公开(公告)号：US20240090134A1

公开(公告)日：2024-03-14

申请号：US18515892

申请日：2023-11-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Hirofumi OIE

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/0212 ,  H05K2201/0707 ,  H05K2201/09472 ,  H05K2201/095 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10287

Abstract: An electronic circuit module includes: a substrate; a first electronic component mounted on one main surface of the substrate; a substrate electrode provided on the one main surface; a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component; a conductor provided on the support surface of the first electronic component; a wire connected to the conductor and the substrate electrode; and a component electrode provided on a surface of the second electronic component and electrically connected to the conductor.

公开(公告)号：US20230343516A1

公开(公告)日：2023-10-26

申请号：US18342046

申请日：2023-06-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE ,  Ai SASAKI

IPC: H01G4/012 ,  H01G4/12 ,  H01G4/008 ,  H01G2/12

CPC classification number: H01G4/012 ,  H01G4/1209 ,  H01G4/008 ,  H01G2/12

Abstract: A ceramic electronic component includes: a ceramic body having a first surface; an external electrode disposed at least on the first surface; an internal electrode disposed inside the ceramic body; and a connection conductor connected to the external electrode and extending through a surface or an interior of the ceramic body to electrically connect to the internal electrode. The external electrode includes an overhanging portion extending laterally from its portion connected to the connection conductor. At least a portion of the overhanging portion is a peeled portion peeled off from the ceramic body.

公开(公告)号：US20220149412A1

公开(公告)日：2022-05-12

申请号：US17584558

申请日：2022-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE

IPC: H01M8/1253 ,  C04B35/486

Abstract: An electrolyte sheet for solid oxide fuel cells includes a ceramic plate body containing a cubic zirconia sintered material, wherein, with the ceramic plate body being defined to have nine portions including an outer peripheral portion and a central portion, ceramic grains in each of the nine portions have a median size D50 of 1.0 μm to 4.0 μm, and a maximum median size D50 of the ceramic grains among the nine portions is 1.0 to 1.3 times a minimum median size D50 of the ceramic grains among the nine portions.

公开(公告)号：US20240431024A1

公开(公告)日：2024-12-26

申请号：US18826758

申请日：2024-09-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE

IPC: H05K1/11 ,  H05K3/24

Abstract: An electronic component includes a main body provided with a first surface and a plurality of electrodes arranged on the first surface. The plurality of electrodes include first-type electrodes individually arranged on the first surface and connected to each other through an interconnection that passes through the inside of the main body and a second-type electrode not connected to other electrodes individually arranged on the first surface. The first-type electrodes each include a first underlying electrode and a first plated film that covers the first underlying electrode. The second-type electrode includes a second underlying electrode and a second plated film that covers the second underlying electrode. The first underlying electrode sinks into the main body as compared with the second underlying electrode.

公开(公告)号：US20240249861A1

公开(公告)日：2024-07-25

申请号：US18624567

申请日：2024-04-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE

IPC: H01C1/04

CPC classification number: H01C1/04

Abstract: To provide ceramic electronic component capable of suppressing breakage of identification mark and element body and intrusion of liquid into element body. Ceramic electronic component includes element body including ceramic as main material, barrier layer formed on surface of element body and including ceramic as main material, and identification mark formed on surface of barrier layer. Element body, barrier layer, and identification mark include glass material. Proportion of glass material included in barrier layer is higher than proportion of glass material included in element body.

公开(公告)号：US20240087793A1

公开(公告)日：2024-03-14

申请号：US18510766

申请日：2023-11-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE ,  Yoshihito OTSUBO

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01G4/005 ,  H01G4/224 ,  H01G4/33

CPC classification number: H01F27/2804 ,  H01F27/327 ,  H01F41/043 ,  H01G4/005 ,  H01G4/224 ,  H01G4/33

Abstract: An electronic component includes a plurality of base materials laminated in a thickness direction, interlayer connection conductor provided in base materials and filled in a through hole penetrating in the thickness direction, and internal electrode formed at a position where internal electrode overlaps interlayer connection conductor when viewed from the thickness direction, internal electrode being formed with base material interposed between internal electrode and interlayer connection conductor. Interlayer connection conductor has a cavity. Cavity being formed so as to be shifted internal electrode side in the thickness direction of the through hole.

公开(公告)号：US20220140374A1

公开(公告)日：2022-05-05

申请号：US17575877

申请日：2022-01-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE

IPC: H01M8/1246

Abstract: An electrolyte sheet for solid oxide fuel cells includes a ceramic plate body having rounded corners in a plan view from a thickness direction of the ceramic plate body, the ceramic plate body having a thickness of 200 μm or less, and each of the rounded corners having a ratio Dmax/Dmin of 1.0 to 1.1, wherein Dmax and Dmin respectively represent maximum and minimum values between distances D from an intersection of extension lines of two sides of the ceramic plate body adjacent to a respective corner to starting points of the respective extension lines in the plan view.

公开(公告)号：US20240221995A1

公开(公告)日：2024-07-04

申请号：US18610460

申请日：2024-03-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE ,  Masahiro TERAMOTO

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/40 ,  H03H7/00

CPC classification number: H01F27/2885 ,  H01F27/292 ,  H01F27/40 ,  H03H7/00

Abstract: To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal surfaces and side surface, LC resonator that includes inductor conductor disposed on substrates and capacitor conductor disposed on substrates and electrically connected to the inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to a ground, outer electrode that is disposed on principal surfaces and that is electrically connected to the LC resonator, and protective layer that covers shield conductor disposed on principal surface and principal surface, in a manner straddling interface between shield conductor disposed on principal surface and substrate body.

公开(公告)号：US20230225045A1

公开(公告)日：2023-07-13

申请号：US18174201

申请日：2023-02-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE ,  Ikuo DEGUCHI

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/024 ,  H05K1/023 ,  H05K1/0306

Abstract: A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes do not overlap each other in a thickness direction of the ceramic multilayer substrate.

公开(公告)号：US20230119828A1

公开(公告)日：2023-04-20

申请号：US18067042

申请日：2022-12-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi OIE ,  Toru YASO ,  Kiyohiro KASHIUCHI

IPC: H05K3/24 ,  H05K3/12 ,  H05K3/46 ,  H01L23/15 ,  H05K1/05

Abstract: An electronic component of the present disclosure includes: an electronic component body; an electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a portion of a perimeter of the electrode and extending across a boundary between the perimeter of the electrode and the surface of the electronic component body, wherein in a plan view of the electronic component body seen from a side where the electrode is disposed, the electrode includes corners each provided by two segments defining a portion of the perimeter of the electrode, and a thickness of at least a portion of the cover layer on at least one of the corners is greater than a thickness of the other portions of the cover layer on portions other than the corners.