公开(公告)号：US20170033097A1

公开(公告)日：2017-02-02

申请号：US15290089

申请日：2016-10-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro SUMI ,  Jun ADACHI ,  Takayuki TSUKIZAWA ,  Katsumi YASUNAKA ,  Sumiyo NAKAMURA ,  Mayu SUZUKI

IPC: H01L27/02 ,  H01L21/283 ,  H01L21/02 ,  H01L49/02

CPC classification number: H01L27/0288 ,  H01L21/02529 ,  H01L21/283 ,  H01L28/60 ,  H01T4/10 ,  H01T4/12 ,  H01T21/00

Abstract: An ESD protection device includes an insulative substrate, first and second discharge electrodes contacting the insulative substrate, the first and second discharge electrodes being spaced apart from and opposed to each other, first and second outer electrodes provided on an outside surface of the insulative substrate and electrically connected to the first and second discharge electrodes, respectively; and a discharge auxiliary electrode extending from the first discharge electrode to the second discharge electrode in a region where the first and second discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles having an average particle diameter of about 0.3 μm to about 1.5 μm, and a density of the metal particles at a random cross-section of the discharge auxiliary electrode is greater than or equal to about 20 particles/50 μm2.

Abstract translation: ESD保护器件包括绝缘衬底，与绝缘衬底接触的第一和第二放电电极，第一和第二放电电极彼此间隔开并彼此相对，设置在绝缘衬底的外表面上的第一和第二外电极以及 电连接到第一和第二放电电极; 以及在第一和第二放电电极彼此相对的区域中从第一放电电极延伸到第二放电电极的放电辅助电极。 放电辅助电极包括平均粒径为约0.3μm至约1.5μm的半导体颗粒和金属颗粒，并且放电辅助电极的随机横截面处的金属颗粒的密度大于或等于约20 颗粒/50μm。

公开(公告)号：US20160020014A1

公开(公告)日：2016-01-21

申请号：US14789555

申请日：2015-07-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shoichiro FURUKAWA ,  Takahiro SUMI ,  Sumiyo NAKAMURA

IPC: H01F27/28 ,  H01F41/04 ,  H01F1/16 ,  H01F27/245

CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/292

Abstract: A laminated coil component has a laminated body which is formed by laminating a plurality of ferrite layers, a helical coil which is provided in the laminated body, and a plurality of external electrodes which are provided on the surface of the laminated body and are electrically connected to the helical coil and are mainly composed of Cu. The ferrite layers have an exposed region exposed from the surface of the laminated body without being covered with the external electrodes. A surface resistivity of the exposed region of the ferrite layers is more than 104Ω and less than 107Ω.

Abstract translation: 层叠线圈部件具有通过层叠多个铁氧体层，设置在层叠体中的螺旋线圈和多个外部电极而形成的层叠体，所述多个外部电极设置在层叠体的表面上并电连接 到螺旋线圈，主要由Cu组成。 铁氧体层具有从层叠体的表面露出而不被外部电极覆盖的露出区域。 铁素体层的暴露区域的表面电阻率大于104＆OHgr; 小于107＆OHgr。

公开(公告)号：US20190244749A1

公开(公告)日：2019-08-08

申请号：US16383919

申请日：2019-04-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Jun ADACHI ,  Naganori HIRAKAWA ,  Hiroyuki ASANO ,  Sumiyo NAKAMURA

IPC: H01F27/29 ,  H01F41/076

CPC classification number: H01F27/29 ,  H01F27/00 ,  H01F41/076 ,  H01F41/10 ,  H01G4/228 ,  H01G4/252

Abstract: An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

公开(公告)号：US20190156988A1

公开(公告)日：2019-05-23

申请号：US16255900

申请日：2019-01-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sumiyo NAKAMURA ,  Jun ADACHI

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/34 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32

Abstract: An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.

公开(公告)号：US20170093150A1

公开(公告)日：2017-03-30

申请号：US15375392

申请日：2016-12-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro SUMI ,  Jun ADACHI ,  Takayuki TSUKIZAWA ,  Katsumi YASUNAKA ,  Sumiyo NAKAMURA ,  Mayu SUZUKI

IPC: H02H9/04

CPC classification number: H02H9/044 ,  H01T1/20 ,  H01T4/12

Abstract: An ESD protection device includes an insulating substrate, first and second discharge electrodes in contact with the insulating substrate, the first and second discharge electrodes separated from each other and opposing each other, first and second outer electrodes on an outside surface of the insulating substrate, the first outer electrode being electrically connected to the first discharge electrode and the second outer electrode being electrically connected to the second discharge electrode, and a discharge auxiliary electrode spanning the first discharge electrode and the second discharge electrode in a region where the discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles. An average particle diameter of the metal particles is about 0.3 μm to about 1.5 μm. A density of the metal particles is greater than or equal to about 20 particles/50 μm2 and the semiconductor particles include an oxygen-containing layer on surfaces of the semiconductor particles.