公开(公告)号：US20200343152A1

公开(公告)日：2020-10-29

申请号：US16928090

申请日：2020-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshitaka MATSUKAWA ,  Yoichi TAKAGI ,  Akio KATSUBE ,  Yoshitaka ECHIKAWA

IPC: H01L23/28 ,  H01L23/495 ,  H05K3/28 ,  H05K9/00 ,  H01L23/00

Abstract: An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).

公开(公告)号：US20200350667A1

公开(公告)日：2020-11-05

申请号：US16931817

申请日：2020-07-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshitaka ECHIKAWA ,  Issei YAMAMOTO ,  Ikuo DEGUCHI

IPC: H01Q1/38 ,  H05K1/02

Abstract: A substrate equipped with an antenna of the present disclosure includes a circuit substrate and an antenna element. When viewed from a thickness direction, an area of one principal surface of the circuit substrate is larger than that of another principal surface thereof, and each of the one principal surface and the other principal surface of the circuit substrate is formed in a rectangular shape. When a maximum width between a first outer periphery of the other principal surface projected onto the one principal surface and a first outer periphery of the one principal surface is defined as W1, the antenna element is mounted in at least part of a region on the one principal surface of the circuit substrate, in which the region has the width W1 from the second outer periphery of the other principal surface projected onto the one principal surface toward the inner side.

公开(公告)号：US20210265555A1

公开(公告)日：2021-08-26

申请号：US17317358

申请日：2021-05-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takafumi KUSUYAMA ,  Yoshitaka ECHIKAWA

IPC: H01L41/047 ,  H01L23/31 ,  H01L23/538

Abstract: A board has a first main surface and a second main surface. A first electronic component is mounted on a board so that one surface on which an electrical functional unit is formed faces a first main surface. A second electronic component is mounted on the board so that one surface on which an electrical functional unit is formed faces a second main surface. At least a portion of the first electronic component and at least a portion of the second electronic component overlap each other in a plan view. The other surface of the first electronic component is exposed from a mold resin. The other surface of the second electronic component is exposed from a mold resin.

公开(公告)号：US20200343618A1

公开(公告)日：2020-10-29

申请号：US16928365

申请日：2020-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshitaka ECHIKAWA ,  Issei YAMAMOTO ,  Ikuo DEGUCHI

IPC: H01Q1/12 ,  H05K1/02

Abstract: A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.