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公开(公告)号：US20160064124A1
公开(公告)日：2016-03-03
申请号：US14937969
申请日：2015-11-11
发明人： Hiroshi IKEDA , Tadamasa MIURA , Kiyohiro KOTO
CPC分类号： H01C7/006 , H01C7/021 , H01C7/041 , H01C7/1013
摘要： An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage.
摘要翻译： 金属层不可能从基板剥离的电子部件包括绝缘陶瓷基板，扩散接合到基板的陶瓷层，包括与第一主体相对的第一主表面和第二主表面的金属层 表面，第一主表面扩散粘合到陶瓷层，以及特征层，其扩散结合到金属层的第二主表面并由陶瓷材料制成，其中特征层相对于环境的电阻值变化 温度或施加电压。
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公开(公告)号：US20130328154A1
公开(公告)日：2013-12-12
申请号：US13966514
申请日：2013-08-14
发明人： Tadamasa MIURA
CPC分类号： H01L35/02 , H01C1/012 , H01C1/1413 , H01C1/142 , H01C7/008 , H01C7/04 , H01C7/042 , H01C17/06533 , H01L35/34
摘要： A thermistor includes a metal substrate, a semiconductor ceramic layer on the metal substrate, and a pair of split electrodes on the semiconductor layer. The semiconductor ceramic layer is formed by a solid-phase method. The metal substrate includes ceramic particles and is not interrupted in the direction of thickness by the ceramic particles or a pillar defined by a chain of the ceramic particles. Preferably, the metal substrate and the ceramic layer of the thermistor have a thickness of about 10 μm to about 80 μm and about 1 μm to about 10 μm, respectively.
摘要翻译： 热敏电阻包括金属基板，金属基板上的半导体陶瓷层和半导体层上的一对分裂电极。 半导体陶瓷层通过固相法形成。 金属基材包括陶瓷颗粒，并且不会被陶瓷颗粒或由陶瓷颗粒链形成的柱子在厚度方向上中断。 优选地，热敏电阻的金属基底和陶瓷层的厚度分别为约10μm至约80μm，约1μm至约10μm。
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公开(公告)号：US20160270252A1
公开(公告)日：2016-09-15
申请号：US15163222
申请日：2016-05-24
IPC分类号： H05K7/20
摘要： Provided is an electronic apparatus that makes it possible to improve a heat transfer property from a heat generating element to a heat storage material. The electronic apparatus is provided with a heat generating element and a heat storage device for storing heat generated by the heat generating element. The heat storage device includes a reaction chamber containing a heat storage material for absorbing the heat generated by the heat generating element. The reaction chamber is defined by a first surface, a second surface opposed to the first surface, and a plurality of side surfaces connecting the first surface with the second surface. In the reaction chamber, a thermal conductivity of a peripheral part is smaller than a thermal conductivity of a central part of the reaction chamber.
摘要翻译： 提供一种电子设备，其可以提高从发热元件到蓄热材料的传热性能。 电子设备设置有用于存储由发热元件产生的热的发热元件和蓄热装置。 蓄热装置包括含有用于吸收由发热元件产生的热的蓄热材料的反应室。 反应室由第一表面，与第一表面相对的第二表面和连接第一表面与第二表面的多个侧表面限定。 在反应室中，周边部分的热导率小于反应室中心部分的热导率。
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公开(公告)号：US20150144295A1
公开(公告)日：2015-05-28
申请号：US14612351
申请日：2015-02-03
CPC分类号： F28D20/003 , F25B17/08 , F28D15/0266 , F28D20/021 , G06F1/203 , G06F1/206 , H05K7/2029 , Y02A30/277 , Y02B30/62 , Y02E60/142
摘要： There is provided an electronic apparatus having a novel means capable of suppressing temperature rise of a heat generating element. The electronic apparatus (20), which includes a heat generating element, is provided with a device (or a chemical heat pump) (10) comprising: a reaction chamber (1) containing a chemical heat storage material showing an endothermic reaction in response to heat emitted by the heat generating element (11); a condensation/evaporation chamber (3) for condensing or evaporating a condensable component produced from the endothermic reaction of the chemical heat storage material; and a communication part (5) communicating the reaction chamber (1) with the condensation/evaporation chamber (3) such that the condensable component is movable between the reaction chamber (1) and the condensation/evaporation chamber (3).
摘要翻译： 提供了一种具有能够抑制发热元件的温度上升的新型装置的电子设备。 包括发热元件的电子设备（20）具有装置（或化学热泵）（10），该装置（10）包括：反应室（1），其包含化学蓄热材料，该化学蓄热材料响应于 由发热元件（11）发出的热量; 用于冷凝或蒸发由化学蓄热材料的吸热反应产生的可冷凝成分的冷凝/蒸发室（3）; 以及将反应室（1）与冷凝/蒸发室（3）连通的连通部（5），使得可冷凝部件能够在反应室（1）和冷凝/蒸发室（3）之间移动。
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公开(公告)号：US20180122537A1
公开(公告)日：2018-05-03
申请号：US15859786
申请日：2018-01-02
发明人： Satoru SENTOKU , Tadamasa MIURA
CPC分类号： H01C1/084 , G01K1/12 , G01K7/22 , H01C1/01 , H01C1/028 , H01C1/1406 , H01C1/1413 , H01C1/144 , H01C7/006 , H01C7/008 , H01C7/02 , H01C7/04
摘要： An electronic component includes a temperature sensor including a pair of electrodes, at least one metal block electrically connected to an electrode of the temperature sensor, an insulation portion in which the temperature sensor and the at least one metal block are embedded, and an external terminal electrically connected to the electrode of the temperature sensor. The at least one metal block includes a flat surface exposed from the insulation portion. The flat surface defines the external terminal.
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公开(公告)号：US20180010861A1
公开(公告)日：2018-01-11
申请号：US15712175
申请日：2017-09-22
发明人： Takuo WAKAOKA , Atsushi KISHIMOTO , Tadamasa MIURA
IPC分类号： F28D15/02 , F28F21/08 , H01L23/427 , F28D15/04 , F28D21/00
CPC分类号： F28D15/0233 , F28D15/02 , F28D15/04 , F28D15/046 , F28D2020/0013 , F28D2021/0028 , F28F21/081 , F28F2255/06 , H01L23/427
摘要： A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.
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公开(公告)号：US20160155546A1
公开(公告)日：2016-06-02
申请号：US15016852
申请日：2016-02-05
发明人： Tadamasa MIURA , Jun YANAGIHARA , Eisuke TASHIRO
CPC分类号： H01C7/008 , H01C1/1413 , H01C1/148 , H01C7/041
摘要： In an thermistor element, a main body includes a first thermistor section and a second thermistor section stacked on the first thermistor section. A first internal electrode and a second internal electrode vertically sandwich the first thermistor section. A second internal electrode and a third internal electrode vertically sandwich the second thermistor section. A temperature coefficient αTH1 of a portion between the first and second internal electrodes in the first thermistor section is different from a temperature coefficient αTH2 of a portion between the second and third electrodes in the second thermistor section.
摘要翻译： 在热敏电阻元件中，主体包括堆叠在第一热敏电阻部上的第一热敏电阻部和第二热敏电阻部。 第一内部电极和第二内部电极垂直夹着第一热敏电阻部分。 第二内部电极和第三内部电极垂直夹着第二热敏电阻部分。 第一热敏电阻部中的第一和第二内部电极之间的部分的温度系数αTH1与第二热敏电阻部中的第二和第三电极之间的部分的温度系数αTH2不同。
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公开(公告)号：US20130200989A1
公开(公告)日：2013-08-08
申请号：US13794852
申请日：2013-03-12
发明人： Tadamasa MIURA
IPC分类号： H01C7/00
摘要： A semiconductor ceramic element includes an element main body where a PTC section including a semiconductor ceramic which has PTC characteristics and an NTC section including a semiconductor ceramic which has NTC characteristics are integrated by co-firing while suppressing interdiffusion. The element main body is formed in such a way that a PTC substrate is first obtained by firing a semiconductor ceramic material to serve as the PTC section at a predetermined temperature, and a paste containing a semiconductor ceramic material to serve as the NTC section is then applied or printed on the PTC substrate, followed by co-firing at a temperature lower than the predetermined temperature.
摘要翻译： 半导体陶瓷元件包括元件主体，其中包括具有PTC特性的半导体陶瓷的PTC部分和包括具有NTC特性的半导体陶瓷的NTC部分通过共同烧制而被一体化，同时抑制相互扩散。 元件主体以这样的方式形成，首先通过在预定温度下烧制半导体陶瓷材料作为PTC部分而获得PTC基板，然后将含有作为NTC部分的半导体陶瓷材料的糊料 施加或印刷在PTC基板上，随后在低于预定温度的温度下共烧。
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公开(公告)号：US20170131156A1
公开(公告)日：2017-05-11
申请号：US15409691
申请日：2017-01-19
发明人： Tadamasa MIURA , Kazuto MIYAGAWA , Akihito NAITO
IPC分类号： G01K7/22
摘要： A temperature detector is configured to detect the temperature of a housing while in contact with the housing, and a spring pin is in contact with the temperature detector in a separable manner. Thus, at mounting of the temperature detecting device on an electronic device, it is possible to fix the temperature detector to the housing, and the spring pin to a circuit board of the electronic device. At disassembly of the electronic device, it is easy to separate the spring pin from the temperature detector by removing, from the housing, the spring pin together with the circuit board. At assembly of the electronic device, it is easy for the spring pin to contact the temperature detector by attaching, to the housing, the spring pin together with the circuit board.
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公开(公告)号：US20150211940A1
公开(公告)日：2015-07-30
申请号：US14683211
申请日：2015-04-10
发明人： Tadamasa MIURA , Shuichi KAWATA , Yuki YAMAMOTO
CPC分类号： G01K7/22 , H01C1/012 , H01C1/14 , H01C1/1406 , H01C1/1413 , H01C7/008 , H01C7/02 , H01C7/04 , H01M2/348 , H01M10/0525 , H01M10/486 , H01M2200/10
摘要： In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.
摘要翻译： 为了进一步提高应力耐受性，热敏电阻器件包括由树脂制成的第一基底构件，设置在金属基材上的热敏电阻薄膜和设置在热敏电阻薄膜上的第一和第二外部电极的热敏电阻元件，以及 第一引线电极和设置在第一基材的主表面上的第二引线电极，并连接到第一外部电极和第二外部电极。 金属基材和热敏电阻薄膜中的每一个在第一外部电极和第二外部电极之间发生偏转。
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