公开(公告)号：US20240136268A1

公开(公告)日：2024-04-25

申请号：US18399324

申请日：2023-12-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiaki SATAKE ,  Tatsuya FUNAKI ,  Kei ARAI

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L21/561 ,  H01L24/83 ,  H01L2224/29191 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83862 ,  H01L2224/95 ,  H01L2924/0715

Abstract: A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.