻译： 本发明的各种实施方案涉及涂覆有聚合物材料的封装陶瓷元件，其精确地应用于在切割期间暴露的元件边缘。 公开了施加聚合物的方法以及特别有用的特定聚合物。 例如，聚合物材料可以使用诸如喷墨印刷之类的精确施加方法来将材料精确地直接写入特定期望的材料。 使用光刻法描述的另一种方法。 此外，本发明人已经将聚酰亚胺鉴定为与某些方面有关的特别有用的聚合物材料。