Abstract:
An ESD protection device includes an insulative substrate, first and second discharge electrodes contacting the insulative substrate, the first and second discharge electrodes being spaced apart from and opposed to each other, first and second outer electrodes provided on an outside surface of the insulative substrate and electrically connected to the first and second discharge electrodes, respectively; and a discharge auxiliary electrode extending from the first discharge electrode to the second discharge electrode in a region where the first and second discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles having an average particle diameter of about 0.3 μm to about 1.5 μm, and a density of the metal particles at a random cross-section of the discharge auxiliary electrode is greater than or equal to about 20 particles/50 μm2.
Abstract:
An ESD protection device includes a bare unitary body, and a first discharge electrode and a second discharge electrode that are disposed inside the bare unitary body. The first discharge electrode and the second discharge electrode are opposed to each other with a gap interposed therebetween. The bare unitary body includes a cavity in which the gap between the first discharge electrode and the second discharge electrode is located, and to which the first discharge electrode and the second discharge electrode are exposed. A first space of the cavity on a side closer to the first discharge electrode is smaller than a second space of the cavity on a side closer to the second discharge electrode.
Abstract:
An ESD protection device includes an insulating substrate, first and second discharge electrodes in contact with the insulating substrate, the first and second discharge electrodes separated from each other and opposing each other, first and second outer electrodes on an outside surface of the insulating substrate, the first outer electrode being electrically connected to the first discharge electrode and the second outer electrode being electrically connected to the second discharge electrode, and a discharge auxiliary electrode spanning the first discharge electrode and the second discharge electrode in a region where the discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles. An average particle diameter of the metal particles is about 0.3 μm to about 1.5 μm. A density of the metal particles is greater than or equal to about 20 particles/50 μm2 and the semiconductor particles include an oxygen-containing layer on surfaces of the semiconductor particles.