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公开(公告)号：US20230387048A1
公开(公告)日：2023-11-30
申请号：US18233459
申请日：2023-08-14
发明人： Hiroshi NISHIKAWA
CPC分类号： H01L23/66 , H04B1/40 , H01L25/00 , H01P1/15 , H01L2223/6661 , H01L2223/6644 , H01L25/16
摘要： An integrated circuit (IC) includes a first switch, a second switch, and an amplifier electrically connected between the first switch and the second switch. An RF signal path passes through first switch, the amplifier, and the second switch in this order. The IC includes an input terminal and an output terminal that are to be connected to each other between the first switch and the amplifier or between the amplifier and the second switch outside of the IC with a component connected therebetween. In a top view of the IC, a first region of the first switch, a second region of the amplifier, and a third region of the second switch are disposed on a straight line such that a virtual straight line connects any point of the first region, any point of the second region, and any point of the second region in this order.
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公开(公告)号：US20230101917A1
公开(公告)日：2023-03-30
申请号：US18077251
申请日：2022-12-08
发明人： Atsushi KISHIMOTO , Takumi MASAKI , Masato INAOKA , Takashi SHIMIZU , Hiroshi NISHIKAWA , Takahiro TAKADA
摘要： A multilayer circuit board includes a board body including insulator layers stacked upon each other, a first land pattern at the board body to mount a passive component, a second land pattern at the board body to mount an active component, and a heat-dissipation layer between the insulator layers and extending along main surfaces of the insulator layers. The heat-dissipation layer includes a hole extending therethrough in a stacking direction of the insulator layers. In a plan view from the stacking direction, an outer edge of the hole of the heat-dissipation layer is on an outer side of the first land pattern, or overlaps the first land pattern.
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公开(公告)号：US20220148986A1
公开(公告)日：2022-05-12
申请号：US17586940
申请日：2022-01-28
发明人： Hiroshi NISHIKAWA
摘要： An integrated circuit (IC) includes a first switch, a second switch, an amplifier electrically connected between the first switch and the second switch, and a base. The first switch, the second switch, and the amplifier are provided on the base. In a top view of the base, the amplifier is disposed between the first switch and the second switch.
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公开(公告)号：US20230188098A1
公开(公告)日：2023-06-15
申请号：US18166132
申请日：2023-02-08
发明人： Hiroshi NISHIKAWA
CPC分类号： H03F3/187 , H03F3/2178
摘要： A semiconductor IC includes a first radio-frequency element (e.g., an inductor in a low-noise amplifier), a second radio-frequency element (e.g., an inductor in a low-noise amplifier), a first via conductor (e.g., a via conductor that is placed between the first radio-frequency element and the second radio-frequency element and that is connected to a ground potential.
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公开(公告)号：US20210266018A1
公开(公告)日：2021-08-26
申请号：US17179401
申请日：2021-02-19
发明人： Hiroshi NISHIKAWA
摘要： A radio frequency module includes: a module substrate including a first principal surface and a second principal surface opposite to each other; a plurality of external-connection terminals (e.g., a plurality of post electrodes) disposed on the second principal surface; a semiconductor component disposed on the second principal surface and including a first low-noise amplifier and/or a second low-noise amplifier; and a metal member set at a ground potential and covering at least part of a surface of the semiconductor component, the surface being opposite to a surface that faces the module substrate.
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公开(公告)号：US20210136186A1
公开(公告)日：2021-05-06
申请号：US17078107
申请日：2020-10-23
摘要： A radio frequency module includes: a module substrate that includes a principal surface on which external-connection terminals are disposed; a power amplifier that is disposed on the principal surface of the module substrate and amplifies a radio frequency transmission signal; and a heat dissipator that dissipates heat of the power amplifier. The heat dissipator includes: a heat dissipation plate that covers a surface of the power amplifier which is opposite to a surface that faces the module substrate; and at least a first leg that extends from the heat dissipation portion toward the principal surface of the module substrate.
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公开(公告)号：US20130293432A1
公开(公告)日：2013-11-07
申请号：US13937026
申请日：2013-07-08
CPC分类号： H01Q1/50 , B81B7/02 , H01Q5/321 , H01Q5/335 , H04B1/0458 , H04W52/0209 , Y02D70/1262 , Y02D70/40
摘要： Provided is a MEMS module that includes a MEMS element having a first capacitor electrode that can be displaced, a second capacitor electrode that opposes the first capacitor electrode, and driving electrodes that cause the first capacitor electrode to be displaced. The driving electrodes are connected to a control unit that applies a driving voltage to the driving electrodes and monitor terminals for detecting power. Thus, an element for monitoring power is not needed and a MEMS module, a variable reactance circuit and an antenna device are provided that are capable of realizing smaller size and lower loss.
摘要翻译： 提供了一种MEMS模块，其包括具有可移位的第一电容器电极的MEMS元件，与第一电容器电极相对的第二电容器电极以及使第一电容器电极移位的驱动电极。 驱动电极连接到向驱动电极施加驱动电压的控制单元和用于检测电力的监视端子。 因此，不需要用于监视功率的元件，并且提供能够实现更小尺寸和更低损耗的MEMS模块，可变电抗电路和天线装置。
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公开(公告)号：US20230119903A1
公开(公告)日：2023-04-20
申请号：US18085607
申请日：2022-12-21
发明人： Takumi MASAKI , Atsushi KISHIMOTO , Masato INAOKA , Takashi SHIMIZU , Hiroshi NISHIKAWA , Takahiro TAKADA
摘要： A multilayer circuit board includes a resin body, signal wires, ground conductors, and a via conductor. The resin body includes resin layers made from thermoplastic resin. The signal wires and the ground conductors are each on or inside the resin body. The via conductor connects corresponding ones of the signal wires to each other or corresponding ones of the ground conductors to each other. The ground conductors include a counter ground conductor on or inside the resin body, facing a signal wire in a stacking direction in which the resin layers are stacked, and overlapping the signal wire in plan view in the stacking direction. The counter ground conductor is made of a graphite sheet including main surfaces and end surfaces covered with a conductor layer. The graphite sheet extends over rigid and flexible portions in plan view in the stacking direction.
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公开(公告)号：US20200228074A1
公开(公告)日：2020-07-16
申请号：US16832295
申请日：2020-03-27
摘要： A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.
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公开(公告)号：US20230395536A1
公开(公告)日：2023-12-07
申请号：US18451857
申请日：2023-08-18
发明人： Naohide TOMITA , Hiroshi NISHIKAWA
IPC分类号： H01L23/66 , H01L23/498 , H01L23/538 , H01L23/522 , H01L23/48 , H01L23/00
CPC分类号： H01L23/66 , H01L23/49805 , H01L23/49838 , H01L23/5389 , H01L23/5226 , H01L23/481 , H01L24/16 , H01L24/08 , H01L24/09 , H01L2223/6677 , H01L2223/6616 , H01L2223/6655 , H01L2224/16145 , H01L2224/08112 , H01L2224/0903 , H01L2224/09177
摘要： A radio frequency module includes a mounting substrate including a first main surface and a second main surface opposite to the first main surface. A first electronic component is disposed on the first main surface of the mounting substrate. A second electronic component is disposed on the second main surface of the mounting substrate. A plurality of connection terminals are disposed on the second main surface of the mounting substrate. A wiring layer faces the second main surface of the mounting substrate. The wiring layer includes a plurality of external connection electrodes, each connected to at least one of the second electronic component and the plurality of connection terminals. At least one of the plurality of external connection electrodes overlaps the second electronic component when viewed in plan in a thickness direction of the substrate.
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