公开(公告)号：US11866379B2

公开(公告)日：2024-01-09

申请号：US17401545

申请日：2021-08-13

申请人： Raytheon Technologies Corporation

发明人： Xuan Liu ,  James T. Beals ,  Xia Tang ,  Richard Wesley Jackson ,  William J. Joost

IPC分类号： C04B41/51 ,  C04B41/45 ,  C04B35/78 ,  C04B41/50 ,  C04B41/52 ,  C04B41/90

CPC分类号： C04B41/4545 ,  C04B35/78 ,  C04B41/4527 ,  C04B41/4582 ,  C04B41/5024 ,  C04B41/5042 ,  C04B41/5144 ,  C04B41/526 ,  C04B41/90

摘要： A method for coating a substrate includes spraying a combination of powders. The combination of powders includes: Hf0.5Si0.5O2; Zr0.5Si0.5O2; and, optionally, at least one of HfO2 and ZrO2. A molar ratio of said Hf0.5Si0.5O2 and HfO2 combined to said Zr0.5Si0.5O2 and ZrO2 combined is from 2:1 to 4:1. A molar ratio of said Hf0.5Si0.5O2 to said HfO2 is at least 1:3.

公开(公告)号：US20170239715A1

公开(公告)日：2017-08-24

申请号：US15328723

申请日：2015-07-24

申请人： DENKA COMPANY LIMITED

发明人： Takeshi MIYAKAWA ,  Hideki HIROTSURU

IPC分类号： B22D19/14 ,  B22D21/00 ,  C04B37/00 ,  B32B5/24 ,  B32B5/30 ,  B22D18/02 ,  C22C21/02

CPC分类号： B22D19/14 ,  B22D18/02 ,  B22D21/007 ,  B32B5/24 ,  B32B5/30 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/025 ,  B32B2260/04 ,  B32B2262/105 ,  B32B2264/107 ,  B32B2307/302 ,  B32B2307/584 ,  B32B2311/24 ,  B32B2315/02 ,  B32B2605/00 ,  C04B37/001 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  C04B2237/365 ,  C04B2237/38 ,  C04B2237/61 ,  C04B2237/704 ,  C22C21/02 ,  C22C47/12 ,  C22C49/06 ,  C22C49/14 ,  C04B35/565 ,  C04B38/00 ,  C04B14/4625 ,  C04B41/4501 ,  C04B41/4582 ,  C04B41/4523 ,  C04B41/5155

摘要： A composite production method includes impregnating a plate-shaped porous inorganic structure and a fibrous inorganic material with a metal while the fibrous inorganic material is arranged to be adjacent to the porous inorganic structure. In the composite structure, first and second phases are adjacent to each other by using a porous inorganic structure having a porous silicon carbide ceramic sintered body and the fibrous inorganic material, the first phase being a phase in which the porous silicon carbide ceramic sintered body is impregnated with the metal, the second phase being a phase in which the fibrous inorganic material is impregnated with the metal, a percentage of the porous silicon carbide ceramic sintered body in the first phase is 50 to 80 volume percent, and a percentage of the fibrous inorganic material in the second phase is 3 to 20 volume percent. A composite is produced by the method.

公开(公告)号：US20160067996A1

公开(公告)日：2016-03-10

申请号：US14943808

申请日：2015-11-17

申请人： BYD COMPANY LIMITED

发明人： Qiang XU ,  Xinping LIN

IPC分类号： B41M5/26 ,  B41M5/24 ,  C23C14/35

CPC分类号： B41M5/262 ,  B41M5/24 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/80 ,  C23C14/35 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/38 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/027 ,  C04B35/10 ,  C04B35/48 ,  C04B41/4529 ,  C04B41/455 ,  C04B41/5049 ,  C04B41/5042 ,  C04B41/505 ,  C04B41/0036 ,  C04B41/4541 ,  C04B41/5127 ,  C04B41/5144 ,  C04B41/4564 ,  C04B41/522

摘要： Embodiments of the present disclosure are directed to a method for forming a pattern on a surface of an insulating substrate and/or a ceramic article. The method comprises: forming a film on at least one surface of the insulating substrate, a material of the film comprising at least one of ZnO, SnO2, TiO2, or a combination thereof; and irradiating at least a part of the film by an energy beam to form the pattern in the film.

摘要翻译： 本公开的实施例涉及在绝缘基板和/或陶瓷制品的表面上形成图案的方法。 所述方法包括：在所述绝缘基板的至少一个表面上形成膜，所述膜的材料包含ZnO，SnO 2，TiO 2或其组合中的至少一种; 以及通过能量束照射所述膜的至少一部分以在所述膜中形成图案。

公开(公告)号：US20150079297A1

公开(公告)日：2015-03-19

申请号：US14390920

申请日：2013-04-05

申请人： SNECMA ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE ,  UNIVERSITE DE BORDEAUX 1 ,  INSTITUT POLYTECHNIQUE DE BORDEAUX

发明人： Jean-Michel Patrick, Maurice Franchet ,  Gilles Charles, Casimir Klein ,  Gerald Sanchez ,  Yann Le Petitcorps ,  Eric Arquis ,  Delphine Vermaut

IPC分类号： C04B41/45 ,  C23C2/26 ,  C04B35/565 ,  C23C2/04 ,  C04B41/90 ,  C04B41/88

CPC分类号： C04B41/4523 ,  C04B35/565 ,  C04B35/62863 ,  C04B35/62873 ,  C04B35/62876 ,  C04B35/62894 ,  C04B35/62897 ,  C04B41/009 ,  C04B41/4584 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  C04B2111/00922 ,  C04B2235/5244 ,  C04B2235/5248 ,  C22C47/04 ,  C22C49/14 ,  C23C2/003 ,  C23C2/02 ,  C23C2/04 ,  C23C2/26 ,  C23C2/38 ,  C04B41/5001 ,  C04B41/4558 ,  C04B41/5061 ,  C04B41/5133 ,  C04B14/4693

摘要： A method of depositing a coating of a first metal alloy on a fiber extending in a main direction, including: a) heating a first mass of a first metal alloy above its melting temperature; and b) moving the fiber through the liquid first mass to be covered by a coating of a non-zero thickness over the entire periphery of the fiber; and prior to a): i) providing a second mass of a second metal alloy having a higher melting temperature than the first alloy; j) heating the second mass to above its melting temperature to be in its liquid state and then moving the fiber through the second alloy such that the second alloy is taken up under visco-capillary conditions and the fiber becomes covered over a portion by a coating of the second alloy of non-zero thickness; and k) cooling the second coating until it becomes solid.

摘要翻译： 一种将第一金属合金涂层沉积在沿主要方向延伸的纤维上的方法，包括：a）将第一金属合金的第一质量加热到其熔融温度以上; 以及b）将纤维移动通过在纤维的整个周边上由非零厚度的涂层覆盖的液体第一物质; 并且在a）之前：i）提供具有比所述第一合金更高的熔化温度的第二金属合金的第二质量; j）将第二物质加热到其熔融温度以上以处于其液态，然后将纤维移动通过第二合金，使得第二合金在粘度 - 毛细管条件下被吸收，并且纤维被覆盖在一部分上 的非零厚度的第二合金; 和k）冷却第二涂层，直到其变成固体。

公开(公告)号：US08890189B2

公开(公告)日：2014-11-18

申请号：US13387606

申请日：2010-07-29

申请人： Hideki Hirotsuru ,  Yosuke Ishihara ,  Hideo Tsukamoto

发明人： Hideki Hirotsuru ,  Yosuke Ishihara ,  Hideo Tsukamoto

IPC分类号： H01L33/60 ,  C04B41/52 ,  C04B35/565 ,  C22C29/06 ,  C22C26/00 ,  C22C1/10 ,  C04B41/00 ,  C04B35/52 ,  C22C29/16 ,  C04B41/90 ,  H01L33/00 ,  H01L33/64

CPC分类号： C04B35/565 ,  B22F2998/10 ,  C04B35/52 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2235/3826 ,  C04B2235/427 ,  C04B2235/5427 ,  C04B2235/5436 ,  C04B2235/5472 ,  C22C1/1036 ,  C22C1/1094 ,  C22C26/00 ,  C22C29/065 ,  C22C29/16 ,  H01L33/0079 ,  H01L33/60 ,  H01L33/641 ,  H01L2924/0002 ,  Y10T428/23 ,  C04B38/00 ,  C04B35/581 ,  C04B35/584 ,  C04B35/185 ,  C04B41/4523 ,  C04B41/5155 ,  C04B41/4572 ,  C04B41/5031 ,  C04B41/4529 ,  C04B41/4574 ,  C04B41/5111 ,  C04B41/5144 ,  C04B41/522 ,  C04B41/4564 ,  C04B41/5116 ,  B22F3/04 ,  C23C16/00 ,  C25D7/12 ,  H01L2924/00

摘要： Provided is a wafer for LED mounting having a small difference in thermal expansion coefficient from an LED and having excellent heat conductivity, a method for manufacturing the wafer for LED mounting, and an LED-mounted structure manufactured by using the wafer for LED mounting. The wafer for LED mounting (6) is constituted of a metal infiltrated ceramic composite (61) and a protective layer (62) that is formed therearound. The metal infiltrated ceramic composite (61) preferably has a thin metal layer (63) on a surface thereof. The method for manufacturing the wafer is characterized by comprising filling at least one selected from the group consisted of porous ceramic bodies, ceramic powder compacts and ceramic powders into a tubular body made of metal or ceramic, then impregnating a metal into the void of at least one selected from the group consisted of porous ceramic bodies, ceramic powder compacts and ceramic powders, and thereafter performing a process.

摘要翻译： 提供了一种用于LED安装的晶片，其具有与LED相当的热膨胀系数差并且具有优异的导热性，用于制造用于LED安装的晶片的方法，以及通过使用用于LED安装的晶片制造的LED安装结构。 用于LED安装（6）的晶片由金属渗透陶瓷复合材料（61）和形成在其周围的保护层（62）构成。 金属渗透性陶瓷复合体（61）的表面优选具有薄的金属层（63）。 制造晶片的方法的特征在于，将从由多孔陶瓷体，陶瓷粉末压块和陶瓷粉末组成的组中选出的至少一种填充到由金属或陶瓷制成的管状体中，然后将金属浸渍到至少 选自由多孔陶瓷体，陶瓷粉末压块和陶瓷粉末组成的组，然后进行处理。

公开(公告)号：US20140284088A1

公开(公告)日：2014-09-25

申请号：US14354600

申请日：2012-09-28

申请人： KYOCERA Corporation

发明人： Kiyotaka Nakamura ,  Yoshio Ohashi ,  Kunihide Shikata

IPC分类号： H05K1/09

CPC分类号： H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

摘要： A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.

摘要翻译： 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主表面接触且包含玻璃的第一区域12a 第一区域12a和第二区域12b位于第一区域12a上并且不包含玻璃成分，第一区域12a的厚度为金属布线层12的厚度的35％以上且70％以下， 并且第一区域12a中的平均晶粒尺寸小于第二区域12b中的平均晶粒尺寸。

公开(公告)号：US08609206B2

公开(公告)日：2013-12-17

申请号：US12990595

申请日：2009-04-30

申请人： Maxim Seleznev

发明人： Maxim Seleznev

IPC分类号： C23C14/14 ,  C23C16/00 ,  B05D5/06 ,  B05B3/00 ,  H05B6/02 ,  F27B14/00 ,  C21D5/00 ,  C21D9/00

CPC分类号： C04B37/026 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  C04B2235/6565 ,  C04B2235/96 ,  C04B2237/124 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/706 ,  H01L21/4846 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  C04B41/4519 ,  C04B41/4556 ,  C04B41/5031 ,  C04B41/0072 ,  C04B41/4529 ,  C04B41/4572 ,  C04B41/5127 ,  C04B41/4539 ,  C04B35/581 ,  H01L2924/00

摘要： Surface metallization technology for ceramic substrates is disclosed herein. It makes use of a known phenomenon that many metal—metal oxide alloys in liquid state readily wet an oxide ceramic surface and strongly bond to it upon solidification. To achieve high adhesion strength of a metallization to ceramic, a discrete metallization layer consisting of metal droplets bonded to ceramic surface using metal—metal oxide bonding process is produced first. Next, a continuous metal layer is deposited on top of the discrete layer and bonded to it using a sintering process. As a result a strongly adhering, glass-free metallization layer directly bonded to ceramic surface is produced. In particular, the process can be successfully used to metalize aluminum nitride ceramic with high thermal and electrical conductivity copper metal.

摘要翻译： 本文公开了陶瓷基板的表面金属化技术。 它利用已知的现象，许多液态金属 - 金属氧化物合金容易地润湿氧化物陶瓷表面，并在凝固时与其牢固地结合。 为了实现金属化对陶瓷的高粘合强度，首先制造了使用金属 - 金属氧化物结合工艺由金属液滴结合到陶瓷表面上的离散金属化层。 接下来，连续金属层沉积在离散层的顶部上并且使用烧结工艺与其结合。 结果，产生直接粘合到陶瓷表面上的强烈粘附的无玻璃的金属化层。 特别地，该方法可以成功地用于金属化具有高导热和导电性的铜金属的氮化铝陶瓷。

公开(公告)号：US20130199361A1

公开(公告)日：2013-08-08

申请号：US13878410

申请日：2011-10-06

申请人： Sorin Lenz ,  Christian Mahringer ,  Günter Rübig ,  Alexander Schreiner

发明人： Sorin Lenz ,  Christian Mahringer ,  Günter Rübig ,  Alexander Schreiner

IPC分类号： A61K6/02 ,  F41H5/02

CPC分类号： A61K6/0205 ,  A61K6/0235 ,  A61K6/024 ,  A61L31/022 ,  A61L31/026 ,  A61L2400/18 ,  C04B35/4885 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00836 ,  C04B2235/3232 ,  C04B2235/404 ,  C04B2235/614 ,  C04B2235/75 ,  C23C14/48 ,  F41H5/02 ,  F41H5/0421 ,  Y10T428/1259 ,  Y10T428/26 ,  C04B41/0054 ,  C04B41/0072 ,  C04B41/4515 ,  C04B41/4529 ,  C04B41/4556 ,  C04B41/5041 ,  C04B41/5133 ,  C04B35/10 ,  C04B35/119 ,  C04B35/48

摘要： Monolithic ceramic bodies that have a mixed-oxide marginal region and a metallic surface, where the ceramic body includes an oxide of a first metal (I), while the mixed-oxide marginal region includes the oxide of the first metal (I) and the oxide of a further metal (II) having a high affinity for oxygen, and the metallic surface includes the further metal (II). The mixed oxide marginal region includes a continuous concentration gradient of the first metal (I), from 100% in the core to 0% in the transitional region to the metallic surface of the ceramic body, and a continuous concentration gradient of the further metal (II), starting from 0% in the core to 100% in the transitional region to the metallic surface of the ceramic body, where the oxygen concentration in the mixed-oxide marginal region remains constant, and the monolithic structure of the ceramic body has no phase boundaries.

摘要翻译： 具有混合氧化物边缘区域和金属表面的单晶陶瓷体，其中陶瓷体包括第一金属（I）的氧化物，而混合氧化物边缘区域包括第一金属（I）的氧化物和 具有对氧的高亲和力的另外的金属（II）的氧化物，并且金属表面包括另外的金属（II）。 混合氧化物边缘区域包括第一金属（I）的连续浓度梯度，从核心中的100％到过渡区域中的0％到陶瓷体的金属表面，以及连续浓度梯度的另外的金属（ II），从过渡区域中的芯的0％开始到陶瓷体的金属表面，其中混合氧化物边界区域中的氧浓度保持恒定，并且陶瓷体的整体结构没有 相边界。

公开(公告)号：US20130177708A1

公开(公告)日：2013-07-11

申请号：US13828360

申请日：2013-03-14

申请人： Jeffrey A. Steinfeldt ,  Carl Jojola ,  Bruce Johnson

发明人： Jeffrey A. Steinfeldt ,  Carl Jojola ,  Bruce Johnson

IPC分类号： C04B41/45

CPC分类号： C04B41/4505 ,  C04B41/90 ,  H01L41/0533 ,  H01L41/1876 ,  H01L41/23 ,  H01L41/338 ,  Y10T428/23 ,  Y10T428/232

摘要： A PZT (lead zirconate titanate) element including one or more outside surfaces including a layer of encapsulation and metallization material and the method of making the same including at least the steps of providing a wafer of ceramic material including a base and one or more walls defining one or more recesses in the wafer which are filled with an encapsulation material. The encapsulation material is then cured and a layer of metallization is applied to one or more of the outside surfaces of the wafer and encapsulation material. Cuts are then made through the layer of metallization and cured encapsulation material to divide the wafer into a plurality of individual and separate ceramic elements with one or more surfaces including a layer of metallization and encapsulation.

公开(公告)号：US08304797B2

公开(公告)日：2012-11-06

申请号：US12846218

申请日：2010-07-29

申请人： Miguel Galvez ,  Victor Perez ,  Kenneth Grossman ,  Mary Ann Johnson

发明人： Miguel Galvez ,  Victor Perez ,  Kenneth Grossman ,  Mary Ann Johnson

IPC分类号： H01L33/00 ,  F21V21/00

CPC分类号： H01L25/0753 ,  B28B1/24 ,  B28B7/164 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  F21K9/20 ,  F21K9/64 ,  F21V3/08 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2224/45099 ,  C04B35/10 ,  C04B35/581 ,  C04B41/0072 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5133 ,  C04B41/5116

摘要： An LED light source (10) comprises a ceramic substrate (20) with first and second opposed surfaces (30, 40). Pockets (50) are formed in the first surface (30) and each of the pockets includes a bottom (60) and a sidewall or sidewalls (70). A final electrical contact (105) comprised of a first electrically conductive material (57) with a coating of a second electrically conductive material (100) thereover is positioned in each of the pockets (50). An LED (110) is positioned in each of the pockets (50) and affixed to the electrical contact (105) and electrical connections (120), preferably in form of wire bonds, join the LEDs, the electrical connections (120) extending from a first LED (110) to an adjacent electrical contact (105). The ceramic substrate (20) is formed by injection molding a ceramic material and binder to form a green substrate (12) and subsequently sintering the green substrate to form the substrate (20). An LED light (150) can be formed from the LED light source (10) by adding a dome (150) formed of a ceramic material containing therein a homogeneous dispersion of a phosphor material capable of emitting light when excited by the light emitted from the operating LEDs (110).

摘要翻译： LED光源（10）包括具有第一和第二相对表面（30,40）的陶瓷基板（20）。 口袋（50）形成在第一表面（30）中，并且每个袋包括底部（60）和侧壁​​或侧壁（70）。 由第一导电材料（57）和其上的第二导电材料（100）的涂层构成的最终电触点（105）位于每个凹穴（50）中。 LED（110）定位在每个凹穴（50）中并固定到电接触（105），并且电连接（120）优选地以线接合的形式连接LED，电连接（120）从 第一LED（110）连接到相邻的电触头（105）。 陶瓷基板（20）通过注射成型陶瓷材料和粘合剂形成绿色基板（12）并随后烧结生坯基板以形成基板（20）而形成。 通过添加由陶瓷材料形成的圆顶（150），可以由LED光源（10）形成LED灯（150），所述圆顶（150）包含能够发射光的荧光体材料的均匀分散体 操作LED（110）。