-
公开(公告)号：US20180141321A1
公开(公告)日：2018-05-24
申请号：US15874021
申请日：2018-01-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keisuke IKENO , Shigeru TAGO , Hirohumi SHINAGAWA , Kuniaki YOSUI , Yuki ITO
CPC classification number: B32B37/06 , B32B37/10 , B32B37/182 , B32B2307/202 , B32B2307/206 , C09K19/38 , H01L23/5383 , H05K3/46 , H05K2201/0129
Abstract: A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.
-
公开(公告)号：US20190057800A1
公开(公告)日：2019-02-21
申请号：US16166227
申请日：2018-10-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuki ITO
Abstract: A multilayer substrate includes an element assembly including a second insulating layer and a first insulating layer arranged in this order from a first side to a second side with respect to a layer stacking direction, a first conductor layer on the first side of the first insulating layer and including a plated layer, and a second conductor layer on the first side of the second insulating layer. The first conductor layer includes a first connection portion and a first circuit portion, and the second conductor layer includes a second connection portion and a second circuit portion. When viewed from the layer stacking direction, the first circuit portion includes an overlapping portion which overlaps the second circuit portion. A portion of the first connection portion connected to the second connection portion has a maximum thickness greater than a maximum thickness of the overlapping portion.
-
3.发明申请公开(公告)号：US20180213653A1
公开(公告)日：2018-07-26
申请号：US15928175
申请日：2018-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru TAGO , Kuniaki YOSUI , Yuki ITO
CPC classification number: H05K3/32 , H05K1/0271 , H05K1/111 , H05K1/116 , H05K1/181 , H05K3/0011 , H05K3/3436 , H05K3/4069 , H05K3/46 , H05K3/4632 , H05K2201/0129 , H05K2201/0141 , H05K2201/10734 , H05K2203/0285
Abstract: A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view.
-
公开(公告)号：US20160330843A1
公开(公告)日：2016-11-10
申请号：US15214611
申请日：2016-07-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru TAGO , Hirofumi SHINAGAWA , Masaki KAWATA , Yuki ITO
CPC classification number: H05K1/181 , H05K1/0393 , H05K1/11 , H05K1/111 , H05K1/118 , H05K3/32 , H05K3/328 , H05K2201/0129 , H05K2201/0141 , H05K2201/0154 , H05K2201/05 , H05K2203/0285 , Y02P70/611
Abstract: A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.
Abstract translation: 模块部件包括：液晶聚合物树脂片的基板和通过超声波接合安装在基板上的电子部件，其中，所述电子部件包括多个第一基板连接电极，所述第一基板连接电极包括分别设置在基板安装面上的各平面导体 彼此连接并且以相同的电位或大致相同的电位连接，并且基板包括第一部件连接电极，其包括设置在部件加载表面上的平面导体，并且接合到多个第一基板连接电极。
-
公开(公告)号：US20190057803A1
公开(公告)日：2019-02-21
申请号：US16166225
申请日：2018-10-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazutaka MURAOKA , Kuniaki YOSUI , Yuki ITO , Naoki GOUCHI
Abstract: A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.
-
Patent Agency Ranking
公开(公告)号：US20190037685A1
公开(公告)日：2019-01-31
申请号：US16149162
申请日：2018-10-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinya OGURI , Yuki ITO , Yuya DOKAI , Isamu MORITA
Abstract: A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.
-
7.发明申请公开(公告)号：US20170338172A1
公开(公告)日：2017-11-23
申请号：US15673451
申请日：2017-08-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Keisuke IKENO , Yuki ITO
IPC: H01L23/498 , H01L21/48 , H01L23/00
CPC classification number: H01L23/49822 , H01L21/4853 , H01L21/4857 , H01L23/145 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/17104 , H01L2224/81191 , H01L2224/81205 , H05K1/02 , H05K1/0298 , H05K3/32 , H05K3/46 , H05K3/4635 , H05K2201/0141 , H05K2201/0154 , H05K2201/09536 , H05K2201/09781 , H05K2201/10674 , H05K2203/0285
Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly and being in a floating state. When the element assembly is viewed from a normal direction that is normal to the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and when the element assembly is viewed from the normal direction, an area within a circle with a center on the m-th external electrode and with a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am with a radius of Dm smaller than the average Dave when viewed from the normal direction.
-
公开(公告)号：US20160157354A1
公开(公告)日：2016-06-02
申请号：US15015475
申请日：2016-02-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru TAGO , Hirofumi SHINAGAWA , Yuki WAKABAYASHI , Kuniaki YOSUI , Yuki ITO , Toshiro ADACHI , Wataru YANASE , Masaki KAWATA
CPC classification number: H05K1/185 , H05K1/0298 , H05K1/186 , H05K3/4682 , H05K2201/09072 , H05K2203/0278
Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.
Abstract translation: 部件嵌入式基板包括层叠体和电子部件。 电子部件嵌入在层压板中。 层压体包括框状导体图案。 当在层叠方向上观察层压体时，框状导体图形被布置成基本上围绕电子部件的整个周边。 框状导体图案包括第一单独导体图案和第二单独导体图案。 第一单独导体图案和第二单独导体图案彼此分离。 第一单独导体图案布置成靠近电子部件的第一外部端子电极，并且第二单独导体图案布置成靠近电子部件的第二外部端子电极。
-
公开(公告)号：US20190053386A1
公开(公告)日：2019-02-14
申请号：US16161118
申请日：2018-10-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masaki KAWATA , Yuki ITO
IPC: H05K3/46
Abstract: A resin multilayer substrate manufacturing method includes arranging a first sheet including a thermoplastic resin as a main material, arranging one or more second sheets each including a first opening and a thermoplastic resin as a main material to be stacked on the first sheet, applying heat and pressure to a multilayer body including the first sheet and the one or more second sheets in a state in which a block, with a higher rigidity than the thermoplastic resin, is inside a space formed by the first opening of one second sheet or by a series of first openings of two or more second sheets, and removing the block.
-
10.发明申请公开(公告)号：US20180182681A1
公开(公告)日：2018-06-28
申请号：US15904469
申请日：2018-02-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Hirofumi SHINAGAWA , Yuki ITO
CPC classification number: H01L23/12 , H01L23/13 , H01L23/48 , H01L23/49816 , H01L23/4985 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13101 , H01L2224/1329 , H01L2224/16225 , H01L2224/81203 , H01L2224/81207 , H01L2224/81801 , H01L2224/8185 , H01L2924/15151 , H01L2924/15159 , H05K1/02 , H05K1/0271 , H05K1/0274 , H05K1/0326 , H05K3/32 , H05K3/328 , H05K3/4697 , H05K2201/0129 , H05K2201/0141 , H05K2201/09063 , H05K2201/09072 , H05K2201/0949 , H05K2201/09781 , H05K2201/09845 , H05K2201/10121 , H05K2201/10553 , H05K2201/2009 , H01L2924/014 , H01L2924/00014
Abstract: A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.
-
-
-
-
-
-
-
-
-
Search Results
13
records
(took 0.017 seconds)
