公开(公告)号：US20170271056A1

公开(公告)日：2017-09-21

申请号：US15611826

申请日：2017-06-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuichi HIRATA ,  Noboru FURUKAWA ,  Yasuo SASAKI ,  Kiyohiro KOTO ,  Kojiro TOKIEDA ,  Yukiko UEDA

IPC: H01C7/04 ,  H01C1/142 ,  H01C17/28 ,  H01C17/245

CPC classification number: H01C7/041 ,  H01C1/142 ,  H01C1/148 ,  H01C7/18 ,  H01C17/245 ,  H01C17/281

Abstract: A method of manufacturing an electronic component includes manufacturing a ceramic element including one pair of end surfaces and four side surfaces, forming external electrodes at both end portions of the ceramic element, measuring an initial characteristic value, determining any side surface to be machined among the four side surfaces and then determining, based on stored data, an amount of machining to be performed on the side surface to be machined, and machining, by the determined machining amount, the side surface of the ceramic element, which is determined to be machined, to be flush or substantially flush with the external electrodes.

公开(公告)号：US20160064124A1

公开(公告)日：2016-03-03

申请号：US14937969

申请日：2015-11-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi IKEDA ,  Tadamasa MIURA ,  Kiyohiro KOTO

IPC: H01C7/00 ,  H01C7/02 ,  H01C7/10 ,  H01C7/04

CPC classification number: H01C7/006 ,  H01C7/021 ,  H01C7/041 ,  H01C7/1013

Abstract: An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage.

Abstract translation: 金属层不可能从基板剥离的电子部件包括绝缘陶瓷基板，扩散接合到基板的陶瓷层，包括与第一主体相对的第一主表面和第二主表面的金属层 表面，第一主表面扩散粘合到陶瓷层，以及特征层，其扩散结合到金属层的第二主表面并由陶瓷材料制成，其中特征层相对于环境的电阻值变化 温度或施加电压。