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公开(公告)号：US20230101917A1
公开(公告)日：2023-03-30
申请号：US18077251
申请日：2022-12-08
发明人： Atsushi KISHIMOTO , Takumi MASAKI , Masato INAOKA , Takashi SHIMIZU , Hiroshi NISHIKAWA , Takahiro TAKADA
摘要： A multilayer circuit board includes a board body including insulator layers stacked upon each other, a first land pattern at the board body to mount a passive component, a second land pattern at the board body to mount an active component, and a heat-dissipation layer between the insulator layers and extending along main surfaces of the insulator layers. The heat-dissipation layer includes a hole extending therethrough in a stacking direction of the insulator layers. In a plan view from the stacking direction, an outer edge of the hole of the heat-dissipation layer is on an outer side of the first land pattern, or overlaps the first land pattern.
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公开(公告)号：US20210337663A1
公开(公告)日：2021-10-28
申请号：US17368905
申请日：2021-07-07
摘要： A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.
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公开(公告)号：US20230119903A1
公开(公告)日：2023-04-20
申请号：US18085607
申请日：2022-12-21
发明人： Takumi MASAKI , Atsushi KISHIMOTO , Masato INAOKA , Takashi SHIMIZU , Hiroshi NISHIKAWA , Takahiro TAKADA
摘要： A multilayer circuit board includes a resin body, signal wires, ground conductors, and a via conductor. The resin body includes resin layers made from thermoplastic resin. The signal wires and the ground conductors are each on or inside the resin body. The via conductor connects corresponding ones of the signal wires to each other or corresponding ones of the ground conductors to each other. The ground conductors include a counter ground conductor on or inside the resin body, facing a signal wire in a stacking direction in which the resin layers are stacked, and overlapping the signal wire in plan view in the stacking direction. The counter ground conductor is made of a graphite sheet including main surfaces and end surfaces covered with a conductor layer. The graphite sheet extends over rigid and flexible portions in plan view in the stacking direction.
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公开(公告)号：US20190271511A1
公开(公告)日：2019-09-05
申请号：US16414802
申请日：2019-05-17
发明人： Atsushi KISHIMOTO , Norikazu KUME , Haruhiko IKEDA , Takuo WAKAOKA , Osamu CHIKAGAWA , Tatsuhiro NUMOTO
IPC分类号： F28D15/04
摘要： A vapor chamber includes a housing including first and second sheets that face each other and that include respective outer edge portions joined to each other, supports that support the first and second sheets from inside and that are disposed therebetween, and a hydraulic fluid enclosed in the housing. The first and second sheets do not include an angled portion having an angle of about 90° or less between a joint and a support nearest to the joint. The expression 0.02≤b/a≤0.3 is satisfied, where a is a distance from an outer edge of the outermost support to an inner edge of the joint between the first and second sheets, and b is a distance between the first and second sheets at the outer edge of the outermost support.
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公开(公告)号：US20180010861A1
公开(公告)日：2018-01-11
申请号：US15712175
申请日：2017-09-22
发明人： Takuo WAKAOKA , Atsushi KISHIMOTO , Tadamasa MIURA
IPC分类号： F28D15/02 , F28F21/08 , H01L23/427 , F28D15/04 , F28D21/00
CPC分类号： F28D15/0233 , F28D15/02 , F28D15/04 , F28D15/046 , F28D2020/0013 , F28D2021/0028 , F28F21/081 , F28F2255/06 , H01L23/427
摘要： A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.
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