METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT

    公开(公告)号:US20180090268A1

    公开(公告)日:2018-03-29

    申请号:US15711341

    申请日:2017-09-21

    Abstract: A method of manufacturing a laminated electronic component having a circuit element formed in an element body. The method includes forming a collective laminated body including a plurality of element bodies having circuit elements formed therein by laminating pluralities of insulator layers and conductor patterns; forming a plurality of external terminals on one of surfaces of the collective laminated body orthogonal to a lamination direction; forming a disappearing layer covering the external terminals and caused to disappear by heat treatment; cutting and dividing the collective laminated body having the disappearing layer formed thereon along the lamination direction into each of element bodies; applying an insulator precursor to a surface of the element body; and forming a laminated electronic component by applying a heat treatment to the element body to which the insulator precursor is applied. In the method, the insulator layers can be replaced by magnetic material layers.

    MULTILAYER COIL COMPONENT
    4.
    发明公开

    公开(公告)号:US20240304367A1

    公开(公告)日:2024-09-12

    申请号:US18665172

    申请日:2024-05-15

    CPC classification number: H01F1/36 H01F5/04

    Abstract: A multilayer coil component includes a multilayer body composed of a plurality of laminated insulating layers; a coil composed of a plurality of coil conductors laminated together with the insulating layers, embedded in the multilayer body, and electrically connected; and outer electrodes provided on an outer surface of the multilayer body and electrically connected to the coil. An inorganic material layer is provided in at least part of the interfaces between the insulating layers and the coil conductors. The inorganic material layer includes an inorganic material and a metal material different from the inorganic material. In the inorganic material layer, the metal material is present between particles of the inorganic material or in/between porous bodies made of the inorganic material.

    LAMINATED ELECTRONIC COMPONENT
    5.
    发明申请

    公开(公告)号:US20210174997A1

    公开(公告)日:2021-06-10

    申请号:US17178160

    申请日:2021-02-17

    Abstract: A laminated electronic component having a coil formed in the laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via an electrode disposed on a side surface of the laminated body. The electrode is covered with an insulator film.

    LAMINATED ELECTRONIC COMPONENT
    6.
    发明申请

    公开(公告)号:US20180090255A1

    公开(公告)日:2018-03-29

    申请号:US15711366

    申请日:2017-09-21

    Abstract: A laminated electronic component having a coil formed in a laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via a conductor extending in a lamination direction of the laminated body. An insulator part is disposed between the conductor and the coil.

    COIL COMPONENT
    10.
    发明申请

    公开(公告)号:US20230096644A1

    公开(公告)日:2023-03-30

    申请号:US17932939

    申请日:2022-09-16

    Abstract: A coil component includes a multilayer body including a plurality of insulating layers and a plurality of coil conductor layers which are stacked in a stacking direction, and a first via conductor and a second via conductor that electrically connect the coil conductor layers. The first via conductor is smaller than the second via conductor.

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