公开(公告)号：US20180141321A1

公开(公告)日：2018-05-24

申请号：US15874021

申请日：2018-01-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keisuke IKENO ,  Shigeru TAGO ,  Hirohumi SHINAGAWA ,  Kuniaki YOSUI ,  Yuki ITO

IPC: B32B37/06 ,  B32B37/10 ,  H05K3/46

CPC classification number: B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B2307/202 ,  B32B2307/206 ,  C09K19/38 ,  H01L23/5383 ,  H05K3/46 ,  H05K2201/0129

Abstract: A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.