公开(公告)号：US20230335451A1

公开(公告)日：2023-10-19

申请号：US18333036

申请日：2023-06-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takamitsu NAKAMURA ,  Hideo NAKAGOSHI ,  Kensuke OTAKE ,  Hiroki YOSHIMORI

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/495 ,  H01L25/16

CPC classification number: H01L23/3107 ,  H01L21/568 ,  H01L23/495 ,  H01L23/552 ,  H01L25/16

Abstract: An electronic component package includes: a resin portion having a first surface; one or more electronic components each having a plurality of external electrodes; and a plurality of extraction electrodes electrically connected to the plurality of external electrodes. Only each of the plurality of extraction electrodes is exposed from the resin portion on the first surface. The plurality of external electrodes are covered with the resin portion.

公开(公告)号：US20230328895A1

公开(公告)日：2023-10-12

申请号：US18335383

申请日：2023-06-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi KITAHARA ,  Kensuke OTAKE ,  Kyo SHIN

IPC: H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3436 ,  H05K3/3463 ,  H05K1/181

Abstract: The present disclosure is directed to an electronic component mounting structure including: a circuit board provided on a surface thereof with a first electrode containing Cu as a main component; and an electronic component mounted on the circuit board, the electronic component including a second electrode on a surface thereof; wherein the second electrode includes a first plating containing Ni as a main component and a second plating containing Sn as a main component formed on a surface of the first plating, and an intermediate bonding layer is provided between the first plating and the first electrode, and the intermediate bonding layer includes a first region containing an alloy of Cu and Sn as a main component and a second region containing Sn as a main component.