公开(公告)号：US20230119498A1

公开(公告)日：2023-04-20

申请号：US18067826

申请日：2022-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ikuo DEGUCHI

IPC: H05K1/02

Abstract: An electronic component includes: an insulating substrate including a first main surface and a second main surface opposite to each other in a thickness direction and a side surface with a plurality of ground electrodes exposed thereto; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films. The plurality of ground electrodes includes a first ground electrode and a second ground electrode, the first ground electrode and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface and at a position closest to the second main surface, respectively.

公开(公告)号：US20230225045A1

公开(公告)日：2023-07-13

申请号：US18174201

申请日：2023-02-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE ,  Ikuo DEGUCHI

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/024 ,  H05K1/023 ,  H05K1/0306

Abstract: A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes do not overlap each other in a thickness direction of the ceramic multilayer substrate.

公开(公告)号：US20230122767A1

公开(公告)日：2023-04-20

申请号：US18067844

申请日：2022-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ikuo DEGUCHI

IPC: H01L23/15 ,  H01L23/31 ,  H01L23/552 ,  H01L23/498 ,  H05K3/46

Abstract: An electronic component includes: an insulating substrate including a first main surface and a second main surface opposite to each other in a thickness direction and a side surface with a plurality of ground electrodes exposed thereto; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films. The plurality of ground electrodes includes a first ground electrode and a second ground electrode, the first ground electrode and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface and at a position closest to the second main surface, respectively.

公开(公告)号：US20230225049A1

公开(公告)日：2023-07-13

申请号：US18174166

申请日：2023-02-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE ,  Ikuo DEGUCHI

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/34

CPC classification number: H05K1/0306 ,  H05K3/4652 ,  H05K3/3442 ,  H05K2201/1006

Abstract: A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate but do not protrude from this side surface, and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes at least partially overlap each other in a thickness direction of the ceramic multilayer substrate, with a distance in the thickness direction between the overlapping ground electrodes being 5 μm or greater.

公开(公告)号：US20200350667A1

公开(公告)日：2020-11-05

申请号：US16931817

申请日：2020-07-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshitaka ECHIKAWA ,  Issei YAMAMOTO ,  Ikuo DEGUCHI

IPC: H01Q1/38 ,  H05K1/02

Abstract: A substrate equipped with an antenna of the present disclosure includes a circuit substrate and an antenna element. When viewed from a thickness direction, an area of one principal surface of the circuit substrate is larger than that of another principal surface thereof, and each of the one principal surface and the other principal surface of the circuit substrate is formed in a rectangular shape. When a maximum width between a first outer periphery of the other principal surface projected onto the one principal surface and a first outer periphery of the one principal surface is defined as W1, the antenna element is mounted in at least part of a region on the one principal surface of the circuit substrate, in which the region has the width W1 from the second outer periphery of the other principal surface projected onto the one principal surface toward the inner side.

公开(公告)号：US20230292432A1

公开(公告)日：2023-09-14

申请号：US18319671

申请日：2023-05-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ikuo DEGUCHI

IPC: H05K1/02

CPC classification number: H05K1/0269 ,  H05K2201/09936

Abstract: An electronic component is an electronic component including a first surface, wherein a marking formed by a collection of a plurality of dot-shaped recesses is formed in the first surface, an inner surface of each of the plurality of dot-shaped recesses is a curved surface, when viewed in a direction perpendicular to the first surface, an region internal to an outline of each of the plurality of dot-shaped recesses is entirely non-flat, the electric component comprises one or more second regions internal to an outline of the marking when viewed in the direction perpendicular to the first surface, each of the one or more second regions not belonging to any of the plurality of dot-shaped recesses, each of the one or more second regions being chamfered, each of the one or more second regions being non-flat, and each of the one or more second regions is convex.

公开(公告)号：US20200343618A1

公开(公告)日：2020-10-29

申请号：US16928365

申请日：2020-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshitaka ECHIKAWA ,  Issei YAMAMOTO ,  Ikuo DEGUCHI

IPC: H01Q1/12 ,  H05K1/02

Abstract: A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.